Abstract: A semiconductor device includes a substrate having fins and trenches in between the fins, a plurality of insulators, a first metal layer, an insulating layer, a second metal layer and an interlayer dielectric. The insulators are disposed within the trenches of the substrate. The first metal layer is disposed on the plurality of insulators and across the fins. The insulating layer is disposed on the first metal layer over the plurality of insulators and across the fins. The second metal layer is disposed on the insulating layer over the plurality of insulators and across the fins. The interlayer dielectric is disposed on the insulators and covering the first metal layer, the insulating layer and the second metal layer.

Abstract: A camera module includes a circuit board, an image sensor, a filter removable switch, a camera lens, and a thermally conductive structure. The circuit board has a surface. The image sensor is disposed on the surface. The filter removable switch is located over the surface. The camera lens is on the light-sensing path of the image sensor. The thermally conductive structure is contacted between the circuit board and the filter removable switch and has a channel. The image sensor is located in the channel.

Abstract: A lens device includes a hollow base, a calibration ring, and a lens assembly. The hollow base includes a bottom surface and an assembly plane opposite to the bottom surface. The assembly plane has a through hole. The calibration ring includes a shaft hole, a first annular surface, and a second annular surface axially opposite to the first annular surface. An inner wall of the shaft hole has an internal thread. The shaft hole corresponds to the through hole of the hollow base. The second annular surface is fixed on the assembly plane of the hollow base via a curing adhesive layer. The lens assembly includes a lens barrel. The lens barrel has an external thread. The lens barrel is screwed to the internal thread of the calibration ring by the external thread.

Abstract: A camera module includes a circuit board, an image sensor, a filter removable switch, a camera lens, and a thermally conductive structure. The circuit board has a surface. The image sensor is disposed on the surface. The filter removable switch is located over the surface. The camera lens is on the light-sensing path of the image sensor. The thermally conductive structure is contacted between the circuit board and the filter removable switch and has a channel. The image sensor is located in the channel.

Abstract: A lens device includes a hollow base, a calibration ring, and a lens assembly. The hollow base includes a bottom surface and an assembly plane opposite to the bottom surface. The assembly plane has a through hole. The calibration ring includes a shaft hole, a first annular surface, and a second annular surface axially opposite to the first annular surface. An inner wall of the shaft hole has an internal thread. The shaft hole corresponds to the through hole of the hollow base. The second annular surface is fixed on the assembly plane of the hollow base via a curing adhesive layer. The lens assembly includes a lens barrel. The lens barrel has an external thread. The lens barrel is screwed to the internal thread of the calibration ring by the external thread.

Abstract: A lens focusing method includes the following steps. A holder is disposed on a printed circuit board, such that the holder surrounds an image sensor that is on the printed circuit board. A lens assembly is rotated to position in the holder through a first thread of the holder and a second thread of the lens assembly. A tilt of the holder is adjusted, such that an optic axis of the lens assembly is perpendicular to the image sensor. The lens assembly is rotated to move to a focal plane in a vertical direction through the first and second threads again.