Abstract: Provide a micro-light-emitting package includes a first substrate, a plurality of micro-light-emitting diodes (micro-LEDs), a transparent protective layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other. The micro-LEDs are disposed on the upper surface of the first substrate. The micro-LEDs have a first electrode and a second electrode electrically opposite to the first electrode. The transparent protective layer covers the micro-LEDs. The plurality of conductive pads are disposed on the lower surface of the first substrate. The conductive pads include a first conductive pad, a second conductive pad, a third conductive pad, and a fourth conductive pad. The first conductive pad, the second conductive pad, the third conductive pad respectively electrically connected to the corresponding first electrode of the micro-LEDs. The fourth conductive pad is commonly electrically connected to the second electrode of the plurality of micro-LEDs.

Abstract: A semiconductor device includes a substrate having fins and trenches in between the fins, a plurality of insulators, a first metal layer, an insulating layer, a second metal layer and an interlayer dielectric. The insulators are disposed within the trenches of the substrate. The first metal layer is disposed on the plurality of insulators and across the fins. The insulating layer is disposed on the first metal layer over the plurality of insulators and across the fins. The second metal layer is disposed on the insulating layer over the plurality of insulators and across the fins. The interlayer dielectric is disposed on the insulators and covering the first metal layer, the insulating layer and the second metal layer.

Abstract: The present invention relates to a method for making a solid electrolytic capacitor having a low equivalent series resistance by impregnating a porous capacitor pellet with conductive polymer. An oxidized pellet is dipped in a high concentration conductive polymer solution to deposit the polymer in doped (conductive) form. The solution also contains a crosslinking agent to prevent redissolution of the polymer when the pellet is re-dipped. After dipping, the solvent in the polymer solution is evaporated and a conductive film formed. In order to evaporate the solvent quickly, the solvent should have a boiling point of 80-220° C. and preferably a boiling point of 100-150° C. The conductive polymer film has a low resistivity (less than 1 ohm-cm, preferably less than 0.2 ohm-cm).

Abstract: Conductive polymers are prepared from a stabilized solution containing a monomer, an Fe(III) oxidizing agent, and a mixed solvent. The solvents are selected to stabilize the Fe(III) oxidizing agent and monomer in solution while allowing highly conducting polymers to be produced upon evaporating the lower-boiling solvent. The higher-boiling solvent does not appreciably complex with Fe(III), while the lower-boiling solvent forms a weak complex with Fe(III). The mixed-solvent system of the present invention may be used for preparing a conductive polymer counter electrode in a solid tantalum capacitor by polymerizing the monomer inside a porous tantalum pellet.

Abstract: Conductive polymers are prepared from a stabilized solution containing a monomer, an Fe(III) oxidizing agent, and a mixed solvent. The solvents are selected to stabilize the Fe(III) oxidizing agent and monomer in solution while allowing highly conducting polymers to be produced upon evaporating the lower-boiling solvent. The higher-boiling solvent does not appreciably complex with Fe(III), while the lower-boiling solvent forms a weak complex with Fe(III). The mixed-solvent system of the present invention may be used for preparing a conductive polymer counter electrode in a solid tantalum capacitor by polymerizing the monomer inside a porous tantalum pellet.

Abstract: Conductive polymers are prepared from a stabilized solution containing a monomer, an Fe(III) oxidizing agent, and a mixed solvent. The solvents are selected to stabilize the Fe(III) oxidizing agent and monomer in solution while allowing highly conducting polymers to be produced upon evaporating the lower-boiling solvent. The higher-boiling solvent does not appreciably complex with Fe(III), while the lower-boiling solvent forms a weak complex with Fe(III). The mixed-solvent system of the present invention may be used for preparing a conductive polymer counter electrode in a solid tantalum capacitor by polymerizing the monomer inside a porous tantalum pellet.

Abstract: The present invention provides a manganese nitrate coating having high conductivity and solid tantalum anode capacitors having low ESR by using an oven atmosphere which effectively treats all of the anodes in the oven. The manganese nitrate coating of the present invention is produced under highly oxidizing conditions by providing one or more oxidizing agents more active than nitrogen dioxide in the atmosphere of the oven during pyrolysis of manganese nitrate. The oxidizing agents include nitric acid, hydrogen peroxide, ozone, and mixtures thereof.

Abstract: A solid electrolytic capacitor having an exothermic alloying fuse attached thereto, the fuse comprising a strip of metal, silicone surrounding the strip and an insulative material disposed on opposite sides of the silicone composition to form a sandwich.

Abstract: A solid electrolytic capacitor having an exothermic alloying fuse attached thereto, the fuse comprising a strip of wire sandwiched between a pair of preformed tapes having silicone on a side next to the wire and an organic polymer on the other side.

Abstract: Encapsulation of electrical components wherein organonitrate is blended with poly(phenylene sulfide), and inorganic filler to reduce the viscosity of the blend and enable improved encapsulation.