Abstract: A lead-free, cream solder composition that is printable includes a SnZn alloy which is lead-free and which is a powder; a solder flux including an epoxy resin; microcapsules that are organic carboxylic acid particles encapsulated with a resin selected from a group consisting of epoxy, polyimide, polycarbonate, polyamide, polyester, polyurea, polyolefin, and polysulfone resins; and a solvent which is a glycol. The presence of the organic carboxylic acid encapsulated with a resin as microcapsules suppresses reactivity of zinc in the SnZn alloy with the organic carboxylic acid Alternately, the solder flux may include the epoxy resin; an organic carboxylic acid; and the solvent; and microcapsules that are particles of a SnZn alloy encapsulated with the described resin. The presence of the SnZn alloy encapsulated with a resin as microcapsules suppresses reactivity of zinc in the SnZn alloy with the organic carboxylic acid so that viscosity and solderability are stabilized.

Abstract: An electrophotographic photoreceptor includes an electroconductive substrate; and at least a photosensitive layer provided on the electroconductive substrate, wherein the electrophotographic photoreceptor has an outermost layer which contains microcapsules having a lubricating oil encompassed therein. The microcapsules may be composed of an inorganic porous particle or an organic polymer material, and the lubricating oil may be a silicone oil or a fluoro oil. Such a photoreceptor has a surface with excellent lubricity and is less susceptible to surface damage and filming from toner or the like while exhibiting good reuseability of toner.

Abstract: A solder composition containing a lead-free SnZn alloy and a solder flux that contains at least an epoxy resin and an organic carboxylic acid. The organic carboxylic acid is dispersed in the solder composition as a solid at room temperature, and has a molecular weight of from 100 to 200 g/mol.

Abstract: A solder composition containing a lead-free SnZn alloy and a solder flux that contains at least an epoxy resin and an organic carboxylic acid. The organic carboxylic acid is dispersed in the solder composition as a solid at room temperature, and has a molecular weight of from 100 to 200 g/mol.

Abstract: An electrophotographic photoreceptor includes an electroconductive substrate; and at least a photosensitive layer provided on the electroconductive substrate, wherein the electrophotographic photoreceptor has an outermost layer which contains microcapsules having a lubricating oil encompassed therein. The microcapsules may be composed of an inorganic porous particle or an organic polymer material, and the lubricating oil may be a silicone oil or a fluoro oil. Such a photoreceptor has a surface with excellent lubricity and is less susceptible to surface damage and filming from toner or the like while exhibiting good reuseability of toner.

Abstract: A solder composition containing a lead-free SnZn alloy and a solder flux that contains at least an epoxy resin and an organic carboxylic acid. The organic carboxylic acid is dispersed in the solder composition as a solid at room temperature, and has a molecular weight of from 100 to 200 g/mol.

Abstract: A soldering flux according to the present invention is a soldering flux containing an epoxy resin and an organic carboxylic acid, wherein the epoxy resin and the organic carboxylic acid are compounded at a ratio of 1.0 equivalent of epoxy group in the epoxy resin to 0.8-2.0 equivalent of carboxyl group in the organic carboxylic acid, and a total amount of the epoxy resin and the organic carboxylic acid is 70% or more by weight based on the total weight of the soldering flux. A lead-free solder composition according to the present invention is a solder composition containing the soldering flux and a lead-free solder. The soldering flux or the lead-free solder composition according to the present invention has special advantages of maintaining an activation by the flux, good wettability of the solder, and no inhibition of a sealing resin from curing.

Abstract: A soldering flux according to the present invention is a soldering flux containing an epoxy resin and an organic carboxylic acid, wherein the epoxy resin and the organic carboxylic acid are compounded at a ratio of 1.0 equivalent of epoxy group in the epoxy resin to 0.8-2.0 equivalent of carboxyl group in the organic carboxylic acid, and a total amount of the epoxy resin and the organic carboxylic acid is 70% or more by weight based on the total weight of the soldering flux. A lead-free solder composition according to the present invention is a solder composition containing the soldering flux and a lead-free solder. The soldering flux or the lead-free solder composition according to the present invention has special advantages of maintaining an activation by the flux, good wettability of the solder, and no inhibition of a sealing resin from curing.