Abstract: A floating chassis support mechanism is provided which can thin a disc reproduction apparatus. In the floating chassis support mechanism for a disc reproduction apparatus for supporting a floating chassis with springs and dampers vertically from the opposite side of a loaded disc, the damper is disposed outside of a projection area of the disc, and an area of the floating chassis supported by the dampers is retracted towards the disc side more than a lower surface of the disc.

Abstract: A disc clamp mechanism for a disc apparatus is provided. In the disc clamp mechanism, a disc is clamped or unclamped by moving a clamper holding chassis near to or remote from a turntable, the clamper holding chassis holding a clamper with a clamper holder, and a contact portion of the clamper holder with the clamper is deformed relative to the clamper holding chassis along a motion direction of the clamper holding chassis. A large space can be formed between the clamper and a turntable in a disc unclamp state to prevent the disc from becoming in contact with the clamper or turntable and being damaged while the disc is transported. A stroke of the clamper holding chassis necessary for reserving the space is made small to make a disc apparatus compact.

Abstract: A floating chassis support mechanism is provided which can thin a disc reproduction apparatus. In the floating chassis support mechanism for a disc reproduction apparatus for supporting a floating chassis with springs and dampers vertically from the opposite side of a loaded disc, the damper is disposed outside of a projection area of the disc, and an area of the floating chassis supported by the dampers is retracted towards the disc side more than a lower surface of the disc.

Abstract: A recording and reproducing apparatus has a communicating unit, a reading unit, a storing unit, a control unit, and an output unit. The communicating unit transmits and receives data to/from an information center in which a plurality of additional information has been stored. The reading unit reads out recorded data from a recording medium on which a plurality of data and index data relating to the plurality of data have been recorded. The data read out from the recording medium by the reading unit is stored in the storing unit. The control unit reads out the additional information corresponding to the recording medium from which the data is read out by the reading unit from the information center by the communicating unit and writes the read-out additional information into the storing unit as additional data of the recording medium which is read out by the reading unit. The output unit outputs the data stored in the storing unit and the additional data.

Abstract: When recording operation is stopped due to, for example, unexpected interruption of electric power supply in the course of the recording operation on a real time basis, a technique of repairing a moving picture and sound data recorded on a recording medium until the recording is stopped, to thereby restore management information data which enables random access and special reproduction is provided. A video/audio/management information multiplexing means is so implemented as to generate data required for generating management information data for allowing random access to the recording medium and effectuating special reproduction of the recording medium, for thereby multiplexing the data required for generating the management information data, encoded video data outputted from a video encoding means and encoded audio data outputted from an audio encoding means.

Abstract: When recording operation is stopped due to, for example, unexpected interruption of electric power supply in the course of the recording operation on a real time basis, a technique of repairing a moving picture and sound data recorded on a recording medium until the recording is stopped, to thereby restore management information data which enables random access and special reproduction is provided. A video/audio/management information multiplexing means is so implemented as to generate data required for generating management information data for allowing random access to the recording medium and effectuating special reproduction of the recording medium, for thereby multiplexing the data required for generating the management information data, encoded video data outputted from a video encoding means and encoded audio data outputted from an audio encoding means.

Abstract: A thin-film multilayer wiring board with first and second metallic wiring layers formed on a substrate and an organic insulating layer interposed between the metallic wiring layers. The insulating layer has the first metallic wiring layer and via holes in a thickness of the insulating layer. The lands of the first and second metallic wiring layers are electrically connected by via studs which are made of a conductive metal filled in the via holes.

Abstract: A novel method is provided for joining substrates made of aluminum nitride series ceramics to each other, which can perform the joining substantially without leaving an intervening third phase other than aluminum nitride series ceramics at the joining interface of the substrates. The method is performed, for example, by providing a joining agent 3 containing at least an aluminum nitride series ceramics and a flux between the substrates 1 and 2, heat treating the joining agent to eutectically melt the aluminum nitride series ceramics and the flux, then precipitating a reprecipitated phase of the aluminum nitride series ceramics at the joining interface of the substrates.

Abstract: A method for verifying the design of piezoelectric devices includes expressing attributes of such piezoelectric device or subsystem thereof in terms of an elastic property or properties of a different subsystem or device component of the piezoelectric device. Such piezoelectric device may include a layer of piezoelectric material and one or more electrodes affixed to one or more faces of such layer. Computational complexity of models of the design are reduced by modeling displacement of the electrodes as being equal to displacement of the layer of piezoelectric material during operation of such piezoelectric device. Further reduction in computational complexity is achieved by modeling electrode displacement as being uniform within each electrode. Stress in the piezoelectric device or subsystem thereof is expressed in terms of elastic properties of a different subsystem of the piezoelectric device.

Abstract: A multi-pin connector has contact pins fixedly soldered into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in a desired form without a housing. The multi-pin connector can be manufactured in a short period of time and can have any pitch, any number of pins and any shape.

Abstract: A thin-film multilayer wiring board comprising a first and a second metallic wiring layers formed on a substrate with an organic insulating layer interposed between the metallic wiring layers, wherein the lands of the first and second metallic wiring layers are electrically connected by via studs made of a conductive metal filler formed by electroless plating, and the difference between the top end diameter and the base diameter of each via stud is 10% or less, or the angle made by the taper of the interface between the insulating layer and each via stud against the axis thereof is 5° or less, can provide a high wiring density and signal transmission performance.

Abstract: A multi-pin connector for mounting other boards or electronic parts on a main board, has contact pins fixedly soldered into bottomed connection holes which are in desired positions on the main board, so that the contact pins are secured separately and arrayed in a desired form without a housing. The contact pins have contact portions and pin portions, with the pin portions being secured in the connection holes.

Abstract: A circuit board is provided with blind connection vias which are filled with solder. The end portions of the pins of an electronic component are inserted into the connection vias, and are connected to the connection vias by solder. The electronic component is surface mounted on the circuit board with the major portions of the pins exposed.

Abstract: A multilayer circuit substrate with a circuit repairing function which has a circuit substrate having a circuit pattern and repair pattern on the inner layer via an inter-substrate insulation film and having circuit repairing areas for cutting and bonding the circuit on these patterns, a terminal bonding pad for bonding electronic circuit parts mounted on this substrate, and a conductive via hole for bonding said circuit pattern to the terminal bonding pad, wherein at least the circuit repairing area of the repair pattern and at least the circuit repairing area of said circuit pattern which are set on said inner layer are brought close to each other and positioned on the same plane.

Abstract: Ends of contact pins are inserted into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in the desired form. By effecting solder reflow in this state, the contact pins are fixedly soldered to the connection holes. A multi-pin connector is thus provided, which can be manufactured with ease in a short period of time and which can have any pitch, any number of pins and any shape.

Abstract: A high-density multilayer printed circuit board is provided such that crosstalk noise between through holes is avoided and wiring efficiency is increased. Power supply through holes which connect to power supply pins of component parts are combined to make room for via holes in certain portions of the multilayer printed circuit board. These power supply through holes are subsequently restored into their original form. This permits via holes to exist at certain locations so that certain wiring layers can be interconnected. Additionally, by restoring the power supply through holes, crosstalk noise is reduced as the rear side of the multilayer printed circuit board is approached. Finally, dummy power supply lines can be provided to further reduce crosstalk noise. These dummy power supply lines are not connected to power supply pins of the component parts.

Abstract: A curing composition for reinforcing an inorganic oxide material or a flawable base is disclosed. The composition comprises a curing compound emulsified and dispersed in water with or without the aid of an emulsifier or a water-soluble high polymer. The composition has excellent preservation stability and is free from the risk of fire or environmental pollution. The process for reinforcing an inorganic oxide material or a flawable base using the composition is also disclosed.

Abstract: A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.

Abstract: A thread cutting device for a sewing machine includes a stationary blade which is disposed downwardly of a needle plate and a movable blade. The stationary blade is provided at its one end with a cutting edge. The movable blade which is formed with a cutout in the surface opposite to the stationary blade, is adapted to rotate about a shaft and pass over the needle plate and the stationary blade. The cutout is adapted to catch and guide a thread along a path for the thread and provided with a cutting edge to cooperate with the cutting edge of the stationary blade to cut the thread. A through hole is formed between the cutout and the cutting edge of the movable blade to meander the thread through the hole.

Abstract: A through hole is formed by a drill in a defective through hole in a board. An insulating resin is coated on the inner surface of the through hole and a cylindrical conductor is closely fixed with an adhesive to the hole h1 to form a reproduced through hole. Thereafter, as usual, a part lead is inserted into and soldered in the reproduced through hole to thereby recover the connection of the lead with the wiring circuit copper foil impaired by the recovering operation of the defective through hole using an external lead.