Patents by Inventor Tsutomu Miyagawa
Tsutomu Miyagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7175405Abstract: A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by the fixed platen; a movable die being held by the movable platen; an open-close mechanism including a screw shaft connected to the movable platen, the open-close mechanism turning the screw shaft so as to move the movable die to and away from the fixed die, whereby the dies can be opened and closed. The fixed die can be taken out from the fixed platen in the direction crossing the open-close direction of the movable die.Type: GrantFiled: November 27, 2002Date of Patent: February 13, 2007Assignee: Apic Yamada CorporationInventors: Kazuhiko Kobayashi, Tsutomu Miyagawa, Tomokazu Asakura, Shusaku Tagami, Hideaki Nakazawa, Naoya Gotoh
-
Patent number: 6814556Abstract: The resin molding machine is capable of executing many functions and easily expanding and modifying the structure. In the resin molding machine, a loader and an unloader are moved on common rail sections so as to convey a work piece and a molded product. An additional rail unit has a rail section, on which the loader and the unloader can be moved. The additional rail unit is detachably attached between a work piece feeding unit and a product accommodating unit. The common rail sections and the rail section of the additional rail unit are disconnectably connected.Type: GrantFiled: April 20, 2001Date of Patent: November 9, 2004Assignee: Apic Yamada CorporationInventors: Junji Hirano, Tsutomu Miyagawa, Tomio Katsuie, Yasuhiko Miyashita
-
Patent number: 6743389Abstract: The resin molding machine and a method of resin molding of the present invention are capable of securely and efficiently mold a work piece, on which a plurality of elements are arranged. The resin molding machine comprises: a lower die on which a work piece to be molded is set; an upper die clamping the work piece with the lower die; a clamper being provided to the upper die, the clamper enclosing a resin molding space of the upper die, the clamper being capable of vertically moving in the upper die and always biased downward, wherein a lower end of the clamper is downwardly projected from a resin molding face of the upper die when the lower die and upper die are opened; and a release film feeding mechanism feeding release film, which is easily peelable from the upper die and resin for molding, so as to cover the rein molding space.Type: GrantFiled: October 5, 2001Date of Patent: June 1, 2004Assignee: Apic Yamada CorporationInventors: Fumio Miyajima, Kunihiro Aoki, Tsutomu Miyagawa, Hideaki Nakazawa
-
Publication number: 20030102587Abstract: The compression molding machine is capable of maintaining dies parallel, precisely clamping work pieces and improving quality of molded products and productivity.Type: ApplicationFiled: November 27, 2002Publication date: June 5, 2003Inventors: Kazuhiko Kobayashi, Tsutomu Miyagawa, Tomokazu Asakura, Shusaku Tagami, Hideaki Nakazawa, Naoya Gotoh
-
Patent number: 6459159Abstract: A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a transfer molding process, the method being characterized in that when the molded piece 40 is clamped with a mold of a transfer molding machine, the perimeter of the underfilled portion, except the end of a gate continuous to the underfilled portion, is closed with a release film 20, and in a state that the perimeter of the underfilled portion is closed, the sealing resin 14 having been supplied to a pot 42 provided in the mold is fed under pressure to the underfilled portion, to thereby fill the underfilled portion.Type: GrantFiled: August 30, 2000Date of Patent: October 1, 2002Assignee: Apic Yamada CorporationInventors: Tsutomu Miyagawa, Kunihiro Aoki, Masahiro Kodama, Fumio Miyajima
-
Publication number: 20020015748Abstract: The resin molding machine and a method of resin molding of the present invention are capable of securely and efficiently mold a work piece, on which a plurality of elements are arranged. The resin molding machine comprises: a lower die on which a work piece to be molded is set; an upper die clamping the work piece with the lower die; a clamper being provided to the upper die, the clamper enclosing a resin molding space of the upper die, the clamper being capable of vertically moving in the upper die and always biased downward, wherein a lower end of the clamper is downwardly projected from a resin molding face of the upper die when the lower die and upper die are opened; and a release film feeding mechanism feeding release film, which is easily peelable from the upper die and resin for molding, so as to cover the rein molding space.Type: ApplicationFiled: October 5, 2001Publication date: February 7, 2002Inventors: Fumio Miyajima, Kunihiro Aoki, Tsutomu Miyagawa, Hideaki Nakazawa
-
Publication number: 20010033876Abstract: The resin molding machine is capable of executing many functions and easily expanding and modifying the structure. In the resin molding machine, a loader and an unloader are moved on common rail sections so as to convey a work piece and a molded product. An additional rail unit has a rail section, on which the loader and the unloader can be moved. The additional rail unit is detachably attached between a work piece feeding unit and a product accommodating unit. The common rail sections and the rail section of the additional rail unit are disconnectably connected.Type: ApplicationFiled: April 20, 2001Publication date: October 25, 2001Inventors: Junji Hirano, Tsutomu Miyagawa, Tomio Katsuie, Yasuhiko Miyashita
-
Patent number: 6261501Abstract: A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a transfer molding process, the method being characterized in that when the molded piece 40 is clamped with a mold of a transfer molding machine, the perimeter of the underfilled portion, except the end of a gate continuous to the underfilled portion, is closed with a release film 20, and in a state that the perimeter of the underfilled portion is closed, the sealing resin 14 having been supplied to a pot 42 provided in the mold is fed under pressure to the underfilled portion, to thereby fill the underfilled portion.Type: GrantFiled: January 22, 1999Date of Patent: July 17, 2001Assignee: Apic Yamada CorporationInventors: Tsutomu Miyagawa, Kunihiro Aoki, Masahiro Kodama, Fumio Miyajima
-
Patent number: 5520491Abstract: A drill screw of the type suitable for fastening a sheet or plate to a lightweight steel frame member comprises a head portion, a threaded portion adjacent the head portion, a drill shaft portion adjacent the threaded portion, a large diameter drill portion adjacent the drill shaft portion, and a small diameter drill portion adjacent the large diameter drill portion. The small diameter drill portion has a smaller drill angle than the large diameter drill portion thus providing improved bite so that less thrusting force is required and the tendency to skid and drift is reduced.Type: GrantFiled: August 1, 1994Date of Patent: May 28, 1996Assignee: Miyagawa Kinzoku Kogyo Co., Ltd.Inventor: Tsutomu Miyagawa
-
Patent number: 5415057Abstract: A balancer device for balancing the moment generated by gravity on a robot arm, which is mounted at the one end thereof for rotation about a rotation axis and having an articulation on the opposite end, comprises a fluid-pressure operated spring means (7), an attachment portion (6) provided on the robot arm near the articulation, a tension transmitting member (2) for applying tension to the robot arm (1) by cooperation with the fluid-pressure operated spring means (7), and a plurality of guide means (3, 4, 5) provided for rotation extending and guiding the tension transmitting member (2). The tension transmitting member (2) is extended so as to pass the plurality of guide means (3, 4, 5) and the attachment portion (6), and to apply tension to the robot arm (1), whereby the balancer device balances the moment by gravity on the robot arm (1).Type: GrantFiled: November 4, 1993Date of Patent: May 16, 1995Assignee: Fanuc, Ltd.Inventors: Ryo Nihei, Yasuo Naito, Takeshi Okada, Tsutomu Miyagawa
-
Patent number: 5095149Abstract: 4-Halogeno-2-alkoxyimino-3-oxo fatty acid can be produced by one-pot and one-step by reacting a halogenating agent with a 2-alkoxyimino-3-oxo fatty acid ester in an ether solvent or a mixed solvent of an ether solvent and an inert organic solvent such as carbon tetrachloride, benzene, toluene, etc.Type: GrantFiled: August 31, 1990Date of Patent: March 10, 1992Assignee: Wako Pure Chemical Industries, Ltd.Inventors: Tsutomu Tani, Kazuo Maruhashi, Tsutomu Miyagawa
-
Patent number: 5001228Abstract: An azo amide compound of the formula .dbd.N--C(CH.sub.3).sub.2 --CO--NH--R].sub.2 or a hydrate thereof or an acid-addition salt thereof, wherein R is --CH.sub.2 CH.dbd.CH.sub.2, benzyl chloride, picolyl, tetrahydropyridylmethyl and N-piperidinoethyl, is useful as a functional polymerization initiator for polymerizing acrylonitrile, methyl acrylate, styrene, vinyl acetate and other vinyl compounds.Type: GrantFiled: July 26, 1989Date of Patent: March 19, 1991Assignee: Wako Pure Chemical Industries, Ltd.Inventors: Kazuo Shiraki, Tsutomu Miyagawa
-
Patent number: 5000880Abstract: Glycero-phosphatidylcholine is acylated with a higher fatty acid anhydride in the presence of a special organic solvent in the absence of a catalyst.Type: GrantFiled: June 1, 1989Date of Patent: March 19, 1991Assignee: Wako Pure Chemical Industries, Ltd.Inventors: Masami Ishihara, Hiroyoshi Nawa, Tsutomu Miyagawa
-
Patent number: 4990600Abstract: Cyclic azoamidine compounds having the formula and salts thereof are disclosed. ##STR1## wherein R denotes a methyl group or an ethyl group, and R.sup.1, R.sup.2, R.sup.3 and R.sup.4 independently denote a lower alkyl group having one to four carbon atoms or a hydrogen atoms, provided that a case where R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are all hydrogen atoms is excluded. The cyclic azoamidine compounds and their salts are useful as polymerization initiators in the production of polymer compounds.Type: GrantFiled: February 27, 1990Date of Patent: February 5, 1991Assignee: Wako Pure Chemical Industries Ltd.Inventors: Motoaki Tanaka, Tsutomu Miyagawa, Kazuo Shiraki
-
Patent number: 4849228Abstract: The present invention provides a biodegradable high molecular polymer characterized in that the content of water-soluble low molecular compounds, as calculated on the assumption that said compounds each is a monobasic acid, is less than 0.01 mole per 100 grams of said high molecular polymer.The thus-obtained high molecular polymer has good aging stability and can be used advantageously as an exipient for pharmaceutical preparations.Type: GrantFiled: November 6, 1987Date of Patent: July 18, 1989Assignee: Takeda Chemical Industries, Ltd.Inventors: Masaki Yamamoto, Hiroaki Okada, Yasuaki Ogawa, Tsutomu Miyagawa
-
Patent number: 4826959Abstract: A mixture of an isomer of 2,2'-azobis(2,4-dimethylvaleronitrile) having a low melting point in an amount of about 70% by weight or more and an isomer of 2,2'-azobis(2,4-dimethylvaleronitrile) having a high melting point in an amount of about 30% by weight or less shows excellent solvent solubility, which is higher than that of the isomer having a low melting point. The mixture is useful as a polymerization initiator, and also as a blowing agent.Type: GrantFiled: January 29, 1988Date of Patent: May 2, 1989Assignee: Wako Pure Chemical Industries, Ltd.Inventors: Motoaki Tanaka, Tsutomu Miyagawa, Hideo Takeuchi
-
Patent number: 4728721Abstract: The present invention provides a biodegradable high molecular polymer characterized in that the content of water-soluble low molecular compounds, as calculated on the assumption that said compounds each is a monobasic acid, is less than 0.01 mole per 100 grams of said high molecular polymer.The thus-obtained molecular polymer has good aging stability and can be used advantageously as an excipient for pharmaceutical preparations.Type: GrantFiled: May 1, 1986Date of Patent: March 1, 1988Assignees: Takeda Chemical Industries, Ltd., Wako Pure Chemical Industries, Ltd.Inventors: Masaki Yamamoto, Hiroaki Okada, Yasuaki Ogawa, Tsutomu Miyagawa
-
Patent number: 4683288Abstract: A polymer or copolymer of lactic acid and/or glycolic acid which has a weight-average molecular weight of not less than about 5,000 and a dispersity of about 1.5 to 2 is advantageously used as a biodegradable polymer or copolymer for medical preparation.Type: GrantFiled: July 3, 1985Date of Patent: July 28, 1987Assignees: Waco Pure Chemical Ind. Inc., Takeda Chemical Industries, Ltd.Inventors: Motoaki Tanaka, Yasuaki Ogawa, Tsutomu Miyagawa, Toshio Watanabe
-
Patent number: 4677191Abstract: A copolymer of lactic acid and glycolic acid which has a weight-average molecular weight of not less than about 5000 and a dispersity of about 1.5 to 2 is advantageously used as a biodegradable polymer for medical preparation.Type: GrantFiled: July 3, 1985Date of Patent: June 30, 1987Assignees: Wada Pure Chemical Ind., Ltd., Takeda Chemical Industries, Ltd.Inventors: Motoaki Tanaka, Yasuaki Ogawa, Tsutomu Miyagawa, Toshio Watanabe
-
Patent number: 4260713Abstract: Water-soluble polymers having high molecular weight with little branching and good water solubility, particularly acrylamide series polymers having excellent flocculation effect can be obtained when 2,2'-azobis-(N,N'-dimethyleneisobutylamidine) or an acid addition salt thereof or a mixture of 2,2'-azobis(N,N'-dimethyleneisobutylamidine) or an acid addition salt thereof and another azo compound is used as polymerization initiator.Type: GrantFiled: April 9, 1979Date of Patent: April 7, 1981Assignee: Wako Pure Chemical Industries, Ltd.Inventors: Motoaki Tanaka, Tsutomu Miyagawa, Takashi Nakata