Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: An optical assembly and a camera module are provided, including a first submodule and a second submodule. The first submodule includes a first lens barrel and a first lens group disposed in the first lens barrel. The second submodule includes a second lens barrel and a second lens group disposed in the second lens barrel. The first lens group and the first lens barrel have a first major engagement mechanism and a first auxiliary engagement mechanism, respectively. The second lens group and the second lens barrel have a second major engagement mechanism and a second auxiliary engagement mechanism, respectively. The first auxiliary engagement mechanism and the second auxiliary engagement mechanism are assembled to form an auxiliary engagement section. The first major engagement mechanism and the second major engagement mechanism are assembled to form a major engagement section.

Abstract: A camera module including a lens holder, a lens barrel, a first lens set, a second lens set, and an image sensing device is provided. The lens holder includes a limiting portion. The lens barrel is disposed in the limiting portion. The image sensing device has a common optical axis, and enables the second lens set to be located between the first lens set and the image sensing device. A position of the lens barrel is adjustable in the limiting portion when assembling the camera module, and the lens barrel is disposed on the lens holder enabling the limiting portion to be located on a periphery of the lens barrel, and a gap is arranged between the limiting portion and the lens barrel such that the position of the lens barrel is adjustable along a direction perpendicular to the optical axis.

Abstract: A camera module including a lens holder, a lens barrel, a first lens set, a second lens set, and an image sensing device is provided. The lens holder includes a limiting portion. The lens barrel is disposed in the limiting portion. The image sensing device has a common optical axis, and enables the second lens set to be located between the first lens set and the image sensing device. A position of the lens barrel is adjustable in the limiting portion when assembling the camera module, and the lens barrel is disposed on the lens holder enabling the limiting portion to be located on a periphery of the lens barrel, and a gap is arranged between the limiting portion and the lens barrel such that the position of the lens barrel is adjustable along a direction perpendicular to the optical axis.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: An assembly method of a camera module is provided. The camera module includes a first and second lens set respectively including at least one lens. The assembly steps include: providing a substrate, a lens holder, and an image sensing device, wherein the image sensing device is located in a space formed by the substrate and the lens holder, and the lens holder includes a limiting portion; disposing the second lens set in the space; assembling a barrel in the limiting portion, wherein the first lens set is disposed in the barrel, the second lens set is located between the first lens set and the image sensing device, and the first and second lens sets and the image sensing device have a common optical axis; inspecting the imaging of the image sensing device; and adjusting a position of the barrel in the limiting portion according to the inspection result.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: A camera module including a lens holder, a lens barrel, a first lens set, a second lens set, an image sensing component and a driver is provided. The lens barrel is disposed on the lens holder. The first lens set is disposed in the lens barrel. The second lens set is fixed in the lens holder. The first lens set and the second lens set include at least one lens respectively. The image sensing component is disposed in the lens holder. The driver is configured to drive the lens barrel to enable the first lens set to move along a direction parallel to an axis direction of the optical axis. The driver adjusts a position of the first lens set so as to form a gap between the first lens set and the second lens set and along the optical axis.

Abstract: A semiconductor device package includes a carrier, a semiconductor device disposed on the carrier, and a lid disposed on the semiconductor device. The lid is spaced from the carrier by a first distance. The lid includes a base portion, a first pin extending from the base portion toward the semiconductor device, and a transparent portion. The first pin is spaced from the carrier by a second distance.

Abstract: An optical assembly and a camera module are provided, including a first submodule and a second submodule. The first submodule includes a first lens barrel and a first lens group disposed in the first lens barrel. The second submodule includes a second lens barrel and a second lens group disposed in the second lens barrel. The first lens group and the first lens barrel have a first major engagement mechanism and a first auxiliary engagement mechanism, respectively. The second lens group and the second lens barrel have a second major engagement mechanism and a second auxiliary engagement mechanism, respectively. The first auxiliary engagement mechanism and the second auxiliary engagement mechanism are assembled to form an auxiliary engagement section. The first major engagement mechanism and the second major engagement mechanism are assembled to form a major engagement section.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: An assembly method of a camera module is provided. The camera module includes a first and second lens set respectively including at least one lens. The assembly steps include: providing a substrate, a lens holder, and an image sensing device, wherein the image sensing device is located in a space formed by the substrate and the lens holder, and the lens holder includes a limiting portion; disposing the second lens set in the space; assembling a barrel in the limiting portion, wherein the first lens set is disposed in the barrel, the second lens set is located between the first lens set and the image sensing device, and the first and second lens sets and the image sensing device have a common optical axis; inspecting the imaging of the image sensing device; and adjusting a position of the barrel in the limiting portion according to the inspection result.

Abstract: A camera module including a lens holder, a lens barrel, a first lens set, a second lens set, an image sensing component and a driver is provided. The lens barrel is disposed on the lens holder. The first lens set is disposed in the lens barrel. The second lens set is fixed in the lens holder. The first lens set and the second lens set include at least one lens respectively. The image sensing component is disposed in the lens holder. The driver is configured to drive the lens barrel to enable the first lens set to move along a direction parallel to an axis direction of the optical axis. The driver adjusts a position of the first lens set so as to form a gap between the first lens set and the second lens set and along the optical axis.

Abstract: An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is disposed over the light receiver and coupled to the first light guide structure. The light receiver and the second light guide structure defines a cavity between the light receiver and the second light guide structure.