Patents by Inventor Tsung-Yang LIU

Tsung-Yang LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for sealing processing module
    Patent number: 9970105
    Abstract: Embodiments of method for cooling a wafer are provided. A method for cooling a wafer includes placing the wafer in a processing module via a passage of a seat member. The method also includes moving a closure member toward the seat member in a diagonal manner. The method further includes engaging the seat member and the closure member and placing a portion of the closure member inside the passage. In addition, the method includes performing a process on the wafer in the processing module.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: May 15, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Chun-Ta Chen, Cheng-Chieh Chen, Hong-Hsing Chou, Yeh-Chieh Wang, Jeng-Yann Tsay, Shyue-Shin Tsai, Tsung-Yang Liu
  • METHOD FOR SEALING PROCESSING MODULE
    Publication number: 20150179456
    Abstract: Embodiments of method for cooling a wafer are provided. A method for cooling a wafer includes placing the wafer in a processing module via a passage of a seat member. The method also includes moving a closure member toward the seat member in a diagonal manner. The method further includes engaging the seat member and the closure member and placing a portion of the closure member inside the passage. In addition, the method includes performing a process on the wafer in the processing module.
    Type: Application
    Filed: December 23, 2013
    Publication date: June 25, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Ta CHEN, Cheng-Chieh CHEN, Hong-Hsing CHOU, Yeh-Chieh WANG, Jeng-Yann TSAY, Shyue-Shin TSAI, Tsung-Yang LIU