Patents by Inventor Tsutomu Nakada
Tsutomu Nakada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11773504Abstract: A plating support system is provided and includes a simulator that predicts an in-plane uniformity value of a plating film formed on a substrate based on assumed conditions for an electroplating treatment of the substrate; a numerical analysis data storage unit that stores numerical analysis data in which each assumed condition is associated with the in-plane uniformity value for plural assumed conditions; a regression analysis unit that estimates a model that the in-plane uniformity value is an objective variable and variables of assumed conditions are explanatory variables by regression analysis based on the numerical analysis data; and an implement condition search unit that uses the estimated model to search for implement conditions that are recommended values of the assumed conditions related to the in-plane uniformity of the plating film formed in the electroplating treatment of the substrate to be plated.Type: GrantFiled: January 14, 2021Date of Patent: October 3, 2023Assignee: EBARA CORPORATIONInventors: Mitsuhiro Shamoto, Masashi Shimoyama, Tsutomu Nakada, Hideharu Aoyama, Masayuki Fujiki
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Publication number: 20210222315Abstract: A plating support system is provided and includes a simulator that predicts an in-plane uniformity value of a plating film formed on a substrate based on assumed conditions for an electroplating treatment of the substrate; a numerical analysis data storage unit that stores numerical analysis data in which each assumed condition is associated with the in-plane uniformity value for plural assumed conditions; a regression analysis unit that estimates a model that the in-plane uniformity value is an objective variable and variables of assumed conditions are explanatory variables by regression analysis based on the numerical analysis data; and an implement condition search unit that uses the estimated model to search for implement conditions that are recommended values of the assumed conditions related to the in-plane uniformity of the plating film formed in the electroplating treatment of the substrate to be plated.Type: ApplicationFiled: January 14, 2021Publication date: July 22, 2021Applicant: EBARA CORPORATIONInventors: MITSUHIRO SHAMOTO, MASASHI SHIMOYAMA, TSUTOMU NAKADA, HIDEHARU AOYAMA, MASAYUKI FUJIKI
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Patent number: 10968530Abstract: In-plane uniformity of a membrane electroplated on a polygon substrate is improved. An electroplating device includes an anode holder configured to hold an anode, a substrate holder configured to hold a polygon substrate, and a regulation plate provided between the anode holder and the substrate holder. The regulation plate has a body portion having a first polygon opening following an outer shape of the polygon substrate, and wall portions protruding on a substrate holder side from edges of the first polygon opening. The wall portions protrude over a first distance on the substrate holder side in first regions which contain middle portions of sides of the first polygon opening, and are notched in second regions which contain corner portions of the first polygon opening, or protrude over a second distance smaller than the first distance on the substrate holder side.Type: GrantFiled: January 29, 2019Date of Patent: April 6, 2021Assignee: EBARA CORPORATIONInventors: Mitsuhiro Shamoto, Tsutomu Nakada, Masashi Shimoyama
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Patent number: 10914019Abstract: A plating apparatus for plating a substrate is provided to reduce vibration of a paddle. The plating apparatus includes a plating bath configured to accommodate plating solution; a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution; a support member for supporting a first end portion of the paddle; a first magnet provided on the paddle; and a second magnet provided on the plating bath. The first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving.Type: GrantFiled: October 29, 2018Date of Patent: February 9, 2021Assignee: EBARA CORPORATIONInventors: Shao Hua Chang, Yasuyuki Masuda, Jumpei Fujikata, Masashi Shimoyama, Tsutomu Nakada
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Patent number: 10632084Abstract: An aquaporin 4 function promotor contains a compound represented by Formula (1) or (2) or a pharmaceutically acceptable salt thereof, as an active ingredient. (In the formula, n11 represents an integer of 1 to 10, and R21 represents one selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an alicyclic heterocyclic group, an aromatic hydrocarbon group, and an aromatic heterocyclic group.Type: GrantFiled: March 3, 2017Date of Patent: April 28, 2020Assignee: NIIGATA UNIVERSITYInventors: Tsutomu Nakada, Vincent Huber, Hironaka Igarashi, Yuji Suzuki, Ingrid Kwee
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Patent number: 10513795Abstract: In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.Type: GrantFiled: April 26, 2019Date of Patent: December 24, 2019Assignee: EBARA CORPORATIONInventors: Junko Mine, Tsutomu Nakada, Mitsutoshi Yahagi
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Publication number: 20190256997Abstract: In-plane uniformity of a membrane electroplated on a polygon substrate is improved. An electroplating device includes an anode holder configured to hold an anode, a substrate holder configured to hold a polygon substrate, and a regulation plate provided between the anode holder and the substrate holder. The regulation plate has a body portion having a first polygon opening following an outer shape of the polygon substrate, and wall portions protruding on a substrate holder side from edges of the first polygon opening. The wall portions protrude over a first distance on the substrate holder side in first regions which contain middle portions of sides of the first polygon opening, and are notched in second regions which contain corner portions of the first polygon opening, or protrude over a second distance smaller than the first distance on the substrate holder side.Type: ApplicationFiled: January 29, 2019Publication date: August 22, 2019Applicant: EBARA CORPORATIONInventors: MITSUHIRO SHAMOTO, TSUTOMU NAKADA, MASASHI SHIMOYAMA
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Publication number: 20190249326Abstract: In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.Type: ApplicationFiled: April 26, 2019Publication date: August 15, 2019Inventors: Junko MINE, Tsutomu NAKADA, Mitsutoshi YAHAGI
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Patent number: 10316426Abstract: In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.Type: GrantFiled: August 26, 2016Date of Patent: June 11, 2019Assignee: EBARA CORPORATIONInventors: Junko Mine, Tsutomu Nakada, Mitsutoshi Yahagi
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Publication number: 20190127875Abstract: A plating apparatus for plating a substrate is provided to reduce vibration of a paddle. The plating apparatus includes a plating bath configured to accommodate plating solution; a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution; a support member for supporting a first end portion of the paddle; a first magnet provided on the paddle; and a second magnet provided on the plating bath. The first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving.Type: ApplicationFiled: October 29, 2018Publication date: May 2, 2019Inventors: Shao Hua CHANG, Yasuyuki MASUDA, Jumpei FUJIKATA, Masashi SHIMOYAMA, Tsutomu NAKADA
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Publication number: 20190091182Abstract: An aquaporin 4 function promotor contains a compound represented by Formula (1) or (2) or a pharmaceutically acceptable salt thereof, as an active ingredient. (In the formula, n11 represents an integer of 1 to 10, and R21 represents one selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an alicyclic heterocyclic group, an aromatic hydrocarbon group, and an aromatic heterocyclic group.Type: ApplicationFiled: March 3, 2017Publication date: March 28, 2019Inventors: Tsutomu NAKADA, Vincent HUBER, Hironaka IGARASHI, Yuji SUZUKI, Ingrid KWEE
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Patent number: 9708724Abstract: An anode unit capable of forming a metal film having a uniform thickness on a substrate is disclosed. The anode unit includes an anode, a first feeding portion connected to a central portion of the anode, a second feeding portion located on a central axis of the anode and located away from the anode, and arms extending radially from the second feeding portion. The arms are connected to a periphery of the anode.Type: GrantFiled: February 23, 2015Date of Patent: July 18, 2017Assignee: Ebara CorporationInventors: Junichiro Tsujino, Tsutomu Nakada, Yusuke Tamari, Mitsutoshi Yahagi, Akira Owatari
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Publication number: 20170058423Abstract: In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.Type: ApplicationFiled: August 26, 2016Publication date: March 2, 2017Inventors: Junko MINE, Tsutomu NAKADA, Mitsutoshi YAHAGI
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Patent number: 9556533Abstract: A substrate processing apparatus includes a plurality of inlet pipes and a plurality of outlet pipes, connected to a processing tank and configured to be switched therebetween to create a flow of a processing liquid in the processing tank in a direction different from that of the processing liquid before the switching. The inlet pipes and the outlet pipes are each provided with a flow control device which is controlled by a control section so that upon the switching, a flow rate of the processing liquid flowing therethrough changes with time.Type: GrantFiled: August 13, 2012Date of Patent: January 31, 2017Assignee: EBARA CORPORATIONInventors: Keiichi Kurashina, Tsutomu Nakada
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Publication number: 20160160352Abstract: There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank.Type: ApplicationFiled: February 12, 2016Publication date: June 9, 2016Inventors: Hiroyuki KANDA, Junichiro TSUJINO, Junko MINE, Makoto KUBOTA, Tsutomu NAKADA, Kenichiro ARAI
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Patent number: 9293364Abstract: There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank.Type: GrantFiled: November 15, 2012Date of Patent: March 22, 2016Assignees: Ebara Corporation, Screen Holdings Co., Ltd.Inventors: Hiroyuki Kanda, Junichiro Tsujino, Junko Mine, Makoto Kubota, Tsutomu Nakada, Kenichiro Arai
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Publication number: 20150275390Abstract: An anode unit capable of forming a metal film having a uniform thickness on a substrate is disclosed. The anode unit includes an anode, a first feeding portion connected to a central portion of the anode, a second feeding portion located on a central axis of the anode and located away from the anode, and arms extending radially from the second feeding portion. The arms are connected to a periphery of the anode.Type: ApplicationFiled: February 23, 2015Publication date: October 1, 2015Inventors: Junichiro TSUJINO, Tsutomu NAKADA, Yusuke TAMARI, Mitsutoshi YAHAGI, Akira OWATARI
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Publication number: 20150267302Abstract: An electroless plating method which can prevent stoppage of a plating reaction and a decrease in a plating rate is disclosed. This method includes: circulating a plating solution through a plating bath while heating the plating solution; immersing the substrate in the plating solution in the plating bath; forming a first electroless plating film on the substrate while circulating the plating solution at a first flow rate during a period from when the substrate is immersed in the plating solution until a predetermined time elapses; and forming a second electroless plating film on the first electroless plating film while circulating the plating solution at a second flow rate that is lower than the first flow rate after the predetermined time has elapsed.Type: ApplicationFiled: March 16, 2015Publication date: September 24, 2015Inventors: Makoto Kubota, Akira Susaki, Masashi Shimoyama, Tsutomu Nakada
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Patent number: 9073802Abstract: The present invention aims at solving the problems of conventional methods for producing an 18F-labeled compound, that is, the problem of purification of a compound in a liquid phase synthesis method and the problem of an insufficient yield due to the reduction of reactivity in a solid phase synthesis method. There is provided a method for producing an 18F-labeled compound including: allowing a high molecular compound containing a residue of a precursor compound to be labeled and a residue of a phase transfer catalyst in the molecule thereof to react with 18F?; and removing the 18F-labeled compound from the high molecular compound.Type: GrantFiled: February 8, 2011Date of Patent: July 7, 2015Assignees: TOKYO INSTITUTE OF TECHNOLOGY, NIIGATA UNIVERSITYInventors: Takashi Takahashi, Hiroshi Tanaka, Tsutomu Nakada
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Publication number: 20150090584Abstract: A plating apparatus for plating a substrate is disclosed. The plating apparatus includes: a dip-type plating bath; a dry-type plating bath having a hole in a sidewall thereof; and a pressing mechanism configured to press a substrate holder, holding a substrate, against the sidewall of the dry-type plating bath to close the hole. The substrate holder includes a base member and a holding member configured to sandwich the substrate therebetween, a first seal portion configured to seal a gap between the substrate and the holding member, a second seal portion configured to seal a gap between the base member and the holding member, and a third seal portion configured to seal a gap between the holding member and the sidewall of the dry-type plating bath.Type: ApplicationFiled: September 26, 2014Publication date: April 2, 2015Inventors: Yoshio Minami, Tsutomu Nakada