Patents by Inventor Tsutomu Kakimoto

Tsutomu Kakimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 6120301
    Abstract: In the BGA in which the bonding portions of the support frame bonded to the wiring substrate via adhesive layer are molded by a resin, the areas of the bonding portions are each selected to be from 0.5 to 3.1 mm.sup.2. Furthermore, holes are formed in the substrate under the frame corresponding to the bonding portions.
    Type: Grant
    Filed: July 24, 1996
    Date of Patent: September 19, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Masahiro Ichitani, Ryo Haruta, Katsuyuki Matsumoto, Arata Kinjyo, Tsutomu Kakimoto