Abstract: A micro array chip is formed by high-speed in jection molding. A chip body has a thickness of 1 mm and each well has a capacity of 1.2 &mgr;L with the bottom having a wall thickness of 250 &mgr;m. An opening of each well is surrounded by an annular protrusion part, which is raised from a surface of the chip body by a height of 200 &mgr;m. The openings of wells may be closed with a sheet of sealant made of aluminum or a resin. An overall shape of the micro array chip is rectangular and is a flat plate with a level bottom surface. Therefore, the micro array chip can be used with a heat block in flat plate form, which is independent of chip specifications such as a number of wells and their shape.

Abstract: A micro array chip is formed by high-speed injection molding. A chip body has a thickness of 1 mm and each well has a capacity of 1.2 &mgr;L with the bottom having a wall thickness of 250 &mgr;m. An opening of each well is surrounded by an annular protrusion part, which is raised from a surface of the chip body by a height of 200 &mgr;m. The openings of wells may be closed with a sheet of sealant made of aluminum or a resin. An overall shape of the micro array chip is rectangular and is a flat plate with a level bottom surface. Therefore, the micro array chip can be used with a heat block in flat plate form, which is independent of chip specifications such as a number of wells and their shape.