Abstract: A communication receiver includes a first signal processing circuit and a second signal processing circuit. The first signal processing circuit includes a first feedforward equalizer and a decision circuit. The first feedforward equalizer processes a received signal to generate a first equalized signal. The decision circuit performs hard decision upon the first equalized signal to generate a first symbol decision signal. The second signal processing circuit includes a second feedforward equalizer, a decision feedforward equalizer, and a first decision feedback equalizer. The second feedforward equalizer processes the first equalized signal to generate a second equalized signal. The decision feedforward equalizer processes the first symbol decision signal to generate a third equalized signal. The first decision feedback equalizer generates a second symbol decision signal according to the second equalized signal and the third equalized signal.

Abstract: A semiconductor arrangement includes a first dielectric feature passing through a semiconductive layer and a first dielectric layer over a substrate. The semiconductor arrangement includes a conductive feature passing through the semiconductive layer and the first dielectric layer and electrically coupled to the substrate. The conductive feature is adjacent the first dielectric feature and electrically isolated from the semiconductive layer by the first dielectric feature.

Abstract: A method for extracting flavone aglycones in Chrysanthemum morifolium is provided. The method includes: (a) immersing a Chrysanthemum morifolium raw material in water or an aqueous solution to perform an immersion procedure for 3.5 hours or more to obtain an immersion sample; and (b) adding an extraction solvent to the immersion sample to perform an extraction procedure 5-60 minutes to obtain an extract. The Chrysanthemum morifolium raw material includes at least one of the following parts of Chrysanthemum morifolium: whole plant, roots, stems, leaves and flowers.

Abstract: A shoe component includes a foam member including a thermoplastic material and a mixed material mixed to each other, wherein the weight percentage of the thermoplastic material is 90 wt % to 99 wt %, and the weight percentage of the mixed material is 10 wt % to 1 wt %. A manufacturing method of the shoe component is also disclosed herein.

Abstract: A method for producing galanthamine using a plant, includes (a) performing a thermal treatment on a living plant to induce accumulation of galanthamine therein, wherein the living plant is a plant belonging to the family Amaryllidaceae; and (b) placing the living plant in a medium and performing an electrical stimulation treatment on the living plant to release the galanthamine from the living plant to the medium.

Abstract: A method for inducing plants to increase their flavonoid compound content, includes performing an induction culture on a young shoot or an adult of a living plant, wherein flavonoid compound content of the young shoot or the adult of the living plant which has been subjected to the induction culture is higher than that of a young shoot or an adult of a living plant which is not subjected to the induction culture. Moreover, the induction culture includes a metal ion stimulation procedure comprising culturing the young shoot or the adult of the living plant in a culture environment with metal ion stimulation, wherein the culture environment with metal ion stimulation contains a metal ion used for stimulating the living plant, and the concentration of the metal ion used for stimulating the living plant is 5 ?M-50 mM.

Abstract: A shoe component includes a foam member including a thermoplastic material and a mixed material mixed to each other, wherein the weight percentage of the thermoplastic material is 90 wt % to 99 wt %, and the weight percentage of the mixed material is 10 wt % to 1 wt %. A manufacturing method of the shoe component is also disclosed herein.

Abstract: An exemplary method includes forming a hard mask layer over an integrated circuit layer and implanting ions into a first portion of the hard mask layer without implanting ions into a second portion of the hard mask layer. An etching characteristic of the first portion is different than an etching characteristic of the second portion. After the implanting, the method includes annealing the hard mask layer. After the annealing, the method includes selectively etching the second portion of the hard mask layer, thereby forming an etching mask from the first portion of the hard mask layer. The method can further include using the etching mask to pattern the integrated circuit layer.

Abstract: A method for inducing plants to increase their flavonoid compound content, includes performing an induction culture on a young shoot or an adult of a living plant, wherein flavonoid compound content of the young shoot or the adult of the living plant which has been subjected to the induction culture is higher than that of a young shoot or an adult of a living plant which is not subjected to the induction culture. Moreover, the induction culture includes a metal ion stimulation procedure comprising culturing the young shoot or the adult of the living plant in a culture environment with metal ion stimulation, wherein the culture environment with metal ion stimulation contains a metal ion used for stimulating the living plant, and the concentration of the metal ion used for stimulating the living plant is 5 ?M-50 mM.

Abstract: A method for producing galanthamine using a plant, includes (a) performing a thermal treatment on a living plant to induce accumulation of galanthamine therein, wherein the living plant is a plant belonging to the family Amaryllidaceae; and (b) placing the living plant in a medium and performing an electrical stimulation treatment on the living plant to release the galanthamine from the living plant to the medium.

Abstract: Provided is a device of automatic mechanical wound opener for head and neck surgery. The device includes a wound opener including: a fixed unit and a plurality of drawing units, and at least one of the drawing units being movably connected on the fixed unit, wherein each of the drawing units includes a first arm, a second arm, and a blade connected to the second arm; wherein the first arm is connected to the fixed unit by one end thereof and to the second arm by the other end thereof; the second arm can be adjusted to an needed included angle relative to the first arm; and at least one of the blades includes an extension plate connected to an end of a plate part of the blade, and the extension plate is connected to the second arm for shortening the spacing between two blades.

Abstract: An exemplary method includes forming a hard mask layer over an integrated circuit layer and implanting ions into a first portion of the hard mask layer without implanting ions into a second portion of the hard mask layer. An etching characteristic of the first portion is different than an etching characteristic of the second portion. After the implanting, the method includes annealing the hard mask layer. After the annealing, the method includes selectively etching the second portion of the hard mask layer, thereby forming an etching mask from the first portion of the hard mask layer. The method can further include using the etching mask to pattern the integrated circuit layer.

Abstract: A method of patterning a substrate includes forming a hard mask layer over the substrate; forming a first material layer over the hard mask layer; and forming a trench in the first material layer. The method further includes treating the hard mask layer with an ion beam through the trench. An etching rate of a treated portion of the hard mask layer reduces with respect to an etching process while an etching rate of untreated portions of the hard mask layer remains substantially unchanged with respect to the etching process. After the treating of the hard mask layer, the method further includes removing the first material layer and removing the untreated portions of the hard mask layer with the etching process, thereby forming a hard mask over the substrate. The method further includes etching the substrate with the hard mask as an etch mask.

Abstract: A method includes receiving a device having a first layer and a second layer over the first layer, the first layer having a first overlay mark. The method further includes forming a first resist pattern over the second layer, the first resist pattern having a second overlay mark. The method further includes performing a first overlay measurement using the second overlay mark in the first resist pattern and the first overlay mark; and performing one or more first manufacturing processes, thereby transferring the second overlay mark into the second layer and removing the first resist pattern. The method further includes performing one or more second manufacturing processes that include forming a third layer over the second layer. After the performing of the one or more second manufacturing processes, the method includes performing a second overlay measurement using the second overlay mark in the second layer and the first overlay mark.

Abstract: A method of patterning a substrate includes forming a hard mask layer over the substrate; forming a first material layer over the hard mask layer; and forming a trench in the first material layer. The method further includes treating the hard mask layer with an ion beam through the trench. An etching rate of a treated portion of the hard mask layer reduces with respect to an etching process while an etching rate of untreated portions of the hard mask layer remains substantially unchanged with respect to the etching process. After the treating of the hard mask layer, the method further includes removing the first material layer and removing the untreated portions of the hard mask layer with the etching process, thereby forming a hard mask over the substrate. The method further includes etching the substrate with the hard mask as an etch mask.

Abstract: A wound opener is provided. An operative field can be created through head/neck soft tissues for introducing the endoscopes and robotic surgical tools. An incision size can be properly adjusted. Thus, endoscopes, robotic arms or other devices can be smoothly introduced into the operative field to evaluate and treat lesions of head and neck soft tissues. Hence, the present invention facilitates surgical procedure, reduces wound size and effectively conceals wound to make it become invisible.

Abstract: Provided is a device of automatic mechanical wound opener for head and neck surgery. The device includes a wound opener including: a fixed unit and a plurality of drawing units, and at least one of the drawing units being movably connected on the fixed unit, wherein each of the drawing units includes a first arm, a second arm, and a blade connected to the second arm; wherein the first arm is connected to the fixed unit by one end thereof and to the second arm by the other end thereof; the second arm can be adjusted to an needed included angle relative to the first arm; and at least one of the blades includes an extension plate connected to an end of a plate part of the blade, and the extension plate is connected to the second arm for shortening the spacing between two blades.

Abstract: Aspects of the disclosure relate to identifying visited travel destinations from a set of digital images associated with users of a social networking system. For example, one or more computing devices provide access to an individual user's account, including the individual user and other users affiliated with the individual user via the social networking system. One or more digital images are received from a computing device associated with the individual user and from one or more second computing devices associated with the other users of the social networking system. From each digital image, a geo-location is determined for each digital image. The one or more computing devices display each geo-located image on a map at a position corresponding to the determined geo-location for the geo-located image.

Abstract: An electronic apparatus includes a first assembly and a second assembly. The first assembly includes at least one hook and at least one elastic locating member. The second assembly includes at least one hook groove and at least one locating groove. The second assembly receives the hook of the first assembly by the hook groove along a first assembling direction. The second assembly makes the hook engaged to the hook groove along a second assembling direction. When the second assembly moves relative to the first assembly along the second assembling direction, the elastic locating member gets into the locating groove, thereby fastening the first assembly and the second assembly.

Abstract: An electronic apparatus includes a first assembly and a second assembly. The first assembly includes at least one hook and at least one elastic locating member. The second assembly includes at least one hook groove and at least one locating groove. The second assembly receives the hook of the first assembly by the hook groove along a first assembling direction. The second assembly makes the hook engaged to the hook groove along a second assembling direction. When the second assembly moves relative to the first assembly along the second assembling direction, the elastic locating member gets into the locating groove, thereby fastening the first assembly and the second assembly.