Abstract: A light emitting element array includes plural light emitting elements connected in parallel to each other by a wiring connected to a terminal configured to supply a current. The number of light emitting elements which have the shortest path length among path lengths on the wiring from the terminal to the respective light emitting elements along a path of the current is one.

Abstract: A method for producing a semiconductor piece includes forming a first groove portion of a front-surface-side groove by anisotropic dry etching from a front surface of a substrate, forming a second groove portion of the front-surface-side groove, the second groove portion being located below and in communication with the first groove portion and having a width wider than a width of the first groove portion, and thinning the substrate from a back surface of the substrate up to the second groove portion. The second groove portion is formed by changing an etching condition of the anisotropic dry etching during the formation of the front-surface-side groove so that the width of the second groove portion is wider than the width of the first groove portion.

Abstract: An optical transmission device includes a first light emitting element, a second light emitting element, and a detection unit. The first light emitting element is configured to emit light. The second light emitting element is configured to emit light. The second light emitting element is connected in parallel with the first light emitting element and is configured to deteriorate earlier than the first light emitting element. The detection unit is configured to detect whether the second light emitting element is deteriorated.

Abstract: A light emitting element array includes plural light emitting elements connected in parallel to each other by a wiring connected to a terminal configured to supply a current. The number of light emitting elements which have the shortest path length among path lengths on the wiring from the terminal to the respective light emitting elements along a path of the current is one.

Abstract: A light emitting element array includes plural light emitting elements connected in parallel to each other by a wiring connected to a terminal that supplies a current. Each of the light emitting elements is disposed at a position of a predetermined path length along a path of the current flowing from the terminal through the wiring. The plural light emitting elements include, in a mixed form, one or more first light emitting elements each having a non-shielded light emission aperture and one or more second light emitting elements each having a shielded light emission aperture. At least one of the first light emitting elements is disposed at a position of the longest path length. At least one of the second light emitting elements is disposed at a position of the shortest path length.

Abstract: A biometric information measuring apparatus includes a light emitting unit, a light receiving unit, a detecting unit and a controller. The light emitting unit is configured to emit light. The light receiving unit is configured to receive light. The detecting unit is configured to detect a frequency distribution of the light received by the light receiving unit. When a feature which is obtained in response to a living body being irradiated with light is included in the frequency distribution detected by the detecting unit, the controller controls an operation state of the apparatus to switch from a standby state to a measurement state in which biometric information in the living body is measured.

Abstract: A biometric information measuring apparatus includes a light emitting unit, a light receiving unit, a detecting unit, and a controller. The light emitting unit is configured to emit light. The light receiving unit is configured to receive light. The detecting unit is configured to detect a frequency distribution of the light received by the light receiving unit. When a feature which is obtained in response to a living body being irradiated with light is no longer included in a frequency component detected by the detecting unit during a period in which biometric information is measured using the frequency distribution detected by the detecting unit, the controller stops measurement of biometric information in the living body.

Abstract: Provided is a method for manufacturing a semiconductor chip including forming a groove on a front surface side along a cut area of a substrate, and a concave portion deeper than the groove on the front surface side as a positioning mark for a cutting member that performs cutting from a back surface of the substrate along the groove on the front surface side, thinning the substrate so as to reach the concave portion and not reach the groove on the front surface side, in the back surface of the substrate, positioning the cutting member from the back surface of the substrate by using the concave portion exposed on the back surface of the substrate as the positioning mark, and performing cutting from the back surface side of the substrate toward the groove on the front surface side of the substrate by using the positioned cutting member.

Abstract: A method for manufacturing a semiconductor chip includes forming at least a portion of a front-side groove by anisotropic dry etching from a front surface of a substrate along a cutting region; forming a modified region in the substrate along the cutting region by irradiating the inside of the substrate with a laser along the cutting region; and dividing the substrate along the cutting region by applying stress to the substrate.

Abstract: An electronic component includes; a magnetic-body core having a plate-shaped portion and a core portion which extends from an upper surface of the plate-shaped portion; a winding wire which includes a wound portion wound by a rectangular wire into an Edgewise winding form and two non-wound portions extending from the wound portion to two distal ends, and the core portion is inserted through the wound portion; and a magnetic exterior body which covers at least the wound portion and the core portion. The two non-wound portions are respectively arranged along a bottom surface and at least one of the side surfaces of the plate-shaped portion. Parts of the two non-wound portions arranged along the bottom surface are electrodes.

Abstract: A method of manufacturing semiconductor chips includes: forming grooves on a front face side of a substrate; and forming grooves on a back face side of the substrate as defined herein, and in manufacturing conditions in which a variation range of a top section of the cutting member having a tapered tip end shape with no top face in the groove width direction changes from a range included in the groove on the front face side to a range away from the groove on the front face side as wear of the cutting member advances, the use of the cutting member is stopped before the variation range changes from the range included in the groove on the front face side to the range away from the groove on the front face side.

Abstract: Provided are a small electronic component including: a magnetic core including at least a columnar core part; a winding coil arranged so as to surround an outer peripheral surface side of the columnar core part and formed by winding a winding wire; and a magnetic cover part formed so as to cover at least part of the magnetic core and the winding coil while following at least part of shapes of the magnetic core and the winding coil through use of a magnetic material containing a mixture of a phosphoric acid ester-based surfactant, magnetic powder, and a resin, an electronic circuit board using the small electronic component, and a method of manufacturing a small electronic component.

Abstract: A design method includes a process of preparing plural cutting members having different degrees of taper in a tip portion thereof, a process of preparing plural grooves on a front surface side having the same shape, a process of confirming a breakage status when a groove on a rear surface side is formed by the plural cutting members, and a process of selecting, when it is confirmed that both of a cutting member that causes breakage and a cutting member that does not cause the breakage are included, the degree of taper of the cutting member that does not cause the breakage as a tip shape of a cutting member to be used in a mass production process.

Abstract: A method of manufacturing semiconductor chips includes: forming grooves on a front face side of a substrate; and forming grooves on a back face side of the substrate as defined herein, and in manufacturing conditions in which a variation range of a top section of the cutting member having a tapered tip end shape with no top face in the groove width direction changes from a range included in the groove on the front face side to a range away from the groove on the front face side as wear of the cutting member advances, the use of the cutting member is stopped before the variation range changes from the range included in the groove on the front face side to the range away from the groove on the front face side.

Abstract: An electronic component which includes a first side-surface and a second side-surface facing the first side-surface, including: a magnetic-body core including a plate-shaped portion and a core portion; a winding wire which includes a wound portion wound with a rectangular wire and two non-wound portions, and of which the core portion is inserted through the wound portion; a magnetic exterior body; a first electrode member including a first side-surface exposed-portion; and a second electrode member including a second side-surface exposed-portion, wherein the first side-surface exposed-portion includes a first connecting portion which extend along the height direction of the first side-surface, the first connecting portion is connected to one of the non-wound portions, the second side-surface exposed-portion includes a second connecting portion which extends along the height direction of the second side-surface, and the second connecting portion is connected to the other of the non-wound portions.

Abstract: A method of manufacturing semiconductor chips includes: forming grooves on a front face side of a substrate; and forming grooves on a back face side of the substrate as defined herein, and in manufacturing conditions in which a variation range of a top section of the cutting member having a tapered tip end shape with no top face in the groove width direction changes from a range included in the groove on the front face side to a range away from the groove on the front face side as wear of the cutting member advances, the use of the cutting member is stopped before the variation range changes from the range included in the groove on the front face side to the range away from the groove on the front face side.

Abstract: Provided is a method for manufacturing a semiconductor chip including forming a groove on a front surface side along a cut area of a substrate, and a concave portion deeper than the groove on the front surface side as a positioning mark for a cutting member that performs cutting from a back surface of the substrate along the groove on the front surface side, thinning the substrate so as to reach the concave portion and not reach the groove on the front surface side, in the back surface of the substrate, positioning the cutting member from the back surface of the substrate by using the concave portion exposed on the back surface of the substrate as the positioning mark, and performing cutting from the back surface side of the substrate toward the groove on the front surface side of the substrate by using the positioned cutting member.

Abstract: A method of manufacturing semiconductor chips includes: forming grooves on a front face side of a substrate; and forming grooves on a back face side of the substrate as defined herein, and in manufacturing conditions in which a variation range of a top section of the cutting member having a tapered tip end shape with no top face in the groove width direction changes from a range included in the groove on the front face side to a range away from the groove on the front face side as wear of the cutting member advances, the use of the cutting member is stopped before the variation range changes from the range included in the groove on the front face side to the range away from the groove on the front face side.

Abstract: A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.

Abstract: A method for producing a semiconductor piece includes forming a first groove portion of a front-surface-side groove by anisotropic dry etching from a front surface of a substrate, forming a second groove portion of the front-surface-side groove, the second groove portion being located below and in communication with the first groove portion and having a width wider than a width of the first groove portion, and thinning the substrate from a back surface of the substrate up to the second groove portion. The second groove portion is formed by changing an etching condition of the anisotropic dry etching during the formation of the front-surface-side groove so that the width of the second groove portion is wider than the width of the first groove portion.