Abstract: A fingerprint identification module includes a light guiding member, a flexible circuit board, two light emitting members, and a fingerprint identification chip. The light guiding member includes a bottom and a protruding edge. The protruding edge surrounds to form a first space. A first through-hole is formed on the bottom. The flexible circuit board is disposed in the first space and has a first portion, a second portion, a third portion, and a fourth portion connected in sequence. The first portion goes out of the light guiding member through the first through-hole. The third portion faces a direction opposite to the bottom. The second portion and the fourth portion face the bottom of the light guiding member. The light emitting members are disposed on the flexible circuit board and face the light guiding member. The fingerprint identification chip is disposed on the third portion of the flexible circuit board.

Abstract: A touch panel with a fingerprint identification function includes a glass substrate, a fingerprint identification chip, and a driving flexible board. The glass substrate has a surface including a touch sensing area and a fingerprint identification area located at different positions. A touch sensing circuit is formed by etching on the touch sensing area. A fingerprint identification circuit is formed by etching on the fingerprint identification area. The surface has at least one driving contact electrically connected to the touch sensing circuit and the fingerprint identification circuit. The fingerprint identification chip has several Au bumps connected to the fingerprint identification circuit, thereby the fingerprint identification chip is engaged with the surface of the glass substrate. The driving flexible board has at least one driving chip and a driving circuit electrically connected to the driving chip. The driving circuit is engaged with the driving contact of the glass substrate.

Abstract: A fingerprint identification module includes a light guiding member, a flexible circuit board, two light emitting members, and a fingerprint identification chip. The light guiding member includes a bottom and a protruding edge. The protruding edge surrounds to form a first space. A first through-hole is formed on the bottom. The flexible circuit board is disposed in the first space and has a first portion, a second portion, a third portion, and a fourth portion connected in sequence. The first portion goes out of the light guiding member through the first through-hole. The third portion faces a direction opposite to the bottom. The second portion and the fourth portion face the bottom of the light guiding member. The light emitting members are disposed on the flexible circuit board and face the light guiding member. The fingerprint identification chip is disposed on the third portion of the flexible circuit board.

Abstract: The present invention provides a package structure of a fingerprint identification chip, including: a substrate, having a first surface, a second surface and a penetrating opening, the second surface including a groove extending from the penetrating opening and a second metal contact, and the groove being used for accommodating a first metal contact; a fingerprint identification chip having an upper surface and a lower surface, the fingerprint identification being disposed in the penetrating opening and having a bonding pad on the lower surface; a cover plate, fixedly disposed on the first surface of the substrate and covering the upper surface of the fingerprint identification chip; and a flexible print circuit (FPC), disposed on the second surface of the substrate, a surface of the FPC having a third metal contact that corresponds to and is electrically connected to the second metal contact, where bonding pad is electrically connected to the first metal contact through a wire.

Abstract: The present invention provides a package structure of a fingerprint identification chip, including: a metal substrate, having a through opening and two grooves extending from two opposite sides of the through opening; a fingerprint identification chip, disposed in the through opening and having an upper surface and a lower surface, the lower surface having a bonding pad; a cover plate, fixedly disposed on the metal substrate and covering the upper surface of the fingerprint identification chip; a flexible printed circuit (FPC), disposed on the lower surface of the fingerprint identification chip and having a first surface and a second surface, the second surface having a first metal contact; and a metal reinforcing plate, inserted into the two grooves and covering the through opening, where the bonding pad is electrically connected to the first metal contact through a wire.

Abstract: This application provides a fingerprint recognition module having a light-emitting function and a manufacturing method therefor. The fingerprint recognition module includes a flexible printed circuit (FPC) board, a die, a light-emitting diode component, an adhesive layer, and a cover plate. The manufacturing method includes the following steps: (a) directly connecting and fixing the die and the light-emitting diode component to the FPC board, and electrically connecting the die and the light-emitting diode component to the FPC board; (b) coating the adhesive layer on an upper surface of the die; (c) covering the adhesive layer with a cover plate, to adhere the cover plate to the adhesive layer; and (d) applying low pressure injection modeling encapsulation to an encapsulation space defined between the cover plate and the FPC board, so as to form an encapsulation layer in the encapsulation space to encapsulate the die and the light-emitting diode component.

Abstract: The present invention relates to a fingerprint identifying module with an indicating function, including a circuit board, a fingerprint sensing element, a light emitting element, and a light guide structure. Both the fingerprint sensing element and the light emitting element are provided on the circuit board. The light guide structure surrounds the fingerprint sensing element and is close to the light emitting element; and may guide a light beam generated by the light emitting element, and enable the light beam to move within the light guide structure. Because the light guide structure surrounding the fingerprint sensing element generates a light emitting effect, a position of the fingerprint sensing element may be displayed.

Abstract: The present invention provides a package structure of a fingerprint identification chip, including: a substrate, having a first surface, a second surface and a penetrating opening, the second surface including a groove extending from the penetrating opening and a second metal contact, and the groove being used for accommodating a first metal contact; a fingerprint identification chip having an upper surface and a lower surface, the fingerprint identification being disposed in the penetrating opening and having a bonding pad on the lower surface; a cover plate, fixedly disposed on the first surface of the substrate and covering the upper surface of the fingerprint identification chip; and a flexible print circuit (FPC), disposed on the second surface of the substrate, a surface of the FPC having a third metal contact that corresponds to and is electrically connected to the second metal contact, where bonding pad is electrically connected to the first metal contact through a wire.

Abstract: The present invention provides a fingerprint recognition touch screen, including a display panel, a metal mesh layer, and a transparent cover plate. The transparent cover plate is disposed above the metal mesh layer and the driver circuit. The metal mesh layer has a plurality of junctions, when a fingerprint surface presses the transparent cover plate, the junctions of the metal mesh layer have respective capacitance states in response to the fingerprint surface located above the junctions, and the capacitance states may be learned by means of a driver circuit to determine a shape of the fingerprint surface.

Abstract: The present invention provides a package structure of a fingerprint identification chip, including: a metal substrate, having a through opening and two grooves extending from two opposite sides of the through opening; a fingerprint identification chip, disposed in the through opening and having an upper surface and a lower surface, the lower surface having a bonding pad; a cover plate, fixedly disposed on the metal substrate and covering the upper surface of the fingerprint identification chip; a flexible printed circuit (FPC), disposed on the lower surface of the fingerprint identification chip and having a first surface and a second surface, the second surface having a first metal contact; and a metal reinforcing plate, inserted into the two grooves and covering the through opening, where the bonding pad is electrically connected to the first metal contact through a wire.

Abstract: This application provides a fingerprint recognition module and a manufacturing method therefor. The fingerprint recognition module includes a flexible printed circuit (FPC) board, a die, an adhesive layer, and a cover plate. The manufacturing method includes the following steps: (a) directly welding the die to the FPC board, and electrically connecting the die to the FPC board; (b) coating the adhesive layer on an upper surface of the die; (c) covering the adhesive layer with a cover plate, to adhere the cover plate to the adhesive layer; and (d) applying low pressure injection modeling encapsulation to an encapsulation space defined between the cover plate and the FPC board, so as to form an encapsulation layer in the encapsulation space and produce a waterproof effect.

Abstract: The present invention provides a human perception test system, which performs a human perception test. The human perception test program and presents on the display module a human perception test interface; the human perception test interface is configured to display a graphic box and an arbitrarily moving graphic; a user operates the control unit to control the graphic box, so that the graphic box and the graphic perform synchronous displacement; when the period of time of the synchronous displacement is equal to a preset time value, two moving speeds of the graphic box within the period of time of the synchronous displacement are acquired; and the micro control unit determines, according to an absolute value of a difference between the two moving speeds, whether the user succeeds in the human perception test.

Abstract: The present invention provides a human perception test system, which performs a human perception test. The human perception test program and presents on the display module a human perception test interface; the human perception test interface is configured to display a graphic box and an arbitrarily moving graphic; a user operates the control unit to control the graphic box, so that the graphic box and the graphic perform synchronous displacement; when the period of time of the synchronous displacement is equal to a preset time value, two moving speeds of the graphic box within the period of time of the synchronous displacement are acquired; and the micro control unit determines, according to an absolute value of a difference between the two moving speeds, whether the user succeeds in the human perception test.

Abstract: A fingerprint identification module includes a sensing surface, a circuit board, a control unit, a fingerprint sensor and a position sensor. The fingerprint sensor is arranged between the sensing surface and the circuit board. When a finger is placed on the sensing surface, a fingerprint image of the finger is sensed by the fingerprint sensor. The position sensor is arranged between the sensing surface and the circuit board, and electrically connected with the control unit. The position sensor senses a touch pressure on the sensing surface. The control unit acquires a position of the finger on the sensing surface according to the at least one touch pressure.

Abstract: A car control device is used for a car. The car control device includes a microcontroller unit, a display module, a pressure sensing unit, a wireless transmission module, a fingerprint identification module and a memory unit. A control signal is transmitted from the car control device to the car through the wireless transmission module. The fingerprint identification module acquires a fingerprint information of a user. The microcontroller unit compares the fingerprint information with the fingerprint record of the memory unit and executes a mental condition test program to perform a mental condition test on the user. If the microcontroller unit judges that the fingerprint information is correct and the user passes the mental condition test, the microcontroller unit issues the control signal to the car through the wireless transmission module so as to control the car.

Abstract: The present invention relates to a fingerprint identifying module with an indicating function, including a circuit board, a fingerprint sensing element, a light emitting element, and a light guide structure. Both the fingerprint sensing element and the light emitting element are provided on the circuit board. The light guide structure surrounds the fingerprint sensing element and is close to the light emitting element; and may guide a light beam generated by the light emitting element, and enable the light beam to move within the light guide structure. Because the light guide structure surrounding the fingerprint sensing element generates a light emitting effect, a position of the fingerprint sensing element may be displayed.

Abstract: This application provides a fingerprint recognition module having a light-emitting function and a manufacturing method therefor. The fingerprint recognition module includes a flexible printed circuit (FPC) board, a die, a light-emitting diode component, an adhesive layer, and a cover plate. The manufacturing method includes the following steps: (a) directly connecting and fixing the die and the light-emitting diode component to the FPC board, and electrically connecting the die and the light-emitting diode component to the FPC board; (b) coating the adhesive layer on an upper surface of the die; (c) covering the adhesive layer with a cover plate, to adhere the cover plate to the adhesive layer; and (d) applying low pressure injection modeling encapsulation to an encapsulation space defined between the cover plate and the FPC board, so as to form an encapsulation layer in the encapsulation space to encapsulate the die and the light-emitting diode component.

Abstract: This application provides a fingerprint recognition module and a manufacturing method therefor. The fingerprint recognition module includes a flexible printed circuit (FPC) board, a die, an adhesive layer, and a cover plate. The manufacturing method includes the following steps: (a) directly welding the die to the FPC board, and electrically connecting the die to the FPC board; (b) coating the adhesive layer on an upper surface of the die; (c) covering the adhesive layer with a cover plate, to adhere the cover plate to the adhesive layer; and (d) applying low pressure injection modeling encapsulation to an encapsulation space defined between the cover plate and the FPC board, so as to form an encapsulation layer in the encapsulation space and produce a waterproof effect.

Abstract: A vacuum lamination device includes a top mold and a bottom mold. The top mold includes a laminating plate. The bottom mold includes a fixing recess. A method for laminating a fingerprint recognition module under a vacuum condition includes the following steps. In a step (a), the vacuum lamination device is provided. In a step (b), the fingerprint recognition module is placed into the fixing recess. In a step (c), the top mold is moved toward the bottom mold to define a sealed chamber. In a step (d), the sealed chamber is evacuated to be in a vacuum state. Consequently, the laminating plate of is subjected to deformation to press a covering plate of the fingerprint recognition module. In a step (e), the fingerprint recognition module in the vacuum lamination device is baked.

Abstract: This invention provides compact photographic and projection modules and electronic systems having the photographic and projection modules, which not only can project image data but also can capture image with good image quality high zoom ratio. Additionally, the photographic and projection modules are reliable and able to be made with low cost.