Patents by Inventor Tsutomu Kiyono

Tsutomu Kiyono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088089
    Abstract: A wire bonding device for bonding a wire to a target includes: a prediction part which predicts, based on time-series data of a diagnosis result regarding an operation of the wire bonding device, a transition of a change from the diagnosis result in an initial state; and a setting part which sets a time point at which the prediction part predicts that an amount of change from the diagnosis result in the initial state reaches a first threshold value as a time point for performing maintenance of the wire bonding device. The wire bonding device allows the maintenance to be performed suitably.
    Type: Application
    Filed: May 24, 2021
    Publication date: March 14, 2024
    Applicant: SHINKAWA LTD.
    Inventor: Tsutomu KIYONO
  • Patent number: 7405353
    Abstract: A high-precision input device which has less delay in signal transmission and can sense a plurality of input signals is provided. This input device includes a planar first input area and a second input area annularly formed around the periphery of the first input area. The input device outputs different signals when beating inputs are applied to the input areas. The surface of the first input area is almost entirely covered by a sheet-like first input sensor that is divided into left-side and right-side sensors. A plurality of second input sensors are arranged annularly in the second input area and they are connected to a conductive section. The conductive section is connected to a plurality of bypass members provided for the second input sensors so that the input device is provided with a plurality of paths for transmitting signals from each of the second input sensors.
    Type: Grant
    Filed: August 4, 2003
    Date of Patent: July 29, 2008
    Assignee: Namco Bandai Games Inc.
    Inventors: Tsutomu Kiyono, Masatoshi Takai, Masuya Oishi
  • Publication number: 20040159223
    Abstract: A high-precision input device which has less delay in signal transmission and can pick up a plurality of input signals is provided. This input device includes a planar first input area (30) in a predetermined region and a second input area (32) annularly formed around the periphery of the first input area (30). The input device outputs different signals when beating inputs are applied to the first and second input areas (30 and 32). The first input area (32) includes a sheet-like first input sensor (36) which is formed over the almost entire surface of the first input area. This first input sensor (36) is divided into left-side and right-side first input sensors (36a and 36b). The second input area (32) includes a plurality of second input sensors (38) which are annularly arranged in the second input area (32). The plurality of second input sensors (38) are connected to a conductive section (40).
    Type: Application
    Filed: August 4, 2003
    Publication date: August 19, 2004
    Applicant: NAMCO LTD.
    Inventors: Tsutomu Kiyono, Masatoshi Takai, Masuya Oishi
  • Patent number: D519569
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: April 25, 2006
    Assignee: Namco Inc.
    Inventors: Tsutomu Kiyono, Masatoshi Takai, Masuya Oishi, Toru Yano