Patents by Inventor Tsutomu Sahoda
Tsutomu Sahoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9236283Abstract: A chamber apparatus including a chamber which accommodates a substrate having a coating film formed thereon; a first heating part which is accommodated in the chamber and disposed on a first face side of the substrate; a second heating part which is accommodated in the chamber and disposed on a second face side of the substrate opposite to the first face; and a pressure control part which is capable of pressurizing and depressurizing inside of the chamber in a heated state.Type: GrantFiled: March 12, 2013Date of Patent: January 12, 2016Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Tsutomu Sahoda, Yoshiaki Masu, Takashi Maruyama
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Patent number: 9214372Abstract: A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. A carrying device has a constitution in which a suction portion suctioning and holding a substrate is rotatable about an arm portion provided in a base portion and the substrate is rotated in the state where the substrate is held by a holding portion. A coating device has a constitution in which a liquid material is ejected from a nozzle to both surfaces of the substrate rotating in an upright state.Type: GrantFiled: August 25, 2009Date of Patent: December 15, 2015Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Tsutomu Sahoda, Futoshi Shimai, Akihiko Sato
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Patent number: 9027504Abstract: A heating apparatus including: a first heating part and a second heating part between which a substrate having a coating film is disposed at a substrate position in the film thickness direction; and a distance control part which controls at least one of a first distance between the substrate position and the first heating part and a second distance between the substrate position and the second heating part.Type: GrantFiled: May 31, 2012Date of Patent: May 12, 2015Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Hidenori Miyamoto, Tsutomu Sahoda
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Patent number: 9010270Abstract: Provided is a coating device including: a substrate carrying unit which rotatably holds a substrate while the substrate is upright and is able to dispose the held substrate at a first position and a second position; an application unit which includes a liquid material nozzle ejecting a liquid material to each of first and second surfaces of the substrate disposed at the first position; and a removal unit which includes an accommodation mechanism accommodating a part of the peripheral edge portion of the substrate disposed at the second position and a cleaning liquid ejection mechanism ejecting a cleaning liquid to the peripheral edge portion and removes the liquid material of the peripheral edge portion.Type: GrantFiled: May 26, 2011Date of Patent: April 21, 2015Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Futoshi Shimai, Akihiko Sato, Tsutomu Sahoda, Kenji Maruyama
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Publication number: 20150060434Abstract: Provided is a chamber apparatus which includes a chamber, in a part of which an internal space capable of accommodating a substrate therein is formed, a heating portion which heats the substrate disposed in the internal space, and a temperature adjustment portion which adjusts the temperature of a part of the chamber, which is in contact with the internal space.Type: ApplicationFiled: August 1, 2014Publication date: March 5, 2015Inventors: Tsutomu Sahoda, Yoshiaki Masu, Hidenori Miyamoto, Yubun Kikuchi
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Patent number: 8919756Abstract: A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. A carrying device has a constitution in which a suction portion suctioning and holding a substrate is rotatable about an arm portion provided in a base portion and the substrate is rotated in the state where the substrate is held by a holding portion. A coating device has a constitution in which a liquid material is ejected from a nozzle to both surfaces of the substrate rotating in an upright state.Type: GrantFiled: September 8, 2010Date of Patent: December 30, 2014Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Tsutomu Sahoda, Futoshi Shimai, Akihiko Sato
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Publication number: 20140370451Abstract: A heating apparatus including: a heating part which heats a substrate having coated thereon a liquid material containing a metal and a solvent, and a thermocouple which is disposed to contact a portion of the heating part and has at least a surface of a contact portion contacting the heating part covered with a protection film.Type: ApplicationFiled: June 18, 2013Publication date: December 18, 2014Inventors: Tsutomu Sahoda, Yoshiaki Masu, Hidenori Miyamoto, Yubun Kikuchi
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Publication number: 20140363903Abstract: A substrate treating apparatus including: a chamber capable of accommodating a substrate; a treating part which conducts a predetermined treatment associated with forming a coating film containing a metal to the substrate accommodated in the chamber; and a detection part which detects a concentration of a predetermined gas containing a chalcogen element within a gas inside the chamber.Type: ApplicationFiled: June 10, 2013Publication date: December 11, 2014Applicant: Tokyo Ohta Kogyo Co., Ltd.Inventors: Hidenori Miyamoto, Yubun Kikuchi, Tsutomu Sahoda, Yoshiaki Masu
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Publication number: 20140263273Abstract: A chamber apparatus including a chamber which accommodates a substrate having a coating film formed thereon; a first heating part which is accommodated in the chamber and disposed on a first face side of the substrate; a second heating part which is accommodated in the chamber and disposed on a second face side of the substrate opposite to the first face; and a pressure control part which is capable of pressurizing and depressurizing inside of the chamber in a heated state.Type: ApplicationFiled: March 12, 2013Publication date: September 18, 2014Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Tsutomu Sahoda, Yoshiaki Masu, Takashi Maruyama
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Patent number: 8807072Abstract: Provided is a coating device including: a rotating part which rotatably holds a substrate while the substrate is upright; a cup portion disposed to surround an outer periphery of the substrate held by the rotating part and having an opening which exposes a first surface and a second surface of the substrate; a coating part which includes a nozzle ejecting a liquid material to the first surface and to the second surface of the substrate through the opening; and a cover portion which is provided on the first surface and the second surface sides of the substrate and by which the opening is opened and closed.Type: GrantFiled: October 3, 2011Date of Patent: August 19, 2014Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Futoshi Shimai, Tsutomu Sahoda, Akihiko Sato, Kenji Maruyama
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Patent number: 8667924Abstract: A coating device including a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of the substrate while rotating a substrate in an upright state, and a nozzle managing mechanism which manages the state of the nozzles, in which the nozzle managing mechanism includes a soaking portion which dips the front end of the nozzle in a soak solution, and a discharging portion which discharges at least the soak solution, and a nozzle managing method.Type: GrantFiled: June 25, 2010Date of Patent: March 11, 2014Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Tsutomu Sahoda, Futoshi Shimai, Akihiko Sato
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Publication number: 20140017407Abstract: A coating device including a substrate carrying unit which rotatably holds a substrate while the substrate is upright and is able to dispose the held substrate at a first position and a second position; an application unit which includes a liquid material nozzle ejecting a liquid material to each of first and second surfaces of the substrate disposed at the first position; and a removal unit which includes an accommodation mechanism accommodating a part of the peripheral edge portion of the substrate disposed at the second position and a cleaning liquid ejection mechanism ejecting a cleaning liquid to the peripheral edge portion and removes the liquid material of the peripheral edge portion.Type: ApplicationFiled: September 9, 2013Publication date: January 16, 2014Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Futoshi Shimai, Akihiko Sato, Tsutomu Sahoda, Kenji Maruyama
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Patent number: 8617655Abstract: A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of a substrate while rotating the substrate; and an adjusting mechanism which adjusts the coating state of the liquid material at the outer periphery of the substrate; wherein the adjusting mechanism includes a dip portion which dips the outer periphery of the substrate in a solution while rotating the substrate and dissolves; and a suction portion which suctions the vicinity of the outer periphery of the substrate after dipping in the solution.Type: GrantFiled: May 10, 2010Date of Patent: December 31, 2013Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Tsutomu Sahoda, Futoshi Shimai, Akihiko Sato
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Patent number: 8567342Abstract: A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of a substrate while rotating the substrate; and an adjusting mechanism which adjusts the coating state of the liquid material at the outer periphery of the substrate; wherein the adjusting mechanism includes a dip portion which dips the outer periphery of the substrate in a solution while rotating the substrate and dissolves and removes a thin film formed on the outer periphery of the substrate; and a suction portion which suctions the vicinity of the outer periphery of the substrate after dipping in the solution.Type: GrantFiled: July 30, 2010Date of Patent: October 29, 2013Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Tsutomu Sahoda, Futoshi Shimai, Akihiko Sato
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Patent number: 8387556Abstract: A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of the substrate while rotating a substrate in an upright state at a predetermined coating position, a carrying mechanism which carries the substrate between a substrate loading position, the coating position, and a substrate unloading position, and a dummy substrate holding mechanism which holds a dummy substrate at a holding position which is a position different from the substrate loading position, the coating position, and the substrate unloading position, and at which the carrying mechanism is allowed to connect with the dummy substrate.Type: GrantFiled: June 25, 2010Date of Patent: March 5, 2013Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Tsutomu Sahoda, Futoshi Shimai, Akihiko Sato
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Publication number: 20120304921Abstract: A heating apparatus including: a first heating part and a second heating part between which a substrate having a coating film is disposed at a substrate position in the film thickness direction; and a distance control part which controls at least one of a first distance between the substrate position and the first heating part and a second distance between the substrate position and the second heating part.Type: ApplicationFiled: May 31, 2012Publication date: December 6, 2012Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Hidenori Miyamoto, Tsutomu Sahoda
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Publication number: 20120308715Abstract: A coating apparatus including: a coating part having a nozzle which ejects a liquid material containing an oxidizable metal and a solvent to a substrate; a supplying system which supplies the liquid material to the coating part; and a recycling system which recovers the liquid material from at least one of the supplying system and the coating part, and supplies the recovered liquid material to at least one of the supplying system and the coating part.Type: ApplicationFiled: May 31, 2012Publication date: December 6, 2012Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Hidenori Miyamoto, Tsutomu Sahoda
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Publication number: 20120309179Abstract: A substrate treating apparatus including: a first chamber having a coating part which forms a coating film of a liquid material containing an oxidizable metal and a solvent on a substrate; a second chamber having a first heating part which heats the coating film; and a connection part which connects the first chamber and the second chamber, wherein the connection part is provided with a second heating part which heats the coating film coated on the substrate and a pressure control part which controls the pressure around the coating film.Type: ApplicationFiled: May 31, 2012Publication date: December 6, 2012Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Hidenori Miyamoto, Tsutomu Sahoda
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Publication number: 20120238075Abstract: A coating apparatus including a coating part which applies a liquid material containing an oxidizable metal and a solvent to a substrate; a chamber having a coating space in which the coating part applies the liquid material to the substrate and a transport space into which the substrate is transported; and a removal part which removes the liquid material from the atmosphere inside the chamber when a concentration of the solvent in the atmosphere inside the chamber exceeds a threshold value.Type: ApplicationFiled: March 6, 2012Publication date: September 20, 2012Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Hidenori Miyamoto, Tsutomu Sahoda
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Publication number: 20120079983Abstract: Provided is a coating device including: a rotating part which rotatably holds a substrate while the substrate is upright; a cup portion disposed to surround an outer periphery of the substrate held by the rotating part and having an opening which exposes a first surface and a second surface of the substrate; a coating part which includes a nozzle ejecting a liquid material to the first surface and to the second surface of the substrate through the opening; and a cover portion which is provided on the first surface and the second surface sides of the substrate and by which the opening is opened and closed.Type: ApplicationFiled: December 7, 2011Publication date: April 5, 2012Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Futoshi Shimai, Tsutomu Sahoda, Akihiko Sato, Kenji Maruyama