Abstract: The invention discloses a testing system and a testing method. The testing system includes a testing platform and a fetching device. The testing platform includes a metal base plate, a DUT board, a testing stand and a metal wall. The DUT board is disposed on the metal base plate. The testing stand is disposed on the DUT board. The metal wall is disposed on the metal base plate and surrounds the testing stand. The fetching device is movably disposed above the testing platform and used for placing a DUT on the testing stand. A metal covering plate of the fetching device corresponds to the metal wall of the testing platform. When the fetching device places the DUT on the testing stand, the metal covering plate cooperates with the metal wall and the metal base plate of the testing platform to form an isolated space, so as to isolate the DUT.

Abstract: A monolithic microwave integrated circuit chip package having thermal vias therein comprising a package substrate, a monolithic microwave integrated circuit chip, a plurality of bumps and a plastic package body. The package channels the ground-signal-ground or ground-signal bonding pad arrangement on the monolithic microwave integrated circuit chip to points outside the package so that the monolithic microwave integrated circuit chip inside the package may operate in the optimal conditions.

Abstract: A flip chip package of monolithic microwave integrated circuit (MMIC) is disclosed. The MMIC package includes a substrate with top and bottom surfaces; a MMIC chip, having an active surface; a plurality of metal strips on the active surface of the MMIC chip; a plurality of metal strips on the top surface of the substrate and electrically connected to the metal strips on the MMIC chip; a plurality of metal strips on the bottom surface of the substrate; a plurality of via holes, penetrating through the substrate and electrically connected to the metal strips on the substrate's top and bottom surface; an underfill, filling all the chinks between MMIC chip and the substrate and covering up the MMIC chip. Moreover, the MMIC package has a penetration hole through the central area of the substrate and filled with a heat-dissipative material for heat dissipation.

Abstract: A flip chip package of monolithic microwave integrated circuit (MMIC) is disclosed.

Abstract: A monolithic microwave integrated circuit (MMIC) package comprises a MMIC die, a heat sink, an insulation substrate, and a sealing material. The MMIC die has an active region and a peripheral region. The heat sink is located in the active region. A plurality of bonding pads are located in the peripheral region. The insulation substrate has an opening and a plurality of transit ports. The opening is used to contain the heat sink and the transit ports are electrically connected to the bonding pads. The sealing material is filled between the insulation substrate and the MMIC die to cover the whole MMIC die so that the MMIC die is fixed to the insulation substrate and is protected.

Abstract: A fragrance diffuser (100) comprises a housing defining a chamber (116) for holding a fragrance-emitting block (110), a heating element (112) located within the housing, a timing and indicating circuit board (114) to signal when the predicted life of the fragrance emitting block has expired, a power supply connection plug (134) for providing electrical power to the heating element and the timing and indicating board, and a keying system (234, 236, 238) incorporated in the chamber (116) and on the fragrance-emitting blocks (110). The blocks are encoded or keyed to indicate that they possess particular predefined characteristics, such that only blocks having those characteristics may be inserted. The diffuser is constructed with a downwardly-projecting housing extension (132) for the power supply connection to allow the use of an adjacent electric power outlet when the diffuser is properly installed.