Patents by Inventor TSUNG-YAO WEN
TSUNG-YAO WEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11569236Abstract: A method of forming a semiconductor device includes etching a substrate to form two first trenches separated by a fin; filling the two first trenches with an isolation layer; and depositing a dielectric layer over the fin and the isolation layer. The method further includes forming a second trench in the dielectric layer over a channel region of the semiconductor device, the second trench exposing the isolation layer. The method further includes etching the isolation layer through the second trench to expose an upper portion of the fin in the channel region of the semiconductor device, and forming a dummy gate in the second trench over the isolation layer and engaging the upper portion of the fin.Type: GrantFiled: November 30, 2020Date of Patent: January 31, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hung-Li Chiang, Cheng-Yi Peng, Tsung-Yao Wen, Yee-Chia Yeo, Yen-Ming Chen
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Patent number: 11158508Abstract: A fin field device structure and method for forming the same are provided. The FinFET device structure includes a protruding structure extending from a substrate and an anti-punch through implant (APT) region formed in the protruding structure. The FinFET device structure includes a barrier layer formed on the APT region, and the barrier layer has a width in a horizontal direction. The width gradually tapers from a bottom of the barrier layer to a top of the barrier layer.Type: GrantFiled: March 12, 2018Date of Patent: October 26, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Yao Wen, Sheng-Chen Wang, Sai-Hooi Yeong, Hsueh-Chang Sung, Ya-Yun Cheng
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Patent number: 11037787Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming a dielectric layer over a substrate, forming a hard mask (HM) layer over the dielectric layer, forming a fin trench through the HM layer and the dielectric layer and extending down to the substrate, forming a semiconductor feature in the fin trench and removing the HM layer to expose an upper portion of the semiconductor feature to form fin features.Type: GrantFiled: October 14, 2019Date of Patent: June 15, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tsung-Yao Wen, Angus Hsiao
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Publication number: 20210082919Abstract: A method of forming a semiconductor device includes etching a substrate to form two first trenches separated by a fin; filling the two first trenches with an isolation layer; and depositing a dielectric layer over the fin and the isolation layer. The method further includes forming a second trench in the dielectric layer over a channel region of the semiconductor device, the second trench exposing the isolation layer. The method further includes etching the isolation layer through the second trench to expose an upper portion of the fin in the channel region of the semiconductor device, and forming a dummy gate in the second trench over the isolation layer and engaging the upper portion of the fin.Type: ApplicationFiled: November 30, 2020Publication date: March 18, 2021Inventors: Hung-Li Chiang, Cheng-Yi Peng, Tsung-Yao Wen, Yee-Chia Yeo, Yen-Ming Chen
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Patent number: 10868006Abstract: A method of forming a semiconductor device includes forming a fin protruding from a substrate, the fin having a channel region, a source/drain (S/D) region, and a biasing region, wherein the channel region and the biasing region sandwich the S/D region. The method further includes trimming the biasing region to reduce a height of the biasing region and forming a gate structure engaging the channel region. The method also includes forming a conductive feature electrically coupling to the biasing region.Type: GrantFiled: December 23, 2019Date of Patent: December 15, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tsung-Yao Wen, Sai-Hooi Yeong, Sheng-chen Wang
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Patent number: 10854605Abstract: A method of forming a semiconductor device includes etching a substrate to form two first trenches separated by a fin; filling the two first trenches with an isolation layer; and depositing a dielectric layer over the fin and the isolation layer. The method further includes forming a second trench in the dielectric layer over a channel region of the semiconductor device, the second trench exposing the isolation layer. The method further includes etching the isolation layer through the second trench to expose an upper portion of the fin in the channel region of the semiconductor device, and forming a dummy gate in the second trench over the isolation layer and engaging the upper portion of the fin.Type: GrantFiled: September 16, 2019Date of Patent: December 1, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hung-Li Chiang, Cheng-Yi Peng, Tsung-Yao Wen, Yee-Chia Yeo, Yen-Ming Chen
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Publication number: 20200144257Abstract: A method of forming a semiconductor device includes forming a fin protruding from a substrate, the fin having a channel region, a source/drain (S/D) region, and a biasing region, wherein the channel region and the biasing region sandwich the S/D region. The method further includes trimming the biasing region to reduce a height of the biasing region and forming a gate structure engaging the channel region. The method also includes forming a conductive feature electrically coupling to the biasing region.Type: ApplicationFiled: December 23, 2019Publication date: May 7, 2020Inventors: Tsung-Yao Wen, Sai-Hooi Yeong, Sheng-chen Wang
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Publication number: 20200043735Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming a dielectric layer over a substrate, forming a hard mask (HM) layer over the dielectric layer, forming a fin trench through the HM layer and the dielectric layer and extending down to the substrate, forming a semiconductor feature in the fin trench and removing the HM layer to expose an upper portion of the semiconductor feature to form fin features.Type: ApplicationFiled: October 14, 2019Publication date: February 6, 2020Inventors: Tsung-Yao Wen, Angus Hsiao
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Publication number: 20200013779Abstract: A method of forming a semiconductor device includes etching a substrate to form two first trenches separated by a fin; filling the two first trenches with an isolation layer; and depositing a dielectric layer over the fin and the isolation layer. The method further includes forming a second trench in the dielectric layer over a channel region of the semiconductor device, the second trench exposing the isolation layer. The method further includes etching the isolation layer through the second trench to expose an upper portion of the fin in the channel region of the semiconductor device, and forming a dummy gate in the second trench over the isolation layer and engaging the upper portion of the fin.Type: ApplicationFiled: September 16, 2019Publication date: January 9, 2020Inventors: Hung-Li Chiang, Cheng-Yi Peng, Tsung-Yao Wen, Yee-Chia Yeo, Yen-Ming Chen
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Patent number: 10522540Abstract: A semiconductor device includes a semiconductor substrate; a semiconductor projection connected to the semiconductor substrate; and a gate engaging the semiconductor projection, wherein the semiconductor projection includes a first region and a second region, the second region is between the first region and the gate, and the first region is lower in height than the second region.Type: GrantFiled: December 10, 2018Date of Patent: December 31, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tsung-Yao Wen, Sai-Hooi Yeong, Sheng-chen Wang
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Patent number: 10446396Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming a dielectric layer over a substrate, forming a hard mask (HM) layer over the dielectric layer, forming a fin trench through the HM layer and the dielectric layer and extending down to the substrate, forming a semiconductor feature in the fin trench and removing the HM layer to expose an upper portion of the semiconductor feature to form fin features.Type: GrantFiled: April 23, 2019Date of Patent: October 15, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tsung-Yao Wen, Angus Hsiao
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Patent number: 10418363Abstract: A method of forming a semiconductor device includes etching a substrate to form two first trenches separated by a fin; filling the two first trenches with an isolation layer; and depositing a dielectric layer over the fin and the isolation layer. The method further includes forming a second trench in the dielectric layer over a channel region of the semiconductor device, the second trench exposing the isolation layer. The method further includes etching the isolation layer through the second trench to expose an upper portion of the fin in the channel region of the semiconductor device, and forming a dummy gate in the second trench over the isolation layer and engaging the upper portion of the fin.Type: GrantFiled: November 19, 2018Date of Patent: September 17, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hung-Li Chiang, Cheng-Yi Peng, Tsung-Yao Wen, Yee-Chia Yeo, Yen-Ming Chen
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Publication number: 20190252189Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming a dielectric layer over a substrate, forming a hard mask (HM) layer over the dielectric layer, forming a fin trench through the HM layer and the dielectric layer and extending down to the substrate, forming a semiconductor feature in the fin trench and removing the HM layer to expose an upper portion of the semiconductor feature to form fin features.Type: ApplicationFiled: April 23, 2019Publication date: August 15, 2019Inventors: Tsung-Yao Wen, Angus Hsiao
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Patent number: 10276380Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming a dielectric layer over a substrate, forming a hard mask (HM) layer over the dielectric layer, forming a fin trench through the HM layer and the dielectric layer and extending down to the substrate, forming a semiconductor feature in the fin trench and removing the HM layer to expose an upper portion of the semiconductor feature to form fin features.Type: GrantFiled: October 17, 2014Date of Patent: April 30, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tsung-Yao Wen, Angus Hsiao
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Publication number: 20190115345Abstract: A semiconductor device includes a semiconductor substrate; a semiconductor projection connected to the semiconductor substrate; and a gate engaging the semiconductor projection, wherein the semiconductor projection includes a first region and a second region, the second region is between the first region and the gate, and the first region is lower in height than the second region.Type: ApplicationFiled: December 10, 2018Publication date: April 18, 2019Inventors: Tsung-Yao Wen, Sai-Hooi Yeong, Sheng-chen Wang
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Publication number: 20190109134Abstract: A method of forming a semiconductor device includes etching a substrate to form two first trenches separated by a fin; filling the two first trenches with an isolation layer; and depositing a dielectric layer over the fin and the isolation layer. The method further includes forming a second trench in the dielectric layer over a channel region of the semiconductor device, the second trench exposing the isolation layer. The method further includes etching the isolation layer through the second trench to expose an upper portion of the fin in the channel region of the semiconductor device, and forming a dummy gate in the second trench over the isolation layer and engaging the upper portion of the fin.Type: ApplicationFiled: November 19, 2018Publication date: April 11, 2019Inventors: Hung-Li Chiang, Cheng-Yi Peng, Tsung-Yao Wen, Yee-Chia Yeo, Yen-Ming Chen
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Patent number: 10169515Abstract: A layout modification method is performed by at least one processor. The layout modification method includes: analyzing, by the at least one processor, allocation of a plurality of specific layout segments of a circuit cell layout to determine a first specific layout segment and a second specific layout segment from the plurality of specific layout segments; determining, by the at least one processor, if the first specific layout segment and the second specific layout segment are coupled to a first signal level; and merging, by the at least one processor, the first specific layout segment and the second specific layout segment into a first merged layout segment when the first specific layout segment and the second specific layout segment are coupled to the first signal level.Type: GrantFiled: November 16, 2015Date of Patent: January 1, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Kam-Tou Sio, Tsung-Yao Wen, Chih-Ming Lai, Hui-Ting Yang, Jui-Yao Lai, Chih-Liang Chen, Chun-Kuang Chen, Ru-Gun Liu, Yen-Ming Chen, Chew-Yuen Young
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Patent number: 10163902Abstract: A semiconductor device includes multiple first fins oriented lengthwise along a first direction and multiple first gate structures oriented lengthwise along a second direction generally perpendicular to the first direction. Each of the first fins includes an end that is narrower than a main body of the respective first fin. The first gate structures are disposed over channel regions of the main body of the first fins to form multiple first FinFETs. The end of the first fins and the channel regions of the first fins sandwich some of source/drain regions of the first fins. The semiconductor device further includes a first contact disposed over and in electrical contact with the ends of the first fins.Type: GrantFiled: March 9, 2018Date of Patent: December 25, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Yao Wen, Sai-Hooi Yeong, Sheng-chen Wang
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Patent number: 10153280Abstract: A method of forming a semiconductor device includes etching a substrate to form two first trenches separated by a fin; filling the two first trenches with an isolation layer; and depositing a dielectric layer over the fin and the isolation layer. The method further includes forming a second trench in the dielectric layer over a channel region of the semiconductor device, the second trench exposing the isolation layer. The method further includes etching the isolation layer through the second trench to expose an upper portion of the fin in the channel region of the semiconductor device, and forming a dummy gate in the second trench over the isolation layer and engaging the upper portion of the fin.Type: GrantFiled: January 25, 2017Date of Patent: December 11, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hung-Li Chiang, Cheng-Yi Peng, Tsung-Yao Wen, Yee-Chia Yeo, Yen-Ming Chen
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Patent number: 10062688Abstract: A semiconductor device and a method of manufacturing the semiconductor device are provided. The semiconductor device includes a fin extending along a first direction over a substrate and a gate structure extending in a second direction overlying the fin. The gate structure includes a gate dielectric layer overlying the fin, a gate electrode overlying the gate dielectric layer, and a first insulating gate sidewall on a first lateral surface of the gate electrode extending along the second direction. A source/drain region is formed in the fin in a region adjacent the gate structure. A portion of the source/drain region extends under the insulating gate sidewall for a substantially constant distance along the first direction.Type: GrantFiled: January 4, 2016Date of Patent: August 28, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Sai-Hooi Yeong, Sheng-Chen Wang, Tsung-Yao Wen, Yen-Ming Chen