Publication number: 20120038042
Abstract: A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a BGA, and the surface of a solder bump after a burn-in test of a BGA. Specifically disclosed are: a lead-free solder alloy; a solder ball; and an electronic member comprising a solder bump, containing at least one additive element selected from Li, Na, K, Ca, Be, Mg, Sc, Y, lanthanoid series elements, Ti, Zr, Hf, Nb, Ta, Mo, Zn, Al, Ga, In, Si and Mn in the total amount of 1 ppm by mass to 0.1% by mass inclusive, with the remainder being 40% by mass or more of Sn.
Type:
Application
Filed:
April 12, 2010
Publication date:
February 16, 2012
Applicants:
Nippon Micrometal Corporation, Nippon Steel Materials Co., Ltd.
Inventors:
Tsutomu Sasaki, Shinichi Terashima, Masamoto Tanaka, Katsuichi Kimura