Abstract: An endoscope objective optical system comprises: a front group having a negative refractive power, a brightness diaphragm, and a back group having a positive refractive power in order from an object side, wherein the front group is composed of a first group, which is a first lens which is a single lens and a second group, which is a single lens or a cemented lens having a negative refractive power; 1<Iw/ft<1.8 0.6<Ia/Iw<0.95 |DL1/RL1a|<0.4 ?3<fL1/ft<?1 where Iw is a maximum image height in underwater observation, ft is a focal distance of an entire objective optical system in observation in the air, Ia is a maximum image height capable of transmitting a principal ray in the observation in the air, and DL1, RL1a, and fL1 are an outer diameter, a radius of curvature of an object side surface, and a focal distance, respectively of the first lens.

Abstract: In one embodiment, a magnetic resonance imaging apparatus includes an input device by which patient information including at least height and weight is inputted; a display; and processing circuitry configured to calculate a BMI (Body Mass Index) indicated by weight (kg)/{height (m)}2 based on the height and weight, determine whether the BMI is within a range of a predetermined threshold value or not; and cause the display to display an alarm when the BMI is not within the range of a predetermined threshold value.

Abstract: An image diagnostic apparatus includes an examination information acquisition unit and an imaging unit. The examination information acquisition unit searches a medical image server based on patient information to acquire past examination information corresponding to the patient information automatically from the medical image server. The imaging unit performs imaging according to an imaging condition set by referring to the examination information. Alternatively, an image diagnostic apparatus includes an imaging condition setting unit and an imaging unit. The imaging condition setting unit automatically sets or indicates an imaging condition closest to information designating an imaging condition included in examination order information directed to an image diagnostic apparatus made by another maker or a different type of an image diagnostic apparatus made by a same maker. The imaging unit performs imaging according to the set or indicated imaging condition.

Abstract: An endoscope objective optical system comprises: a front group having a negative refractive power, a brightness diaphragm, and a back group having a positive refractive power in order from an object side, wherein the front group is composed of a first group, which is a first lens which is a single lens and a second group, which is a single lens or a cemented lens having a negative refractive power; 1<Iw/ft<1.8 0.6<Ia/Iw<0.95 |DL1/RL1a|<0.4 ?3<fL1/ft<?1 where Iw is a maximum image height in underwater observation, ft is a focal distance of an entire objective optical system in observation in the air, Ia is a maximum image height capable of transmitting a principal ray in the observation in the air, and DL1, RL1a, and fL1 are an outer diameter, a radius of curvature of an object side surface, and a focal distance, respectively of the first lens.

Abstract: According to one embodiment, a medical image processing apparatus includes an image acquisition part and a display processing part. The image acquisition part is configured to acquire plural series, each consisting of frames of medical image data corresponding to at least one of slice positions and time phases. The display processing part is configured to perform display processing to display image data in a region of interest of at least one frame of first medical image data belonging to a first series out of the plural series. The image data in the region of the interest are overlapped with a region of at least one frame of second medical image data belonging to another series. The region of the at least one frame of the second medical image data is different from a region corresponding to the region of the interest.

Abstract: Provided is an endoscope objective optical system 1 including, in order from an object side, a first lens 2 composed of a negative single lens, a second lens 3 composed of a positive single lens, an aperture stop 4, a third lens 5 composed of a positive single lens, and a fourth lens 6 composed of a positive combined lens, wherein the third lens 5 has a meniscus shape having a convex surface facing the image side. The endoscope objective optical system (1) satisfies the following conditions: 0.3<Df/f<1.15,??(1) n1<1.79,??(2) n2>n1,??(3) 0.6<IH/f<0.83,??(4) and |r1|?|r2|+d1>1.

Abstract: Provided is an endoscope objective optical system 1 including, in order from an object side, a first lens 2 composed of a negative single lens, a second lens 3 composed of a positive single lens, an aperture stop 4, a third lens 5 composed of a positive single lens, and a fourth lens 6 composed of a positive combined lens, wherein the third lens 5 has a meniscus shape having a convex surface facing the image side. The endoscope objective optical system (1) satisfies the following conditions: (1) 0.3<Df/f<1.15, (2) n1<1.79, (3) n2>n1, (4) 0.6<IH/f<0.83, and (5) |r1|?|r2|+d1>1.

Abstract: An endoscope objective optical system includes, in order from an object side, a first lens composed of a negative single lens, a second lens composed of a positive single lens, an aperture stop, a third lens composed of a positive single lens, and a fourth lens composed of a positive combined lens, the third lens having a meniscus shape having a convex surface facing the image side. The endoscope objective optical system satisfies the following conditions: 0.3<Df/f<1.15,??(1) n1<1.79,??(2) n2>n1,??(3) 0.6<IH/f<0.83,??(4) and |r1|?|r2|+d1>1.8??(5) Df is the distance from a surface of the first lens facing the object side to the aperture stop, f is the focal length of the entire system, IH is the maximum image height of the entire system, and d1 is the center thickness of the third lens.

Abstract: A semiconductor device includes a semiconductor chip, and a guard ring made of an electrically conductive material and arranged between electrodes on the semiconductor chip and side edges of the semiconductor chip, the guard ring being divided by isolating sections on the semiconductor chip.

Abstract: According to one embodiment, an image diagnostic apparatus includes an examination information acquisition unit and an imaging unit. The examination information acquisition unit searches a medical image server based on patient information to acquire past examination information corresponding to the patient information automatically from the medical image server. The imaging unit performs imaging according to an imaging condition set by referring to the examination information. Alternatively, according to one embodiment, an image diagnostic apparatus includes an imaging condition setting unit and an imaging unit. The imaging condition setting unit automatically sets or indicates an imaging condition closest to information designating an imaging condition included in examination order information directed to an image diagnostic apparatus made by another maker or a different type of an image diagnostic apparatus made by a same maker.

Abstract: A semiconductor device includes a semiconductor layer, an electrode pad that is composed of Au and is provided on the semiconductor layer, a silicon nitride film provided on the semiconductor layer and the electrode pad so that an end portion of the silicon nitride film is located, and a metal layer that contacts a part of a surface of the electrode pad and the end portion of the silicon nitride film and is provided so that another part of the surface of the electrode pad is exposed, the metal layer including any of Ti, Ta and Pt.

Abstract: A semiconductor device includes: a semiconductor layer composed of one of GaAs based semiconductor, InP-based semiconductor, and GaN-based semiconductor; a first silicon nitride film that is provided on the semiconductor layer, and of which an end portion is in contact with a surface of the semiconductor layer; a protective film that is composed of one of polyimide and benzocyclobutene, and is provided on the semiconductor layer and the first silicon nitride film, the protective film covering the end portion of the first silicon nitride film; and a first metallic layer that is composed of one of titanium, tantalum and platinum, and is continuously provided from a first portion located between the semiconductor layer and the protective film to a second portion located between the end portion of the first silicon nitride film and the protective film, the first metallic layer being in contact with the surface of the semiconductor layer and a surface of the end portion of the first silicon nitride film.

Abstract: A semiconductor device includes a semiconductor chip, and a guard ring made of an electrically conductive material and arranged between electrodes on the semiconductor chip and side edges of the semiconductor chip, the guard ring being divided by isolating sections on the semiconductor chip.

Abstract: A semiconductor device includes: a semiconductor layer composed of one of GaAs based semiconductor, InP-based semiconductor, and GaN-based semiconductor; a first silicon nitride film that is provided on the semiconductor layer, and of which an end portion is in contact with a surface of the semiconductor layer; a protective film that is composed of one of polyimide and benzocyclobutene, and is provided on the semiconductor layer and the first silicon nitride film, the protective film covering the end portion of the first silicon nitride film; and a first metallic layer that is composed of one of titanium, tantalum and platinum, and is continuously provided from a first portion located between the semiconductor layer and the protective film to a second portion located between the end portion of the first silicon nitride film and the protective film, the first metallic layer being in contact with the surface of the semiconductor layer and a surface of the end portion of the first silicon nitride film.

Abstract: A semiconductor device includes a semiconductor layer, an electrode pad that is composed of Au and is provided on the semiconductor layer, a silicon nitride film provided on the semiconductor layer and the electrode pad so that an end portion of the silicon nitride film is located, and a metal layer that contacts a part of a surface of the electrode pad and the end portion of the silicon nitride film and is provided so that another part of the surface of the electrode pad is exposed, the metal layer including any of Ti, Ta and Pt.

Abstract: An objective optical system for endoscopes has, in order form the object side, a single lens with negative power, a cemented lens with positive power, and an image sensor unit. The cemented lens has a plano-convex lens, located at the image-side end, with a convex surface facing the image side and an aperture stop placed proximate to a cemented portion and the image sensor unit includes an optically cemented body of at least one optical part, a path bending prism, and a solid-state image sensor to satisfy the following conditions: 1.5<TB/f<3.5 2.4<TC/f<4 where f is the focal length of the whole of the objective optical system, TB is the optical path length of the cemented lens, and TC is the optical path length of the image sensor unit.

Abstract: An endoscope observation optical system capable of improving the observation resolution of a mucous membrane of a living body is provided. The endoscope includes an observation optical system compatible with both standard visible-light observation and blood-vessel-enhancement observation, whose main component of a displayed image is an absorption peak of hemoglobin present in a waveband lower than 480 nm, wherein some longitudinal chromatic aberration remains in the endoscope observation optical system due to undercorrection at a wavelength of 415 nm, and wherein the focal position during blood-vessel-enhancement observation is set closer to a near point than the focal position during standard visible-light observation.

Abstract: An objective optical system for endoscopes has, in order form the object side, a single lens with negative power, a cemented lens with positive power, and an image sensor unit. The cemented lens has a plano-convex lens, located at the image-side end, with a convex surface facing the image side and an aperture stop placed proximate to a cemented portion and the image sensor unit includes an optically cemented body of at least one optical part, a path bending prism, and a solid-state image sensor to satisfy the following conditions: 1.5<TB/f<3.5 2.4<TC/f<4 where f is the focal length of the whole of the objective optical system, TB is the optical path length of the cemented lens, and TC is the optical path length of the image sensor unit.

Abstract: An objective optical system is disclosed that is suitable for a high-precision endoscope that performs focusing by moving a single lens component. The objective optical system includes, in order from the object side, a front lens group, a middle lens group, and a rear lens group. The middle lens group is composed of two or more lens components, at least two of which have positive refractive power, and the lens component that is moved for focusing is in the middle lens group. Additionally, the objective optical system satisfies two specified conditions, and other conditions may apply.

Abstract: An objective optical system is disclosed that is suitable for a high-precision endoscope that performs focusing by moving a single lens component. The objective optical system includes, in order from the object side, a front lens group, a middle lens group, and a rear lens group. The middle lens group is composed of two or more lens components, at least two of which have positive refractive power, and the lens component that is moved for focusing is in the middle lens group. Additionally, the objective optical system satisfies two specified conditions, and other conditions may apply.