Abstract: A measurement tool includes: a measurement tool body including a sample collection unit for collecting a liquid sample by a capillary phenomenon, and a liquid feed channel; and a lid body attachable to and detachable from the measurement tool body. The liquid feed channel includes an upstream side channel and a downstream side channel. A space is defined, into which an upstream side end of the sample collection unit and a downstream side end of the upstream side channel open, when the lid body is attached to the measurement tool body. The downstream side channel is connected to a downstream side end of the sample collection unit. The space is open when the lid body is separated from the measurement tool body, and the space is closed and the upstream side channel and the sample collection unit are connected when the lid body is attached to the measurement tool body.

Abstract: There is provided an optical filter capable of effectively transmitting ultraviolet light in a wavelength range from 220 nm to 225 nm while suppressing the transmission of ultraviolet light in a wavelength range from 240 nm to 320 nm. An optical filter 1 includes a transparent substrate 2 and a dielectric multilayer film 3 provided on the transparent substrate 2 and containing hafnium oxide. A minimum value of spectral transmittance in a wavelength range from 220 nm to 225 nm is 50% or more with an incident angle of 0 degrees, and a maximum value of spectral transmittance in a wavelength range from 240 nm to 320 nm is 5% or less with an incident angle of 0 degrees.

Abstract: A dielectric multilayer film-incorporated glass plate is disclosed that includes a glass plate and a dielectric multilayer film. The glass plate includes a corner surface located between at least one main surface and a side surface. The dielectric multilayer film includes a main surface covering portion that covers the main surface of the glass plate and a corner surface covering portion that covers the corner surface of the glass plate.

Abstract: Provided are: a band-pass filter for which filter characteristics can be improved; and a manufacturing method therefor. A band-pass filter 11, which allows light of a specific wavelength region to pass, includes: a substrate 12 which has light transmitting properties; a first dielectric multilayer film 13 that is provided on a first main surface S1 of the substrate 12; and a second dielectric multilayer film 14 that is provided on a second main surface S2 which is opposite the first main surface S1. The first dielectric multilayer film 13 contains a hydrogenated silicon layer. The second dielectric multilayer film 14 contains a hydrogenated silicon layer.

Abstract: A dielectric multilayer film-incorporated glass plate is disclosed that includes a glass plate and a dielectric multilayer film. The glass plate includes a corner surface located between at least one main surface and a side surface. The dielectric multilayer film includes a main surface covering portion that covers the main surface of the glass plate and a corner surface covering portion that covers the corner surface of the glass plate.

Abstract: Provided is a cover member for an exhibit or display element which makes an exhibit or display element visible as if nothing existed between the exhibit or display element and the viewer and can protect the exhibit or display element. The cover member (3) for an exhibit or display element includes a transparent substrate (31a) and an antireflection film (31b) formed on at least one surface of the transparent substrate. The cover member (3) for an exhibit or display element has a luminous reflectance of 0.5% or less.

Abstract: Provided is a cover member for an exhibit or display element which makes an exhibit or display element visible as if nothing existed between the exhibit or display element and the viewer and can protect the exhibit or display element. The cover member (3) for an exhibit or display element includes a transparent substrate (31a) and an antireflection film (31b) formed on at least one surface of the transparent substrate. The cover member (3) for an exhibit or display element has a luminous reflectance of 0.5% or less.

Abstract: The invention provides a manufacturing method for a glass substrate with a thin film, which allows easy manufacturing of a less warped glass substrate with a thin film. The method performs: a deformation step of plastically deforming a glass substrate 10 to give a principal surface 10a thereof a curved shape so that the principal surface 10a of the glass substrate 10 is flattened in the final state after the formation of the thin film; and a thin film formation step of forming a thin film 11 on the principal surface 10a of the plastically deformed glass substrate 10.

Abstract: A substrate is made of a crystallized glass having translucency and an average linear thermal expansion coefficient of ?5×10?7/° C. at 30 to 500° C. The substrate has a first surface (working surface) of a smooth surface having a surface roughness Rmax of less than 0.5 ?m, and a second surface (non-working surface) of a rough surface having a surface roughness Rmax of 4 ?m. A light shielding layer consisting of a light shielding film and an antioxidant film is formed on the second surface of the substrate through sputtering.

Abstract: A substrate is made of a crystallized glass having translucency and an average linear thermal expansion coefficient of ?5×10?7/° C. at 30 to 500° C. The substrate has a first surface (working surface) of a smooth surface having a surface roughness Rmax of less than 0.5 ?m, and a second surface (non-working surface) of a rough surface having a surface roughness Rmax of 4 ?m. A light shielding layer consisting of a light shielding film and an antioxidant film is formed on the second surface of the substrate through sputtering.

Abstract: A substrate is made of a crystallized glass having translucency and an average linear thermal expansion coefficient of ?5×10?7/° C. at 30 to 500° C. The substrate has a first surface (working surface) of a smooth surface having a surface roughness Rmax of less than 0.5 ?m, and a second surface (non-working surface) of a rough surface having a surface roughness Rmax of 4 ?m. A light shielding layer consisting of a light shielding film and an antioxidant film is formed on the second surface of the substrate through sputtering.

Abstract: A substrate is made of a crystallized glass having translucency and an average linear thermal expansion coefficient of ?5×10?7/° C. at 30 to 500° C. The substrate has a first surface (working surface) of a smooth surface having a surface roughness Rmax of less than 0.5 ?m, and a second surface (non-working surface) of a rough surface having a surface roughness Rmax of 4 ?m. A light shielding layer consisting of a light shielding film and an antioxidant film is formed on the second surface of the substrate through sputtering.

Abstract: A glass article which comprises a transparent heat-resistant glass sheet and a light-shielding layer on the surface thereof, wherein an average visible light transmittance at a wavelength of 380-780 nm of the glass article is 0.03-15%; and an average infrared reflectance at a wavelength of 1000-2500 nm of the glass article is at least 50%.

Abstract: In a cathode ray tube us a glass panel having a difference in thickness between a central region and a peripheral region of a face portion, the glass panel having an outer surface with a colored film formed thereon, the colored film being thin in film thickness in an area corresponding to a thick part of the face portion of the glass panel and thick in film thickness in an area corresponding to a thin part of the face portion of the glass panel so as to reduce the difference in transmittance resulting from the difference in thickness between the central region and the peripheral region of the face portion of the glass panel. As another embodiment, the colored film comprises a film having a light color tone in an area corresponding to a thick part of the face portion of the glass panel and a dark color tone in an area corresponding to a thin part of the face portion of the glass panel.

Abstract: A method of making a catalytic converter for an automotive internal combustion engine comprises a cylindrical honeycomb catalyst carrier made of a ceramic and carrying a catalytic material. The catalyst carrier is encased within a cylindrical container upon being axially supported at its opposite end faces between oppositely disposed annular metal caps through cushioning materials. The metal caps are fixedly secured to the inner peripheral surface of the container by plug welding. In production of the catalytic converter, the plug welding is made in a state in which the metal caps are being biased to the catalyst carrier at a predetermined pressure by a pair of pressing jigs which respectively abut the metal caps.

Abstract: An automatic machining apparatus includes a rack for storing workpieces mounted on pallets, setting stations for setting the workpieces on the pallets, processing machines for processing the workpieces according to specified processing information, and a stacker crane for transporting the workpieces on the pallets between the rack and setting stations and between the rack and processing machines. The entire apparatus is operable under control of a main controller, with the processing machines controlled by an auxiliary controller. Each pallet carries an IC card for storing information on treatment done to the workpiece mounted thereon. The main controller includes a first communicating device for writing the information on treatment into the IC card. The auxiliary controller includes a second communicating device for reading the information on treatment from the IC card.

Abstract: A plastic package type semiconductor device comprises: a die pad consisting of a plurality of parts; a tab lead consisting of a plurality of parts holding the die pad; a flat type Jumper lead formed between the parts of the die pad; an electrical insulating type insulating film formed on the die pad; a semiconductor chip bonded on the insulating film by an adhesive; and a plastic mold as a plastic package for molding the die pad, the tab lead, the flat type Jumper lead, the insulating file, and the semiconductor device in the plastic mold, whereby the semiconductor chip is Insulated electrically from the die pad. In addition, a SOJ plastic package type semiconductor device has a configuration without the Jumper lead described above.