Abstract: Disclosed are a low-cost radio wave-transmitting decorative film which has excellent stretch moldability, radio wave transmissibility, and mirror-like metallic gloss that does not easily disappear, and a decorative member employing the radio wave-transmitting decorative film. Specifically disclosed are a decorative film which includes a first polymer film, a second polymer film, and a light-reflecting layer which is arranged between the polymer films and formed by the physical vapor deposition of an alloy of silicon and a metal, and a decorative member in which the decorative film is provided on the surface of a base.

Abstract: There is provided a radio wave transmitting decorative member which has radio wave transmitting properties as well as mirror-surface like metallic luster, the radio wave transmitting decorative member which hardly loses its metallic luster and which can be produced at a low cost. More specifically, disclosed is a radio wave transmitting decorative member including a substrate, and a light reflecting layer provided on top of the substrate and formed of an alloy composed of either silicon or germanium and a metal, wherein the light reflecting layer is preferably a deposition film formed by a physical vapor deposition of an alloy composed of either silicon or germanium and a metal.

Abstract: A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings penetrating in a thickness direction of the electromagnetic wave shielding layer are provided in the electromagnetic wave shielding layer.

Abstract: Provided are: a cover-lay film which has an electromagnetic wave shielding function and excellent flexibility, enables a reduction in the thickness of a flexible printed wiring board, and eliminates the necessity of connecting a layer for shielding electromagnetic noise, to the ground circuit of the flexible printed wiring board; a method for manufacturing the same; and a flexible printed wiring board. Employed is a cover-lay film including: a base material film which has a roughened surface (textured surface) created on at least a part of one surface, and an unroughened surface (non-textured surface) excluding the roughened surface; and a deposition film made of a conductive material which is formed on a surface of the base material film on the side where the roughened surface has been created.

Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.

Abstract: The radio wave transmitting decorative member and the method of producing thereof efficiently and stably of the present invention is provided with radio wave transmitting properties as well as mirror-surface like metallic luster, hardly loses its metallic luster, and can be produced at a low cost. The method of producing a radio wave transmitting decorative member, having a substrate, a transparent organic material layer, and a light reflecting layer formed of an alloy composed of either silicon or germanium and a metal provided between the substrate and the transparent organic material layer; wherein the light reflecting layer is formed from a target having an alloy composed of either silicon or germanium, and of a metal with the use of a DC magnetrons sputtering.

Abstract: A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings penetrating in a thickness direction of the electromagnetic wave shielding layer are provided in the electromagnetic wave shielding layer.

Abstract: A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.

Abstract: A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.

Abstract: A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.

Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.

Abstract: The invention provides a transmission noise suppressing structure and a wiring board capable of suppressing a transmission noise transferred through a power supply line, stabilizing a power supply voltage, and reducing signal transmission line cross talk transmitted through the power supply line or a ground layer without being affected by a resistive layer. A transmission noise suppressing structure includes a power supply line and a signal transmission line arranged apart from each other on the same surface; a ground layer arranged apart from the power supply line and the signal transmission line; and a resistive layer arranged apart from the power supply line and the ground layer. The resistive layer has an area (I) which faces the power supply line and an area (II) which does not face the power supply line. The resistive layer and the signal transmission line are apart from each other.

Abstract: An optical transceiver of the present invention comprising an OSA, a circuit board, and a flexible substrate connecting these, in which the flexible substrate has high-speed signal lines and other lines other than the high speed signal lines provided separated from each other on the same surface, a ground layer placed apart and opposite these, and a resistive layer placed apart and opposite the high-speed signal lines, the other lines and the ground layer. High-speed signal and the resistive layer are opposite at least a part of the other lines.

Abstract: Disclosed are a low-cost radio wave-transmitting decorative film which has excellent stretch moldability, radio wave transmissibility, and mirror-like metallic gloss that does not easily disappear, and a decorative member employing the radio wave-transmitting decorative film. Specifically disclosed are a decorative film which includes a first polymer film, a second polymer film, and a light-reflecting layer which is arranged between the polymer films and formed by the physical vapor deposition of an alloy of silicon and a metal, and a decorative member in which the decorative film is provided on the surface of a base.

Abstract: The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 ?m or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member.

Abstract: Provided are: a cover-lay film which has an electromagnetic wave shielding function and excellent flexibility, enables a reduction in the thickness of a flexible printed wiring board, and eliminates the necessity of connecting a layer for shielding electromagnetic noise, to the ground circuit of the flexible printed wiring board; a method for manufacturing the same; and a flexible printed wiring board. Employed is a cover-lay film including: a base material film which has a roughened surface (textured surface) created on at least a part of one surface, and an unroughened surface (non-textured surface) excluding the roughened surface; and a deposition film made of a conductive material which is formed on a surface of the base material film on the side where the roughened surface has been created.

Abstract: The radio wave transmitting decorative member and the method of producing thereof efficiently and stably of the present invention is provided with radio wave transmitting properties as well as mirror-surface like metallic luster, hardly loses its metallic luster, and can be produced at a low cost. The method of producing a radio wave transmitting decorative member, having a substrate, a transparent organic material layer, and a light reflecting layer formed of an alloy composed of either silicon or germanium and a metal provided between the substrate and the transparent organic material layer; wherein the light reflecting layer is formed from a target having an alloy composed of either silicon or germanium, and of a metal with the use of a DC magnetrons sputtering.

Abstract: A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.

Abstract: There is provided a radio wave transmitting decorative member which has radio wave transmitting properties as well as minor-surface like metallic luster, the radio wave transmitting decorative member which hardly loses its metallic luster and which can be produced at a low cost. More specifically, disclosed is a radio wave transmitting decorative member including a substrate, and a light reflecting layer provided on top of the substrate and formed of an alloy composed of either silicon or germanium and a metal, wherein the light reflecting layer is preferably a deposition film formed by a physical vapor deposition of an alloy composed of either silicon or germanium and a metal.

Abstract: The invention provides a transmission noise suppressing structure and a wiring board capable of suppressing a transmission noise transferred through a power supply line, stabilizing a power supply voltage, and reducing signal transmission line cross talk transmitted through the power supply line or a ground layer without being affected by a resistive layer. A transmission noise suppressing structure includes a power supply line and a signal transmission line arranged apart from each other on the same surface; a ground layer arranged apart from the power supply line and the signal transmission line; and a resistive layer arranged apart from the power supply line and the ground layer. The resistive layer has an area (I) which faces the power supply line and an area (II) which does not face the power supply line. The resistive layer and the signal transmission line are apart from each other.