Abstract: A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.

Abstract: A lighting apparatus including a light guiding plate, and a light source including a plurality of light-emitting elements which emit light at a plurality of brightness levels. The light emitting elements is provided opposite to a side edge of the light guiding plate and arranged along the side edge of the light guiding plate. The light-emitting elements are divided into a plurality of sets according to the brightness levels, and light-emitting elements in each of the sets are connected in series.

Abstract: A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.

Abstract: A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.

Abstract: There is provided a lighting apparatus comprising a light guiding plate, and a light source including a plurality of light-emitting elements which emit light at a plurality of brightness levels. The light emitting elements is provided opposite to a side edge of the light guiding plate and arranged along the side edge of the light guiding plate. The light-emitting elements are divided into a plurality of sets according to the brightness levels, and light-emitting elements in each of the sets are connected in series.

Abstract: A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.

Abstract: The invention provides a method for readily forming a bump with a desired width, a semiconductor device and a method for making the same, a circuit board, and an electronic device. A method for forming a bump includes forming an opening in an insulating film which exposes at least a part of a pad, and forming the bump so as to be connected to the pad. A resist layer 20 defines a through hole which extends over at least a part of the pad in plan view. A metal layer is formed in the opening so as to connect to the exposed portion of the pad.

Abstract: A laser machining method and apparatus performs high-speed and high-precision machining on a thin film and a liquid crystal panel. The apparatus includes: a plurality of pulse laser generators, drivers for alternately driving a plurality of pulse laser generators to generate laser beams delayed in phase between each other; collimators for making the generated laser beams equal in quality; a wave plate for converting the laser beams into elliptically polarized laser beams; and a phase grating for dividing each laser beam emitted by each of the plurality of laser beam generators into a plurality of laser beams; such that an object to be processed is selectively illuminated with the plurality of laser beams produced by the phase grating. The phase grating has structure on its surface for dividing each of the laser beams into equal intensity beams. Open grooves are formed having uniform shape and quality.

Abstract: An LED lamp device of the invention includes a power supply unit (102, 103) supplied with an alternating-current power supply voltage, and an LED lamp (106) constituted by one or a plurality of serially connected LEDs connected to output terminals of the power supply unit (102, 103). The power supply unit (102) obtains a rectified wave of the alternating-current power supply voltage, admits electric power for only part of a time period in which the voltage of the rectified wave corresponding to each half period of the wave of the alternating-current power supply voltage is higher than or equal to a predetermined value, and uses the electric power as power for lighting the LED lamp (106).

Abstract: An LED lamp device of the invention includes a power supply unit (102, 103) supplied with an alternating-current power supply voltage, and an LED lamp (106) constituted by one or a plurality of serially connected LEDs connected to output terminals of the power supply unit (102, 103). The power supply unit (102) obtains a rectified wave of the alternating-current power supply voltage, admits electric power for only part of a time period in which the voltage of the rectified wave corresponding to each half period of the wave of the alternating-current power supply voltage is higher than or equal to a predetermined value, and uses the electric power as power for lighting the LED lamp (106).

Abstract: A laser machining method and apparatus for performing high- speed and high-precision machining on a thin film deposited on a substrate, as well as a liquid crystal panel having an electrode structure patterned using the laser machining apparatus and according to this method are disclosed.

Abstract: In a structure for connecting terminals on wiring boards, lands on a wiring board are respectively connected with lead terminals on another wiring board through solder. Outline of each land has a bump and a recess respectively on edges facing to terminal arranging direction. Meanwhile the lead terminals are rectangular. In plan view, the recess protrudes from an edge of respective lead terminal while protrusions on ends of the recess protrude from another edge of the respective lead terminal. Even when position of the each land to the respective lead terminal deviates not so excessively, the bump and the protrusion protrude from outline of the lead terminal. Thus, on each of such protruding portions, visible fillets of the solder are formed.

Abstract: A laser machining apparatus for performing high-precision machining on a thin film deposited on a substrate, such as a liquid crystal panel. The apparatus includes a pulse laser generator for emitting a laser beam, a driver for driving the pulse laser generator, a phase grating for dividing the laser beam; a rotary stage for rotating the phase grating to control the direction of the beams illuminating an object, and a spatial filter (element 2101).

Abstract: A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.

Abstract: The invention provides a method for readily forming a bump with a desired width, a semiconductor device and a method for making the same, a circuit board, and an electronic device. A method for forming a bump includes forming an opening in an insulating film which exposes at least a part of a pad, and forming the bump so as to be connected to the pad. A resist layer 20 defines a through hole which extends over at least a part of the pad in plan view. A metal layer is formed in the opening so as to connect to the exposed portion of the pad.

Abstract: In a structure for connecting terminals on wiring boards, lands on a wiring board are respectively connected with lead terminals on another wiring board through solder. Outline of each land has a bump and a recess respectively on edges facing to terminal arranging direction. Meanwhile the lead terminals are rectangular. In plan view, the recess protrudes from an edge of respective lead terminal while protrusions on ends of the recess protrude from another edge of the respective lead terminal. Even when position of the each land to the respective lead terminal deviates not so excessively, the bump and the protrusion protrude from outline of the lead terminal. Thus, on each of such protruding portions, visible fillets of the solder are formed.

Abstract: A display control device for a liquid crystal display is comprised of a detecting section for extracting a horizontal and vertical synchronizing signal from a video signal, a control signal generating circuit for generating a scanning start signal synchronous to the vertical synchronizing signal and a reference clock signal synchronous to the horizontal synchronizing signal, an X-driver circuit for extracting a horizontal picture signal from the video signal in synchronism with the horizontal synchronizing signal and supplying the horizontal picture signal to each of the horizontal pixel lines, and a Y-driver circuit having a shift register for shifting the scanning start pulse in one direction in response to the reference clock signal and selecting the horizontal pixel line corresponding to a holding position of the scanning start pulse, for supplying a selecting signal to the selected horizontal pixel line.

Abstract: A laser machining method and apparatus for performing high-speed and high-precision machining on a thin film deposited on a substrate, as well as a liquid crystal panel. The apparatus includes: a plurality of pulse laser generators; a system for alternately driving a plurality of pulse laser generators so that the plurality of pulse laser generators generate laser beams having a delay in phase between each other; a system for making the laser beams generated by the plurality of laser beam generators equal in quality; a system for converting the laser beams generated by the plurality of laser beam generators into elliptically polarized laser beams; and a system for dividing each laser beam emitted by each of the plurality of laser beam generators into a plurality of laser beams; whereby an object to be processed is selectively illuminated with the plurality of laser beams produced by the beam-dividing system.

Abstract: An information recording disk formed from two substrates with a stepped central opening for receiving a hub within the stepped recess of at least one of the substrates is provided. In one embodiment, the central aperture of the first substrate is larger than the central aperture of the second substrate to form the stepped recess. In another embodiment, at least one substrate has a stepped surface defining a central aperture and a hub structure is mounted within this stepped recess to reduce overall thickness of the disk.

Abstract: An information recording disk formed from two substrates with a stepped central opening for receiving a hub within the stepped recess of at least one of the substrates is provided. In one embodiment, the central aperture of the first substrate is larger than the central aperture of the second substrate to form the stepped recess. In another embodiment, at least one substrate has a stepped surface defining a central aperture and a hub structure is mounted within this stepped recess to reduce overall thickness of the disk.