Patents by Inventor Tsutomu GANSE

Tsutomu GANSE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing laminate material
    Patent number: 11059281
    Abstract: A laminate material with a metal exposed portion is efficiently produced. A peeling step is performed in which a laser beam L is irradiated on a resin layer 17, 18 of a laminate raw material 10 in which a resin layer 17, 18 is laminated on at least one surface of a metal foil 11 to peel the resin layer 17, 18 and the metal foil 11 to thereby form a peeled portion 21, 22. Thereafter, the resin layers 17 and 18 corresponding to the peeled portions 21 and 22 are cut off to expose the metal foil 11.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: July 13, 2021
    Assignee: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Kensuke Nagata, Tsutomu Ganse
  • LAMINATE MATERIAL
    Publication number: 20190214611
    Abstract: Provided is a laminate material capable of easily forming a metal exposed portion. The laminate material 1 is a laminate material formed by bonding and laminating a resin layer 17, 18 on at least one surface of a metal foil 11. A recess 27, 28 in which a foil thickness of the metal foil 11 is reduced is formed on a part of a bonding surface of the metal foil. A peeled portion 21, 22 where the resin layer 17, 18 corresponding to the recess 27, 28 has been peeled from the metal foil 11 is formed.
    Type: Application
    Filed: May 30, 2017
    Publication date: July 11, 2019
    Applicant: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Kensuke NAGATA, Tsutomu GANSE
  • METHOD OF PRODUCING LAMINATE MATERIAL
    Publication number: 20190176457
    Abstract: A laminate material with a metal exposed portion is efficiently produced. A peeling step is performed in which a laser beam L is irradiated on a resin layer 17, 18 of a laminate raw material 10 in which a resin layer 17, 18 is laminated on at least one surface of a metal foil 11 to peel the resin layer 17, 18 and the metal foil 11 to thereby form a peeled portion 21, 22. Thereafter, the resin layers 17 and 18 corresponding to the peeled portions 21 and 22 are cut off to expose the metal foil 11.
    Type: Application
    Filed: May 30, 2017
    Publication date: June 13, 2019
    Applicant: SHOWA DENKO PACKAGING CO., LTD.
    Inventors: Kensuke NAGATA, Tsutomu GANSE