Abstract: A spin orbit torque magnetoresistive random access memory (SOT MRAM) includes at least a spin current source alloy layer, a ferromagnetic free layer, and an insulation layer. The spin current source alloy layer is a nickel-tungsten alloy layer. The ferromagnetic free layer is located on the spin current source alloy layer. The insulation layer is located on the ferromagnetic free layer. Since the nickel-tungsten alloy layer has favorable perpendicular magnetic anisotropic and can maintain a high spin Hall angle, it is suitable as a spin current source for the SOT MRAM.

Abstract: A semiconductor package includes a circuit board structure, a first redistribution layer structure and first bonding elements. The circuit board structure includes outermost first conductive patterns and a first mask layer adjacent to the outermost first conductive patterns. The first redistribution layer structure is disposed over the circuit board structure. The first bonding elements are disposed between and electrically connected to the first redistribution layer structure and the outermost first conductive patterns of the circuit board structure. In some embodiments, at least one of the first bonding elements covers a top and a sidewall of the corresponding outermost first conductive pattern.

Abstract: In an embodiment, a method includes: forming active devices over a semiconductor substrate; forming an interconnect structure over the active devices, the interconnect structure comprising a first portion of a seal ring over the semiconductor substrate, the seal ring being electrically insulated from the active devices; forming a first passivation layer over the interconnect structure; forming a first metal pad and a second metal pad extending through the first passivation layer and over the interconnect structure, the first metal pad having a bowl shape, the second metal pad having a step shape; and depositing a second passivation layer over the first metal pad and the second metal pad.

Abstract: A semiconductor package structure includes a first component, a bonding structure on the first component, a second component connected to the first component, and a copper connector on the second component. The bonding structure includes a copper base on the first component and copper protruding portions on the copper base. The second component is connected to the first component by bonding the copper protruding portions to the copper connector, and the copper protruding portions are in contact with the copper connector.

Abstract: A high-bandwidth package-on-package (HBPoP) structure includes a first package structure and a second package structure disposed over the first package structure. The first package structure includes a first package substrate, a semiconductor die, an interposer, and a molding material. The first package substrate is formed of a silicon and/or ceramic material. The semiconductor die is disposed over the first package substrate. The interposer is disposed over the semiconductor die and is formed of a silicon and/or ceramic material. The molding material is disposed between the first package substrate and the interposer and surrounds the semiconductor die.

Abstract: A semiconductor package structure includes a package substrate, a semiconductor die, an interposer, an adhesive layer, and a molding material. The semiconductor die is disposed over the package substrate. The interposer is disposed over the semiconductor die. The adhesive layer connects the semiconductor die and the interposer. The molding material surrounds the semiconductor die and the adhesive layer.

Abstract: A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component is disposed between the electronic component and the cover. The dam is disposed between the electronic component and the cover and surrounds the heat conduction component.

Abstract: In one embodiment of the present disclosure, the simulator apparatus a disposable, replaceable filter cartridge insertable into a recessed cavity of the main tubing in the interior chamber of a distal end of the cylindrical body, wherein the disposable cartridge comprises a base, spinach, ginger, cranberry extracts, carrot, pomegranate, citrus extract, broccoli, wheat germ and kale; and, a removably attachable coupling securing the filter cartridge in place at the distal end of the cylindrical body to lock the filter cartridge into the recessed cavity of the main tubing. In one embodiment, the apparatus further comprises a removably attachable cover, wherein the cover comprises a grid. In another embodiment the removably attachable cover comprises a screen.

Abstract: A method of making a nanoparticle reinforced metal matrix component is provided. The method involves solid state processing nanoparticles into a metal matrix material at solid state processing conditions to form a master alloy. At least a portion of the master alloy is added to a mass of metal melt to produce the nanoparticle reinforced metal matrix component.

Abstract: One aspect of the present invention is a method of applying a solder filler to an aluminum body part. The method includes abrading the surface of an aluminum body part at a temperature of at least about 300 degrees Celsius with a solder filler at a temperature of at least about 300 degrees Celsius.

Abstract: One method of the present invention includes applying a paste-like fluxing agent to an aluminum body part; heating the fluxing agent to deoxidize the surface of the aluminum body part; applying a solder filler to the aluminum body part; and heating the solder filler to bond the solder filler to the aluminum body part. The melting point of the solder filler is at least 100 degrees C. lower than the melting point of the aluminum body part. Another method includes forming a filler/flux mixture; applying the filler/flux mixture; and heating the filler/flux mixture to bond the solder filler to the aluminum body part. The disclosed solder fillers include tin-based alloys as follows: (1) 12-22% copper, 3-5% zinc and 75-85% tin; and (2) 3-5% copper, iron, cobalt, or nickel, 12-40% zinc and 55-85% tin and zinc-based solder filler alloys composed of 78-98% zinc and 2-22% aluminum.

Abstract: One method of the present invention includes applying a paste-like fluxing agent to an aluminum body part; heating the fluxing agent to deoxidize the surface of the aluminum body part; applying a solder filler to the aluminum body part; and heating the solder filler to bond the solder filler to the aluminum body part. The melting point of the solder filler is at least 100 E C lower than the melting point of the aluminum body part. Another method includes forming a filler/flux mixture; applying the filler/flux mixture; and heating the filler/flux mixture to bond the solder filler to the aluminum body part. The disclosed solder fillers include tin-based alloys as follows: (1) 12-22% copper, 3-5% zinc and 75-85% tin; and (2) 3-5% copper, iron, cobalt, or nickel, 12-40% zinc and 55-85% tin and zinc-based solder filler alloys composed of 78-98% zinc and 2-22% aluminum.

Abstract: A method and apparatus for directly making rapid prototype tooling from a computer model having a free-form shape. The method steps comprise essentially: (a) machining a soft metal tooling base so as to contour at least one free-form surface in conformity with the computer model; (b) cold-gas dynamic spraying the contoured surface to form superimposed impact welded metal particle layers, the layers consisting of at least one thermal management under-layer comprising primarily copper, and at least an outer wear resistant layer comprising primarily tool steel.

Abstract: A method and apparatus for gas-dynamic cold spraying a liner 3 in a cylinder 2 of an aluminum engine block 1 is provided. The gas-dynamic cold spray liner 3 allows the aluminum engine block 1 to have a hardened cylinder surface 10 without the induction of residual hoop stress within the aluminum engine block 1.

Abstract: A metal matrix composite includes a plurality of fibers having an average diameter of about eight micrometers with a coating, and a metal or alloy distributed with said fibers, a fibers-to-metal or alloy ratio has a range is has a range of about 9:1 to less than about 1:1.

Abstract: A method of enhancing a joint in a metal assembly. At least two metal members are joined together. Each member has a joining surface that mates with the other joining surface. The metal members are contacted against one another such that the joining surfaces mate. The mated joining surfaces are welded together at multiple locations. The welding process leaves a small gap between the metal members between these welding locations. Heat is applied to the joining surfaces adjacent to the gap. A solder is applied to the heated joining surfaces. The joining surfaces cause the solder to melt and to be wicked into the gap by the capillary force. The solder fills the length, width and thickness of the gap and joins the metal members together with a metallurgical bond. The entire joint including areas between the welding locations becomes joined.