Patents by Inventor Tsutomu HAYASAKA

Tsutomu HAYASAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11950049
    Abstract: An acoustic reflector includes a reflection portion on which an elliptical reflection surface is formed, in which sound output from a speaker device that has an output position of the sound at or near one focal point on the elliptical reflection surface is reflected by the elliptical reflection surface, and the reflection portion has a size that reflects sound in a range of equal to or less than a nominal directional angle of the speaker device. As a result, because an outer shape of the reflection portion is formed to have a size in the range corresponding to the nominal directional angle of the speaker device, it is possible to reduce the size of the acoustic reflector.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: April 2, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Takahiro Hayasaka, Daisaku Matsufuji, Tsutomu Toyoguchi
  • Patent number: 11533833
    Abstract: An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: December 20, 2022
    Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Daisuke Kishi, Shota Mori, Takahiro Matsuzawa, Tsutomu Hayasaka
  • Patent number: 11172599
    Abstract: An electromagnetic-wave shielding sheet is an electromagnetic-wave shielding sheet used to form an electronic component-mounted substrate, the electronic component-mounted substrate including an electromagnetic-wave shielding layer covering at least a part of a step part and an exposed surface of a substrate, in which the electromagnetic-wave shielding sheet is a laminate including a cushion layer and a conductive layer, the conductive layer is an isotropic conductive layer containing a binder resin and a conductive filler, a thickness of the conductive layer is 8 to 70 ?m, and a content of the conductive filler in a region on a side opposite to a cushion layer side in the conductive layer is larger than that in a region on the cushion layer side in the conductive layer.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: November 9, 2021
    Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Shota Mori, Kazunori Matsudo, Kenji Ando, Tsutomu Hayasaka
  • Publication number: 20210251111
    Abstract: An electromagnetic-wave shielding sheet is an electromagnetic-wave shielding sheet used to form an electronic component-mounted substrate, the electronic component-mounted substrate including an electromagnetic-wave shielding layer covering at least a part of a step part and an exposed surface of a substrate, in which the electromagnetic-wave shielding sheet is a laminate including a cushion layer and a conductive layer, the conductive layer is an isotropic conductive layer containing a binder resin and a conductive filler, a thickness of the conductive layer is 8 to 70 ?m, and a content of the conductive filler in a region on a side opposite to a cushion layer side in the conductive layer is larger than that in a region on the cushion layer side in the conductive layer.
    Type: Application
    Filed: October 1, 2019
    Publication date: August 12, 2021
    Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Shota MORI, Kazunori MATSUDO, Kenji ANDO, Tsutomu HAYASAKA
  • Publication number: 20210242137
    Abstract: An electromagnetic wave shielding sheet according to the present embodiments is an electromagnetic wave shielding sheet for forming an electromagnetic wave shielding layer used for a component-mounting substrate including a substrate, an electronic component and an electromagnetic wave shielding layer, in which the electromagnetic wave shielding sheet includes at least one of a conductive layer before thermal pressing of the electromagnetic wave reflection layer and a conductive layer before thermal pressing of the electromagnetic wave absorption layer, the conductive layer before thermal pressing of the electromagnetic wave reflection layer includes a binder resin and a conductive filler, and the conductive layer before thermal pressing of the electromagnetic wave absorption layer includes a binder resin and an electromagnetic wave absorption filler. The Young's modulus of the conductive layer at 23° C. is set to 10 to 700 MPa.
    Type: Application
    Filed: April 15, 2019
    Publication date: August 5, 2021
    Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Kazunori MATSUDO, Ryota UMEZAWA, Kenji ANDO, Tsutomu HAYASAKA
  • Publication number: 20200413576
    Abstract: An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.
    Type: Application
    Filed: September 15, 2020
    Publication date: December 31, 2020
    Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Daisuke KISHI, Shota MORI, Takahiro MATSUZAWA, Tsutomu HAYASAKA
  • Patent number: 10820457
    Abstract: An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: October 27, 2020
    Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Daisuke Kishi, Shota Mori, Takahiro Matsuzawa, Tsutomu Hayasaka
  • Patent number: 9549473
    Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2). The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: January 17, 2017
    Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Satoshi Nishinohara, Hidenobu Kobayashi, Kazunori Matsudo, Tsutomu Hayasaka
  • Publication number: 20160270243
    Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2). The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.
    Type: Application
    Filed: August 27, 2015
    Publication date: September 15, 2016
    Inventors: Satoshi NISHINOHARA, Hidenobu KOBAYASHI, Kazunori MATSUDO, Tsutomu HAYASAKA
  • Publication number: 20160024327
    Abstract: The present invention provides a dispersed composition containing an ultramarine (A), a black inorganic pigment (B) (excluding carbon black), and a dispersion medium (C), wherein the weight ratio of ultramarine (A)/black inorganic pigment (B) is from 80/20 to 4.3/95.7. As a result, the invention provides a coating film and a colored item having a high surface resistivity (an antistatic effect) and resistance to overheating by sunlight, as well as a coating composition for forming this coating film and colored item, for use in fields such as black matrices for color filters and automotive coating materials.
    Type: Application
    Filed: May 20, 2013
    Publication date: January 28, 2016
    Applicants: TOYO INK HOLDINGS CO., LTD., TOYOCOLOR CO., LTD
    Inventors: Masahiro OOKAWA, Takeshi NISHINAKA, Tetsuro OIZUMI, Tsutomu HAYASAKA