Abstract: Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a first conductive structure disposed within a first layer of the semiconductor structure. The semiconductor structure includes a dielectric structure disposed within a second layer of the semiconductor structure, with the second layer being disposed on the first layer. The semiconductor structure includes a second conductive structure disposed within a recessed portion of the dielectric structure that extends to the first conductive structure, with the second conductive structure having a concave recessed portion on a top surface of the second conductive structure. The semiconductor structure includes multiple layers of conductive material disposed within the concave recessed portion of the second conductive structure.

Abstract: An impression mold for relief art, for applying slightly three-dimensional pattern on a piece of paper or a card, comprises at least a mold plate and a pattern piece connected to the mold plate. One surface of the mold plate defines an area of molding, which includes a multitude of retaining holes. The pattern piece has one side provided with a predetermined pattern to be impressed and the opposite side provided with a retaining member, whereby the pattern piece can be quickly removed from the mold plate, and whereby other pattern pieces can be quickly arranged on the mold plate.

Abstract: A heat-expelling device with a wind guide comprises a shell, a heat-generating body disposed within the front portion of the shell and a wind-blowing unit disposed within the rear portion of the shell. It further contains a wind guide at a predetermined location between the heat-generating body and the wind-blowing unit, whose outer wall includes a convex conic surface curved along the axis of and toward the heat-generating body. Thereby, the air density and the heat exchange rate can be significantly increased, and the heat generated within the heat-generating body can be delivered to the exterior of the heat-expelling device, which effectively increases the outflow air temperature and reduces the temperature of the shell.