Abstract: Provided is a pharmaceutical composition including an active pharmaceutical ingredient, a toll-like receptor (TLR) agonist, a stimulator of interferon genes (STING) agonist, and a pharmaceutically acceptable carrier. Also provided are a method for inducing immune response and a method for treating or preventing cancer or an infectious disease, including administering an effective amount of the pharmaceutical composition to a subject in need thereof.

Abstract: A method includes forming isolations extending into a semiconductor substrate, recessing the isolation regions, wherein a semiconductor region between the isolation regions forms a semiconductor fin, forming a first dielectric layer on the isolation regions and the semiconductor fin, forming a second dielectric layer over the first dielectric layer, planarizing the second dielectric layer and the first dielectric layer, and recessing the first dielectric layer. A portion of the second dielectric layer protrudes higher than remaining portions of the first dielectric layer to form a protruding dielectric fin. A portion of the semiconductor fin protrudes higher than the remaining portions of the first dielectric layer to form a protruding semiconductor fin. A portion of the protruding semiconductor fin is recessed to form a recess, from which an epitaxy semiconductor region is grown. The epitaxy semiconductor region expands laterally to contact a sidewall of the protruding dielectric fin.

Abstract: A heat dissipating device is disclosed. The heat dissipating device comprises a heat dissipating base, a frame and at least one resilient member. The heat dissipating base has a plate, and at least one hole is formed on the plate. The frame has at least one protruding column, and at least one side of the frame has a protrusion. The resilient member is put on the protruding column correspondingly. When the frame buckles an edge of the plate by the protrusion and be put on the heat dissipating base, the protruding column can pass through the hole on the plate to make the frame elastically associate with the heat dissipating base through the resilient member. Thus, the heat dissipating device makes the heat dissipating base keep closer contact with a chip, balances internal stresses, prevents hestsinks design from being restricted, and further lowers cost.

Abstract: A liquid crystal display (LCD) has a plastic frame for supporting a liquid crystal display panel and a metal cover for boxing the plastic frame. A print circuit board (PCB) is fixed on a lower surface of the plastic frame and connects to the liquid crystal display panel by using a flexible flat cable that extends along a sidewall of the plastic frame. A conductive film is taped both on a grounding pin of the PCB and on a sidewall of the metal cover for discharging segregated charges on the PCB to the environment.

Abstract: An integrated heat-dissipating module includes a heat-dissipating device substantially in contact with a main heat-generating source on a motherboard, a casing capping over the main heat-generating source and substantially in contact with sub heat-generating sources installed around the main heat-generating source, and a heat-dissipating fan installed on a first vent of the casing. The heat produced by the main heat-generating source is transmitted to the air inside the casing via the heat-dissipating device. Then, the hot airflow concentrated within the casing is expelled from a second vent of the casing by the heat-dissipating fan. The casing is made of a high heat conducting material and has a plurality of external heat-dissipating fins extending outward from an outer surface of the casing for quickly transmitting the heat generated by the sub heat-generating sources to the outside. Heat produced by the main heat-generating source and the sub heat-generating sources is dissipated simultaneously.

Abstract: A liquid crystal display (LCD) has a plastic frame for supporting a liquid crystal display panel and a metal cover for boxing the plastic frame. A print circuit board (PCB) is fixed on a lower surface of the plastic frame and connects to the liquid crystal display panel by using a flexible flat cable that extends along a sidewall of the plastic frame. A conductive film is taped both on a grounding pin of the PCB and on a sidewall of the metal cover for discharging segregated charges on the PCB to the environment.

Abstract: An integrated heat-dissipating module includes a heat-dissipating device substantially in contact with a main heat-generating source on a motherboard, a casing capping over the main heat-generating source and substantially in contact with sub heat-generating sources installed around the main heat-generating source, and a heat-dissipating fan installed on a first vent of the casing. The heat produced by the main heat-generating source is transmitted to the air inside the casing via the heat-dissipating device. Then, the hot airflow concentrated within the casing is expelled from a second vent of the casing by the heat-dissipating fan. The casing is made of a high heat conducting material and has a plurality of external heat-dissipating fins extending outward from an outer surface of the casing for quickly transmitting the heat generated by the sub heat-generating sources to the outside. Heat produced by the main heat-generating source and the sub heat-generating sources is dissipated simultaneously.