Patents by Inventor Tsutomu Nishimura

Tsutomu Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6296786
    Abstract: A treated waste has been treated so as to prevent diffusion of a substance to be disposed, of e.g., radionuclide “I”, that tends to occur when the waste is disposed of in reducing environment at an ultra-deep underground. The treated waste has a low-resolution compound containing “I”, e.g., “AgI”, and a high oxygen potential agent having a higher oxygen potential than the compound, e.g., “Fe2O3”. Ionization of the substance to be disposed, attributable to reduction of the compound, can be suppressed over a long time.
    Type: Grant
    Filed: July 28, 1998
    Date of Patent: October 2, 2001
    Assignee: Kabushiki Kaisha Kobe Seiko Sho.
    Inventors: Ryutaro Wada, Tsutomu Nishimura, Tsuyoshi Imakita, Yoshitaka Kurimoto, Yasushi Sugimura
  • Patent number: 6266230
    Abstract: The present invention provides a multilayer ceramic capacitor in which electrode metal layers and dielectric ceramic layers are laminated alternately and its dielectric constant peak is present at a temperature below −50° C. The multilayer ceramic capacitor is at least one selected from a multilayer ceramic capacitor to be incorporated into an electric circuit in which an electric field of at least 200 V/mm is applied to dielectric layers as a DC bias electric field and an alternating current at a frequency of at least 20 kHz is superimposed and a multilayer ceramic capacitor to be incorporated into an electric circuit in which an electric field of at least 200 V/mm is applied to dielectric layers as an AC electric field. As the dielectric ceramic, a ceramic containing lead atoms whose amount is indicated by being measured in the form of PbO, which is at least 30 mol %, particularly a compound with a perovskite structure represented by ABO3 is used.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: July 24, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junichi Kato, Takuya Ishii, Koji Yoshida, Tsutomu Nishimura, Yoshimasa Yabu
  • Patent number: 5863505
    Abstract: The present invention provides an underground-environment simulator which simulates underground environment spaces used for radioactive waste disposal or the like, and has a hermetic box, wherein the carbon dioxide gas concentration inside the box can be adjusted to an optional level, and the atmosphere inside the box can be uniformly and stably maintained. In the underground-environment simulator of the present invention, a carbon dioxide gas feeding means feeds carbon dioxide gas into a circulating gas circulation which controls the atmosphere inside the hermetic box, and the concentration of carbon dioxide gas in the circulating gas is measured and adjusted to a predetermined level while oxygen is removed from the circulating gas in an oxyhydrogen reactor. Accordingly, the carbon dioxide gas concentration can be controlled within a low concentration range, and various underground environments can be accurately simulated by varying the carbon dioxide gas concentration to an optional level.
    Type: Grant
    Filed: May 27, 1997
    Date of Patent: January 26, 1999
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Ryutaro Wada, Makoto Asao, Tsutomu Nishimura, Toshio Iwata, Kenji Yamaguchi, Kiyoshi Tsune
  • Patent number: 5252519
    Abstract: A multilayered glass-ceramic substrate using copper as wiring material is fabricated by a step of forming wiring patterns with Au paste for connection of semiconductor chip prepared by adding at least one of Ni powder, Pt powder and Pd powder to Au powder, and copper oxide paste mainly composed of CuO powder, on a green sheet, and burning out the organic pattern by heat treatment in air, a step of reducing the copper oxide electrode by heat treatment in a reducing atmosphere containing hydrogen, and a step of sintering the substrate material, copper oxide electrode and gold electrode by heat treatment in nitrogen. Since the Au wiring pattern is formed on the top layer of the multilayered substrate in this constitution, wire bonding of high reliability is realized. Besides, by making use of the excellent solderability of Au, it may be also applied in flip-chip mounting of semiconductor.
    Type: Grant
    Filed: October 31, 1991
    Date of Patent: October 12, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Nakatani, Tsutomu Nishimura, Satoru Yuhaku, Yasuhiko Hakotani
  • Patent number: 5014158
    Abstract: A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electrode layers are made of Ni. The dielectric layers are made of a dielectric ceramic composition having a structural formula of:{Bam(Til-xZrx)O2+m}1-.alpha.-.beta.-{MnO2}.alpha.-{X}.beta.where X is at least one of Yb2O3, Dy2O3, and ThO2 and m, x, .alpha., and .beta. are expressed as:0.98.ltoreq.m.ltoreq.1.020.ltoreq.x.ltoreq.0.20.005.ltoreq..alpha..ltoreq.0.050.001.ltoreq..beta..ltoreq.0.02so that the laminated ceramic capacitor can be minimized in the size, increased in the capacitance, and reduced in the cost of production.
    Type: Grant
    Filed: April 11, 1990
    Date of Patent: May 7, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Nishimura, Seiichi Nakatani, Satoru Yuhaku, Yasuhiko Hakotani, Tatsuro Kikuchi
  • Patent number: 5004715
    Abstract: A low temperature sintering dielectric ceramic composition, which exhibits high dielectric constant, low dielectric loss, high electrical resistivity, high mechanical strength and narrow grain size distribution, is disclosed. The ceramic composition is a binary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3) and copper oxide, or a ternary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3), lead titanate (PbTiO.sub.3) and copper oxide. A multilayer ceramic capacitor comprising internal copper electrodes and ceramic dielectric layers consisting of the dielectric ceramic composition is also disclosed. A method of readily manufacturing the multilayer ceramic capacitor with copper internal electrodes is also disclosed.
    Type: Grant
    Filed: February 22, 1990
    Date of Patent: April 2, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasuhiko Hakotani, Seiichi Nakatani, Satoru Yuuhaku, Tsutomu Nishimura, Toru Ishida
  • Patent number: 5004640
    Abstract: Multilayered ceramic substrates having Cu electrode patterns in or on ceramic-glass insulating layers which consist essentially of Al.sub.2 O.sub.3, SiO.sub.2, B.sub.2 O.sub.3, Na.sub.2 O, K.sub.2 O, CaO, MgO and PbO. The methods for manufacturing the substrate comprises thermally treating a laminate of alternately superimposing ceramic-glass insulating layers and CuO-based electrode layers of desired patterns in air or in a molecular oxygen-containing atmosphere to eliminate organic binders from the laminates by burning out, reducing the CuO into metallic Cu at low temperatures in an atmosphere containing hydrogen, and firing the thus reduced laminate in an inert gas such as nitrogen. The firing is effected at 850.degree. to 950.degree. C. The multilayered ceramic substrate may also be obtained by forming ceramic-glass insulating layers and CuO-based electrode layers alternately on a sintered ceramic support, followed by the thermal treatment, reduction and firing set forth above.
    Type: Grant
    Filed: March 10, 1989
    Date of Patent: April 2, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Nakatani, Satoru Yuhaku, Tsutomu Nishimura, Yukio Terada, Yasuyuki Baba
  • Patent number: 4933088
    Abstract: A method of and an apparatus for treating water by providing a water being treated with a crystal water-containing proton-releasing crystalline mineral and/or a magnetic field, while controlling the amount of proton released and the strength of said magnetic field as control indicators so as to remove, reduce, vanish or deproliferate the cations, a part of the anions, eutrophicated substances, chlorophyll, algae, bacteria and the like which are contained in the water by flocculating them, making them adsorbed to flocs or making them colloidal.
    Type: Grant
    Filed: February 23, 1988
    Date of Patent: June 12, 1990
    Assignee: Kabushiki Kaisha Astec
    Inventor: Tsutomu Nishimura
  • Patent number: 4906404
    Abstract: A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.
    Type: Grant
    Filed: November 7, 1988
    Date of Patent: March 6, 1990
    Assignees: Dai-Ichi Kogyo Seiyaku Co., Ltd., Dowa Mining Co., Ltd., Matsushita Electric Industrial Co.
    Inventors: Masatoshi Suehiro, Masashi Echigo, Masami Sakuraba, Yutaka Mitsune, Seiichi Nakatani, Tsutomu Nishimura
  • Patent number: 4906405
    Abstract: Disclosed are a CuO conductor paste which is effective for making a multilayered ceramic body, the conductor material of which is made of copper, and a method of manufacturing a multilayered ceramic body using the conductor paste. The conductor paste is made of CuO as the main component with an addition of at least one of PbO-based glass, or any of Bi.sub.2 O.sub.3 -based glass, CuO-based glass and CuAl.sub.2 O.sub.4 as the additive. The multilayered ceramic body is manufactured by a method comprising a forming process for making a multilayered body from the conductor paste and dielectric material, a binder removing process by heat treating the multilayered body, thus obtained, in air, a reduction process for reducing CuO to copper in a mixed gas atmosphere of hydrogen and nitrogen, and a sintering process for sintering the multilayered body thus reduced in a nitrogen gas atmosphere.
    Type: Grant
    Filed: May 17, 1988
    Date of Patent: March 6, 1990
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Nakatani, Tsutomu Nishimura, Satoru Yuhaku, Minehiro Itagaki
  • Patent number: 4865772
    Abstract: A copper-containing thick film conductor composition comprising 55 to 95% by weight of an inorganic powder and 45 to 5% by weight of an organic medium, said inorganic powder comprising 100 parts by weight of a copper powder, 0.05 to 3 parts by weight of a zinc oxide powder, 1 to 7 parts by weight of a lead borate glass powder, 0.2 to 5 parts by weight of a borosilicate glass powder and 0 to 10 parts by weight of a copper snboxide powder having an average particle size of not more than 1.0 .mu.m. The composition of the present invention is excellent in solderability and adhesive strength to the substrate.
    Type: Grant
    Filed: November 15, 1988
    Date of Patent: September 12, 1989
    Inventors: Masatoshi Suehiro, Masashi Echigo, Yutaka Mitsune, Masami Sakuraba, Seiichi Nakatani, Tsutomu Nishimura
  • Patent number: 4812422
    Abstract: Disclosed is a dielectric paste for a ceramic multilayer wiring substrate, of which feature, among others, lies in the composition of inorganic components comprised of ceramics made of Al.sub.2 O.sub.3, SiO.sub.2, CaO and MgO, and a borosilicate glass. This can be prepared by mixing a part of the glass with the ceramic, calcining the mixture at a high temperature, and then adding the remaining glass to mix with the calcined product. The insulation layer is densely formed, and a dielectric paste excelling in electric insulating property can be obtained by mixing this composition with an organic liquid.
    Type: Grant
    Filed: June 3, 1986
    Date of Patent: March 14, 1989
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoru Yuhaku, Seiichi Nakatani, Tsutomu Nishimura, Toru Ishida
  • Patent number: 4795512
    Abstract: A method of manufacturing a multilayer ceramic using Cu as the conductor material is disclosed. This method comprises a step of forming a multilayer laminate by the green tape multilayer laminating method or by the thick film printing method on ceramic substrate with an insulating material with a mixture of ceramic and glass containing lead oxide as its main component and a conductor paste with CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of causing reduction at temperatures where copper oxide is reduced, but lead oxide is not, in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of firing in a nitrogen atmosphere, thereby effecting sintering of the insulating material composed of ceramic and glass containing lead oxide and metallization of copper electrodes (firing process).
    Type: Grant
    Filed: February 25, 1987
    Date of Patent: January 3, 1989
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Nakatani, Tsutomu Nishimura, Satoru Yuhaku, Toru Ishida
  • Patent number: 4789707
    Abstract: There is disclosed a coating resin composition which contains as a crosslinking agent a melamine-formaldehyde resin which permits a paint to cure at low temperatures, permits a paint to form a coating film flexible enough for the fabrication of the coated substrate, gives off only a small amount of formaldehyde at the time of paint application, and makes it possible to increase the solids content in a paint. The melamine-formaldehyde resin is a mixed alkyl etherified methylol melamine resin, and the other composition-constituting component is an alkyd resin, polyester resin, or vinyl copolymer.
    Type: Grant
    Filed: March 2, 1987
    Date of Patent: December 6, 1988
    Assignees: Mitsui-Cyanamid Ltd., Nippon Paint Co., Ltd.
    Inventors: Tsutomu Nishimura, Yasuo Saito, Kenji Shindo, Kazutoshi Abe
  • Patent number: 4695403
    Abstract: A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorganic ingredient may be further added with a manganese oxide or a heat resistant insulating material such as ceramics and/or glass.
    Type: Grant
    Filed: June 17, 1986
    Date of Patent: September 22, 1987
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Nishimura, Seiichi Nakatani, Satoru Yuhaku, Toru Ishida
  • Patent number: 3969428
    Abstract: A process for the production of conjugated diolefins having 4-6 carbon atoms from the corresponding monoolefins according to the oxidative dehydrogenation process wherein oxides of molybdenum, arsenic and an alkaline earth metal are used as catalyst. The use of this catalyst enables the production of conjugated diolefins in a high yield.
    Type: Grant
    Filed: October 11, 1974
    Date of Patent: July 13, 1976
    Assignee: Agency of Industrial Science & Technology
    Inventors: Toshio Ishikawa, Takashi Hayakawa, Tsutomu Nishimura, Michio Araki, Katsuomi Takehira