Abstract: A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the base, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the integrated package substrate, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the integrated package substrate, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the base, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.

Abstract: A non-contact power supply device on which a power-feeding object device can easily and appropriately be placed, and a non-contact power transmission device including the power-feeding object device. The non-contact power transmission device includes a non-contact power supply device having a power feeding coil, a housing that houses the power feeding coil, and a bobbin around which the power feeding coil is wound. The housing has a concave part at least partially accommodating a power-feeding object device. The concave part has a curved surface at least in a portion of an inner surface on which the power-feeding object device is placed. The curved inner surface of the concave part prevents the power-feeding object device from standing upright. A portable electronic device serving as the power-feeding object device is at least partially accommodated in the concave part.

Abstract: A non-contact power supply device on which a power-feeding object device can easily and appropriately be placed, and a non-contact power transmission device including the power-feeding object device. The non-contact power transmission device includes a non-contact power supply device having a power feeding coil, a housing that houses the power feeding coil, and a bobbin around which the power feeding coil is wound. The housing has a concave part at least partially accommodating a power-feeding object device. The concave part has a curved surface at least in a portion of an inner surface on which the power-feeding object device is placed. The curved inner surface of the concave part prevents the power-feeding object device from standing upright. A portable electronic device serving as the power-feeding object device is at least partially accommodated in the concave part.

Abstract: An inspection unit, in which a laser source and a reflection measuring module containing a laser source and a light receiver are connected to an optical switch, is connected to an input optical fiber of an optical fiber device. An end of an output optical fiber is beveled and is connected to the light receiver through an adapter. When loss is measured, inspection light from the laser source is input into the light receiver through the input optical fiber, the optical fiber device, and the output optical fiber. When return loss is measured, an optical switch is switched to input inspection light, from the laser source in the reflection measuring module, into the optical fiber device through the input optical fiber, and to input light reflected from the optical fiber device into the light receiver in the reflection measuring module.

Abstract: The invention provides a method of forming a device having an optical semiconductor element by bonding a cover body, which can cover the optical semiconductor element, to a head portion having the optical semiconductor element. The method comprises the steps of: a short circuit step of shorting terminals of the optical semiconductor with each other (S3); a bonding step of bonding the head portion and the cover body by welding (S5); and a step of eliminating short between the shorted terminals (S6). By method of the invention, electric influence applied to the optical semiconductor mounted on the head portion during welding process is prevented.