Abstract: A power supply circuit module includes a power supply circuit including a lower substrate, an upper substrate parallel or substantially parallel to the lower substrate, an inductor, and chip components mounted on the lower substrate, switching circuit components and chip components mounted on the upper substrate, and substrate connectors that connect the lower substrate with the upper substrate electrically and mechanically. A portion of the substrate connectors is an inductor configuring portion of the power supply circuit or a portion of an inductor configuring portion of the power supply circuit.

Abstract: An inductor element includes a magnetic body core provided with a through-hole, and a coil inserted through the through-hole and wound around the magnetic body core a plurality of times. The coil includes three bonding portions located on one side in a thickness direction of the magnetic body core. The three bonding portions are located on a first virtual plane that partially intersects with the coil.

Abstract: A circuit module has a circuit board on which electronic components are mounted and a covering member which has a plate portion and one or more supporting portions. The supporting portions fix the plate portion parallel to the surface of the circuit board. The covering member can be chucked by a chucking device to mount the circuit module to a mother circuit board.

Abstract: To prevent a substrate for mounting electronic components from being damaged when cores are rubbed together during assembly, a pair of core members sandwich a part of a coil pattern formed on the substrate from the top and bottom sides of the substrate, and the core members are held together by a core-combining member. A cover member is fixed to the substrate to cover the upper side of the core-combining member. Inclined ribs on the cover member raise the core-combining member by abutting against external inclined fates of leg portions of the core-combining member. A clearance thereby is formed between internal faces of a top bar portion of each core member and a surface of the substrate.

Abstract: In order to prevent a substrate for mounting electronic components from being damaged when cores are rubbed together during assembly, a pair of core members are respectively arranged so as to sandwich a part of a coil pattern formed on the substrate from the top and bottom sides of the substrate, and the core members are held together by a core-combining member. A cover member is arranged and fixed to the substrate so as to cover the upper side of the core-combining member. Inclined ribs on the cover member raise the core-combining member by abutting against external inclined faces of leg portions of the core-combining member so as to apply a raising force. A clearance thereby is formed between internal faces of a top bar portion of each core member and a surface of the substrate. When sliding the core member, the surface of the substrate is not contacted by the core member so as not to be damaged.

Abstract: A circuit module has a covering member which has a plate portion and one or more supporting portions and a circuit board on which electronic components are mounted. The supporting portions fix the plate portion parallel to the surface of the circuit board. The covering member can be chucked by a chucking device to mount the circuit module to a mother circuit board.

Abstract: A reference electrode is fixed on the bottom of a concave portion of a substrate. A movable electrode is provided so that its electrode face faces that of the reference electrode at an interval to form a capacitor by the movable and reference electrodes. A driving electrode for driving the movable electrode is fixed on the substrate at an interval from the movable electrode. The distance 2L between the driving and movable electrodes is twice the distance L between the movable and reference electrodes. An external bias voltage is applied between the driving and movable electrodes to deflect the movable electrode. This doubles the range of the displacement of the movable electrode, thereby increasing the capacity change rate of the variable capacitor.