Patents by Inventor Tsutomu HAYASAKA
Tsutomu HAYASAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11950049Abstract: An acoustic reflector includes a reflection portion on which an elliptical reflection surface is formed, in which sound output from a speaker device that has an output position of the sound at or near one focal point on the elliptical reflection surface is reflected by the elliptical reflection surface, and the reflection portion has a size that reflects sound in a range of equal to or less than a nominal directional angle of the speaker device. As a result, because an outer shape of the reflection portion is formed to have a size in the range corresponding to the nominal directional angle of the speaker device, it is possible to reduce the size of the acoustic reflector.Type: GrantFiled: March 26, 2020Date of Patent: April 2, 2024Assignee: SONY GROUP CORPORATIONInventors: Takahiro Hayasaka, Daisaku Matsufuji, Tsutomu Toyoguchi
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Patent number: 11533833Abstract: An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.Type: GrantFiled: September 15, 2020Date of Patent: December 20, 2022Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.Inventors: Daisuke Kishi, Shota Mori, Takahiro Matsuzawa, Tsutomu Hayasaka
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Patent number: 11172599Abstract: An electromagnetic-wave shielding sheet is an electromagnetic-wave shielding sheet used to form an electronic component-mounted substrate, the electronic component-mounted substrate including an electromagnetic-wave shielding layer covering at least a part of a step part and an exposed surface of a substrate, in which the electromagnetic-wave shielding sheet is a laminate including a cushion layer and a conductive layer, the conductive layer is an isotropic conductive layer containing a binder resin and a conductive filler, a thickness of the conductive layer is 8 to 70 ?m, and a content of the conductive filler in a region on a side opposite to a cushion layer side in the conductive layer is larger than that in a region on the cushion layer side in the conductive layer.Type: GrantFiled: October 1, 2019Date of Patent: November 9, 2021Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.Inventors: Shota Mori, Kazunori Matsudo, Kenji Ando, Tsutomu Hayasaka
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Publication number: 20210251111Abstract: An electromagnetic-wave shielding sheet is an electromagnetic-wave shielding sheet used to form an electronic component-mounted substrate, the electronic component-mounted substrate including an electromagnetic-wave shielding layer covering at least a part of a step part and an exposed surface of a substrate, in which the electromagnetic-wave shielding sheet is a laminate including a cushion layer and a conductive layer, the conductive layer is an isotropic conductive layer containing a binder resin and a conductive filler, a thickness of the conductive layer is 8 to 70 ?m, and a content of the conductive filler in a region on a side opposite to a cushion layer side in the conductive layer is larger than that in a region on the cushion layer side in the conductive layer.Type: ApplicationFiled: October 1, 2019Publication date: August 12, 2021Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.Inventors: Shota MORI, Kazunori MATSUDO, Kenji ANDO, Tsutomu HAYASAKA
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Publication number: 20210242137Abstract: An electromagnetic wave shielding sheet according to the present embodiments is an electromagnetic wave shielding sheet for forming an electromagnetic wave shielding layer used for a component-mounting substrate including a substrate, an electronic component and an electromagnetic wave shielding layer, in which the electromagnetic wave shielding sheet includes at least one of a conductive layer before thermal pressing of the electromagnetic wave reflection layer and a conductive layer before thermal pressing of the electromagnetic wave absorption layer, the conductive layer before thermal pressing of the electromagnetic wave reflection layer includes a binder resin and a conductive filler, and the conductive layer before thermal pressing of the electromagnetic wave absorption layer includes a binder resin and an electromagnetic wave absorption filler. The Young's modulus of the conductive layer at 23° C. is set to 10 to 700 MPa.Type: ApplicationFiled: April 15, 2019Publication date: August 5, 2021Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.Inventors: Kazunori MATSUDO, Ryota UMEZAWA, Kenji ANDO, Tsutomu HAYASAKA
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Publication number: 20200413576Abstract: An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.Type: ApplicationFiled: September 15, 2020Publication date: December 31, 2020Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.Inventors: Daisuke KISHI, Shota MORI, Takahiro MATSUZAWA, Tsutomu HAYASAKA
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Patent number: 10820457Abstract: An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.Type: GrantFiled: November 4, 2019Date of Patent: October 27, 2020Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.Inventors: Daisuke Kishi, Shota Mori, Takahiro Matsuzawa, Tsutomu Hayasaka
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Patent number: 9549473Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2). The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.Type: GrantFiled: August 27, 2015Date of Patent: January 17, 2017Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.Inventors: Satoshi Nishinohara, Hidenobu Kobayashi, Kazunori Matsudo, Tsutomu Hayasaka
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Publication number: 20160270243Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2). The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.Type: ApplicationFiled: August 27, 2015Publication date: September 15, 2016Inventors: Satoshi NISHINOHARA, Hidenobu KOBAYASHI, Kazunori MATSUDO, Tsutomu HAYASAKA
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Publication number: 20160024327Abstract: The present invention provides a dispersed composition containing an ultramarine (A), a black inorganic pigment (B) (excluding carbon black), and a dispersion medium (C), wherein the weight ratio of ultramarine (A)/black inorganic pigment (B) is from 80/20 to 4.3/95.7. As a result, the invention provides a coating film and a colored item having a high surface resistivity (an antistatic effect) and resistance to overheating by sunlight, as well as a coating composition for forming this coating film and colored item, for use in fields such as black matrices for color filters and automotive coating materials.Type: ApplicationFiled: May 20, 2013Publication date: January 28, 2016Applicants: TOYO INK HOLDINGS CO., LTD., TOYOCOLOR CO., LTDInventors: Masahiro OOKAWA, Takeshi NISHINAKA, Tetsuro OIZUMI, Tsutomu HAYASAKA