Patents by Inventor Tsutomu Kitajima

Tsutomu Kitajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220394856
    Abstract: A flexible printed circuit board including a terminal includes a flexible printed circuit board that includes an electrically conductive line and the terminal soldered to the flexible printed circuit board. The flexible printed circuit board includes a land and a soldering restricting section. The land is electrically connected to the electrically conductive line and has a metal surface and is soldered to the terminal. The soldering restricting section has a non-metal surface and is not soldered to the terminal. The terminal includes an overlapping section and a protrusion section. The overlapping section overlaps the land and is soldered to the land and includes a removed section that is formed in such a manner that a portion is partially removed in a predefined area. The protruding section is continuous from the overlapping section and protrudes to an area that does not overlap the flexible printed circuit board.
    Type: Application
    Filed: September 7, 2020
    Publication date: December 8, 2022
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Tsutomu KITAJIMA, Yoshiro ADACHI, Yuuki OOHASHI, Manabu SUDOU
  • Publication number: 20220394855
    Abstract: A flexible printed circuit board includes an electrically conductive line and a land that is connected to the electrically conductive line and to be connected to a terminal. The land includes soldering portions that have metal surfaces and to which the terminal is to be soldered. A dividing section is between the soldering portions and the dividing section has a non-metal surface and defines each of the soldering portions that are adjacent to each other.
    Type: Application
    Filed: September 7, 2020
    Publication date: December 8, 2022
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Tsutomu KITAJIMA, Yoshiro ADACHI, Yuuki OOHASHI, Manabu SUDOU
  • Patent number: D258289
    Type: Grant
    Filed: October 13, 1978
    Date of Patent: February 17, 1981
    Assignee: Toshiba Photo Products Co., Ltd.
    Inventor: Tsutomu Kitajima