Abstract: A semiconductor device includes a first terminal, a second terminal, and a plurality of third terminals on a substrate. Memory chips are stacked on the substrate in an offset manner. Each memory chip has first pads, second pads, and third pads thereon. A first bonding wire is electrically connected to the first terminal and physically connected to a first pad of each memory chip. A second bonding wire is electrically connected to the second terminal and physically connected to a second pad of each memory chip. A third bonding wire electrically connects one third terminal to a third pad on each memory chip. A fourth bonding wire is connected to the first bonding wire at a first pad on a first memory chip of the stack and another first pad on the first memory chip. The fourth bonding wire straddles over the second bonding wire and the third bonding wire.

Abstract: According to one embodiment, a semiconductor device includes a first electrode, a second electrode, and a wire extending between the first electrode and the second electrode. The wire includes a first conductor in contact with the first electrode and the second electrode, and a second conductor that is provided inside the first conductor and has no contact with the first electrode and the second electrode.

Abstract: A semiconductor device includes a semiconductor chip having an electrode pad, a terminal having a terminal pad, and a bonding wire. The bonding wire includes a first end portion, a first bonded portion bonded to the electrode pad, a loop portion extending between the semiconductor chip and the terminal, and a second bonded portion bonded to the terminal pad. The second bonded portion is a wedge bonded portion comprising a second end portion of the bonding wire opposite to the first end portion. A length of the first bonded portion in the first direction is greater than a length of the second bonded portion in the first direction.

Abstract: A semiconductor device includes a semiconductor chip having an electrode pad, a terminal having a terminal pad, and a bonding wire. The bonding wire includes a first end portion, a first bonded portion bonded to the electrode pad, a loop portion extending between the semiconductor chip and the terminal, and a second bonded portion bonded to the terminal pad. The second bonded portion is a wedge bonded portion comprising a second end portion of the bonding wire opposite to the first end portion. A length of the first bonded portion in the first direction is greater than a length of the second bonded portion in the first direction.

Abstract: A semiconductor device includes a first terminal, a second terminal, and a plurality of third terminals on a substrate. Memory chips are stacked on the substrate in an offset manner. Each memory chip has first pads, second pads, and third pads thereon. A first bonding wire is electrically connected to the first terminal and physically connected to a first pad of each memory chip. A second bonding wire is electrically connected to the second terminal and physically connected to a second pad of each memory chip. A third bonding wire electrically connects one third terminal to a third pad on each memory chip. A fourth bonding wire is connected to the first bonding wire at a first pad on a first memory chip of the stack and another first pad on the first memory chip. The fourth bonding wire straddles over the second bonding wire and the third bonding wire.

Abstract: According to one embodiment, a semiconductor device includes a first electrode, a second electrode, and a wire extending between the first electrode and the second electrode. The wire includes a first conductor in contact with the first electrode and the second electrode, and a second conductor that is provided inside the first conductor and has no contact with the first electrode and the second electrode.

Abstract: A semiconductor device of an embodiment includes a substrate including a semiconductor element, a first electrode on the substrate and electrically connected to the semiconductor element, a second electrode on the substrate and electrically connected to the semiconductor element, and a terminal spaced from the first electrode, the substrate, and the second electrode. A first bonding wire has a first bonding portion bonded to the second electrode at a first end and a second bonding portion bonded to the terminal at a second end. A second bonding wire has a third bonding portion bonded to the second electrode at a first end and a fourth bonding portion bonded to the terminal at a second end. Each of the first and second bonding wires comprise copper and have a diameter less than or equal to 100 ?m.

Abstract: A latch circuit includes a node configured to store a logic state indicating a value 1 or 0, a detection circuit configured to detect an inversion of the logic state at the node, and a switching circuit configured to switch, when the inversion of the logic state is detected, an output path that outputs the logic state at the node to another path that outputs an original logic state before the inversion of the logic state is detected.

Abstract: In a case where a cellular phone exists outside a WOS system service area, the cellular phone receives a not-connectable signal and an audio message from a mobile switching controller. The cellular phone conducts disconnection processing with the not-connectable signal as a turning point. Moreover, the cellular phone stores an extension number and converts a dedicated special number into an external number for retransmission, thus establishing connection to a PBX. After the reception of a connection-accepted signal and an automatic exchange answer message from the PBX, the cellular phone automatically transmits the stored extension number.

Abstract: The pattern matching processing system includes: a recognition pattern-storage unit which stores a first image data obtained by picking up an image of at least a portion of a lead frame or a substrate of a first object and the second image data obtained by picking up an image of at least a portion of a lead frame of a second object that is different from the first object, respectively, and also stores one of the first image data and the second image data as an ordinary recognition pattern, and the other as an auxiliary recognition pattern; and a recognition unit, which recognizes input image data by a first pattern matching with the ordinary recognition pattern stored in the recognition pattern-storage unit, and also carries out the second pattern matching with the auxiliary recognition pattern when an error is caused in the first pattern matching.

Abstract: A bonding apparatus includes: a storage unit that stores bonding conditions of a ball; a detection unit that detects a first position on a Z axis of a capillary with the ball coming into contact with a semiconductor element and detects a second position on the Z axis of the capillary when the ball at the tip end of the capillary is bonded to the semiconductor element; a calculation unit that calculates a collapse amount of the ball which is a difference between the first position and the second position detected by the detection unit and a bonding time and calculates a collapse amount of the ball for a predetermined period; and a first adjustment unit that adjusts the bonding conditions when the collapse amount of the ball for a predetermined period is outside a predetermined numerical range.

Abstract: In a technique connecting between bonding pads of semiconductor chips, contact between wires is prevented. A semiconductor device of the present embodiment is provided with a semiconductor chip 1 in which a plurality of bonding pads 3 are arranged in line, a semiconductor chip 2 in which a plurality of bonding pads 4 are arranged in line substantially parallel to the plurality of bonding pads 3, and a plurality of wires 7 which connect the bonding pads 3 to the bonding pads 4 respectively. At least one of the wires 7 is bended with respect to a reference straight line S which passes through the bonding pad 3 and the bonding pad 4 which are connected by the wire 7. The bended wire is extended out from the bonding pad 4 in a certain direction in which a distance between the bended wire and an adjacent wire which is adjacent to the bended wire is larger than a distance between the reference straight line of the bended wire and the reference straight line of the adjacent wire.

Abstract: In a case where a cellular phone exists outside a WOS system service area, the cellular phone receives a not-connectable signal and an audio message from a mobile switching controller. The cellular phone conducts disconnection processing with the not-connectable signal as a turning point. Moreover, the cellular phone stores an extension number and converts a dedicated special number into an external number for retransmission, thus establishing connection to a PBX. After the reception of a connection-accepted signal and an automatic exchange answer message from the PBX, the cellular phone automatically transmits the stored extension number.

Abstract: The pattern matching processing system includes: a recognition pattern-storage unit which stores a first image data obtained by picking up an image of at least a portion of a lead frame or a substrate of a first object and the second image data obtained by picking up an image of at least a portion of a lead frame of a second object that is different from the first object, respectively, and also stores one of the first image data and the second image data as an ordinary recognition pattern, and the other as an auxiliary recognition pattern; and a recognition unit, which recognizes input image data by a first pattern matching with the ordinary recognition pattern stored in the recognition pattern-storage unit, and also carries out the second pattern matching with the auxiliary recognition pattern when an error is caused in the first pattern matching.

Abstract: In a technique connecting between bonding pads of semiconductor chips, contact between wires is prevented. A semiconductor device of the present embodiment is provided with a semiconductor chip 1 in which a plurality of bonding pads 3 are arranged in line, a semiconductor chip 2 in which a plurality of bonding pads 4 are arranged in line substantially parallel to the plurality of bonding pads 3, and a plurality of wires 7 which connect the bonding pads 3 to the bonding pads 4 respectively. At least one of the wires 7 is bended with respect to a reference straight line S which passes through the bonding pad 3 and the bonding pad 4 which are connected by the wire 7. The bended wire is extended out from the bonding pad 4 in a certain direction in which a distance between the bended wire and an adjacent wire which is adjacent to the bended wire is larger than a distance between the reference straight line of the bended wire and the reference straight line of the adjacent wire.

Abstract: In a case where a cellular phone exists outside a WOS system service area, the cellular phone receives a not-connectable signal and an audio message from a mobile switching controller. The cellular phone conducts disconnection processing with the not-connectable signal as a tuning point. Moreover, the cellular phone stores an extension number and converts a dedicated special number into an external number for retransmission, thus establishing connection to a PBX. After the reception of a connection-accepted signal and an automatic exchange answer message from the PBX, the cellular phone automatically transmits the stored extension number.

Abstract: An information delivery system having a service section; a plurality of nodes connected to the service section through a network and allocated with specific addresses that are unique within the network; and terminal devices for system users connected to the service section and the plurality of nodes through the network; wherein the service section acquires profile data of each node user through each node and analyzes the person profile data in order to mediate between each node user and each system user according to the profile data to help exchange information.

Abstract: An information delivery system having a service section; a plurality of nodes connected to the service section through a network and allocated with specific addresses that are unique within the network; and terminal devices for system users connected to the service section and the plurality of nodes through the network; wherein the service section acquires profile data of each node user through each node and analyzes the person profile data in order to mediate between each node user and each system user according to the profile data to help exchange information.

Abstract: An apparatus for supplying a resin material to molds of a resin press molding machine includes a supply cylinder for supplying the resin material to the molds, resin material charge hopper mounted to the supply cylinder, a plunger for extruding the resin material within the supply cylinder, a drive device for moving forward and backward the plunger in an axial direction, an opening and closing device for opening and closing an opening of a fore end of the supply cylinder, and a die positioned between the opening and closing device and the molds to form the resin material into a predetermined shape.

Abstract: An elevator apparatus includes an electric motor for driving the elevator apparatus, an elevator cage adapted to be lifted or lowered by the electric motor, a brake device for holding and retaining an elevator driving system, including the electric motor, and a malfunction detecting device responsive to the application of a torque to a retainer section of the brake device during the lifting or lowering of the elevator cage.