Abstract: In a method for manufacturing a component incorporating module, lands for mounting components are independently formed on a transfer plate in an isolated manner, and circuit components are connected to the lands for mounting components. An insulation resin layer is formed so as to cover the circuit components on the transfer plate, and is hardened. The circuit components and the lands for mounting components are embedded in the upper resin layer. Thereafter, the transfer plate is removed from the resin layer, and wiring patterns which are used to connect between lands or connect lands to other portions are formed on a back surface of the resin layer on which the lands for mounting components are exposed.

Abstract: A component-containing module includes a module substrate having first wiring lines provided on the top surface of the module substrate, a first circuit component mounted on the first wiring lines of the module substrate, a submodule substrate having an area smaller than the area of the module substrate and mounted on the first wiring lines of the module substrate at a position at which the first circuit component is not mounted, a second circuit component mounted on second wiring lines provided on the top surface of the submodule substrate, and an insulating resin layer provided on the entire top surface of the module substrate so as to encompass the first circuit component, the second circuit component, and the submodule substrate.

Abstract: A microstrip line includes a strip conductor, a line electrode, and edge electrodes provided at the edges on both sides of the line electrode. The construction of the microstrip line greatly reduces the edge effect of the line electrode and decreases the conductor loss of the line electrode.

Abstract: A microstrip line includes a strip conductor, a line electrode, and edge electrodes provided at the edges on both sides of the line electrode. The construction of the microstrip line greatly reduces the edge effect of the line electrode and decreases the conductor loss of the line electrode.

Abstract: A dielectric substrate, a transistor, which is an active device, a varactor diode, which is a frequency-variable device, are mounted on one main surface of a package substrate to configure an oscillator. The dielectric substrate is made from a large-dielectric-constant dielectric having high temperature stability. A microstrip-line resonator is formed by thin-film-electrode forming. The microstrip-line resonator and the transistor constitute an oscillating circuit.

Abstract: PROBLEM TO BE SOLVED: To provide a voltage controlled oscillator providing a strip line resonator in the inside layer of a multilayer substrate and less in the dispersion of oscillation frequency by humidity. SOLUTION: Polytetrafluoroethylene is used as the core material of the multilayer substrate. Since the polytetrafluoroethylene has smaller water absorptivity than glass epoxy, the change of dielectricity to the change of humidity. As a result, also the change of the resonant frequency of the strip line resonator formed in the inside layer of the multilayer substrate is small, as a result, also the change of oscillation frequency becomes small. Then, since the change of the oscillation frequency is small, control voltage sensitivity can be reduced, and thus, C/N characteristics is improved.

Abstract: A microstrip line includes a strip conductor, a line electrode, and edge electrodes provided at the edges on both sides of the line electrode. The construction of the microstrip line greatly reduces the edge effect of the line electrode and decreases the conductor loss of the line electrode.

Abstract: An oscillator module in which external wires can be reduced, and characteristics of a resonator and oscillation margin can be measured. A circuit portion for oscillation and a two-port surface acoustic wave resonator are sealed in a package, one of the terminals of the two-port surface acoustic wave resonator is connected inside the package to an input terminal of the circuit portion for oscillation. The number of external terminals provided at the package is reduced, enabling the oscillator module to be made small-scale and at lower cost. Furthermore, it is possible to measure the insertion loss and resonant frequency of the two-port surface acoustic wave resonator, and the oscillation margin of the oscillator module, making it possible to improve the yield of the oscillator and reduce costs.

Abstract: An FSK modulator including an amplifier for oscillation has a surface acoustic wave resonator connected in series with a switching circuit formed without a variable-capacity diode but including a semiconductor switch and one or more fixed-capacity capacitors. When an input signal is received, the switch causes a capacitor or combination of capacitors to become connected in series with the surface acoustic wave resonator, providing oscillations with two frequencies to effect FSK modulation.