Patents by Inventor Tsutomu Sakatsu

Tsutomu Sakatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid-state imaging device and method of production of the same
    Patent number: 6472247
    Abstract: In a solid-state imaging device and its production method according to the present invention, a solid-state image sensor has an effective light-receiving region on a circuit formation surface provided in a face-down condition. A transparent substrate has a conductor pattern provided thereon to confront the circuit formation surface of the image sensor. A transparent adhesive agent is provided between the image sensor and the substrate and formed into a thin layer, the adhesive agent covering the light-receiving region of the image sensor. A plurality of bumps are provided on one of the image sensor and the substrate to interconnect the image sensor and the conductor pattern of the substrate.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: October 29, 2002
    Assignee: Ricoh Company, Ltd.
    Inventors: Jun Andoh, Yoshihiro Morii, Toshio Kobayashi, Akio Yashiba, Hiroshi Takemoto, Takeshi Sano, Tsutomu Sakatsu
  • Conductive particle arranging device and conductive particle transferring method using the same
    Patent number: 6247640
    Abstract: A device for arranging conductive particles in a preselected pattern for the connection of electric circuit boards or electric parts is disclosed. Particularly, a device capable of surely and efficiently transferring, e.g., solder bumps to the electrode pads of a semiconductor chip or the leads of a TAB (Tape Automated Bonding) tape and a conductive particle transferring method using the same are disclosed.
    Type: Grant
    Filed: January 12, 2000
    Date of Patent: June 19, 2001
    Assignee: Ricoh Company, Ltd.
    Inventors: Satoshi Kuwazaki, Kazushi Iwata, Yoshihiro Yoshida, Tsutomu Sakatsu, Toshiaki Iwafuchi
  • Conductive particle transferring method
    Patent number: 6063701
    Abstract: A process for manufacturing a device for arranging conductive particles in a preselected pattern for the connection of electric circuit boards or electric parts is disclosed. Particularly, a device capable of surely and efficiently transferring, e.g., solder bumps to the electrode pads of a semiconductor chip or the leads of a TAB (Tape Automated Bonding) tape and a conductive particle transferring method using the same are disclosed.
    Type: Grant
    Filed: September 15, 1997
    Date of Patent: May 16, 2000
    Assignee: Ricoh Company, Ltd.
    Inventors: Satoshi Kuwazaki, Kazushi Iwata, Yoshihiro Yoshida, Tsutomu Sakatsu, Toshiaki Iwafuchi
  • Method for arranging conductive particles on electrodes of substrate
    Patent number: 5616206
    Abstract: A method for arranging conductive particles on electrodes of a substrate, which electrically connect with electrodes of an electric part via the conductive particles. An adhesive layer is formed on the electrodes. Conductive particles are arranged on the adhesive layer in a predetermined pattern. Then, the conductive particles on said electrodes of a substrate are affixed thereon.
    Type: Grant
    Filed: June 16, 1994
    Date of Patent: April 1, 1997
    Assignee: Ricoh Company, Ltd.
    Inventors: Tsutomu Sakatsu, Yoshihiro Yoshida