Patents by Inventor Tsutomu Sawai
Tsutomu Sawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180238749Abstract: A force sensor unit having a simple structure to allow ready assembling and easy downsizing of the force sensor unit. The force sensor unit includes a cylindrical body, a substrate that blocks one end of the cylindrical body, a force sensor that is supported on the substrate, and a force transmission mechanism that is disposed in an internal space of the cylindrical body to transmit a force to the force sensor. The force transmission mechanism includes a contact member, a coil spring, and an operated member. These members are arranged in order in the internal space of the cylindrical body, and are not adhered to nor engaged with each other. The members except the substrate are simply fitted loosely in the internal space of the cylindrical body, thereby facilitating assembling of the force sensor unit and enabling downsizing of the force sensor unit.Type: ApplicationFiled: January 12, 2016Publication date: August 23, 2018Inventors: Masashi Doko, Tsutomu Sawai, Hiroki Hayashi
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Patent number: 9983074Abstract: A force detector capable of preventing short-circuit fault between electrodes and allowing for downsizing. A prescribed region encompasses a projection region defined by projecting a deformation region of a force sensor element, which is deformed when a force transmission member applies a force to the force sensor element, onto a base substrate. A plurality of terminals are provided by four soldering land electrodes formed, respectively, at four corners of the base substrate. The soldering land electrodes are shaped such that a portion of each soldering land electrode is located within the projection region to form a soldering portion.Type: GrantFiled: June 26, 2015Date of Patent: May 29, 2018Assignee: HOKURIKU ELECTRIC INDUSTRY CO., LTD.Inventors: Masayoshi Minami, Tsutomu Sawai
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Publication number: 20170160149Abstract: A force detector capable of preventing short-circuit fault between electrodes and allowing for downsizing. A prescribed region encompasses a projection region defined by projecting a deformation region of a force sensor element, which is deformed when a force transmission member applies a force to the force sensor element, onto a base substrate. A plurality of terminals are provided by four soldering land electrodes formed, respectively, at four corners of the base substrate. The soldering land electrodes are shaped such that a portion of each soldering land electrode is located within the projection region to form a soldering portion.Type: ApplicationFiled: June 26, 2015Publication date: June 8, 2017Inventors: Masayoshi Minami, Tsutomu Sawai
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Patent number: 8173472Abstract: A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L1 of a weight portion 5 and an additional weight portion 3 as measured in an extending direction of a centerline C is determined to be shorter than a length L2 of a support portion 7 as measured in the extending direction of the centerline C. The weight portion 5 and the additional weight portion 3 are received within a space 15 defined, being surrounded by the support portion 7. Then, dimensions and shapes of the weight portion 5 and the additional weight portion 3 are determined to allow the weight portion 5 and the additional weight portion 3 to move within the space 15.Type: GrantFiled: January 24, 2011Date of Patent: May 8, 2012Assignee: Hokuriku Electric Industry Co., Ltd.Inventors: Tsutomu Sawai, Kazuya Komori
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Publication number: 20110117689Abstract: A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L1 of a weight portion 5 and an additional weight portion 3 as measured in an extending direction of a centerline C is determined to be shorter than a length L2 of a support portion 7 as measured in the extending direction of the centerline C. The weight portion 5 and the additional weight portion 3 are received within a space 15 defined, being surrounded by the support portion 7. Then, dimensions and shapes of the weight portion 5 and the additional weight portion 3 are determined to allow the weight portion 5 and the additional weight portion 3 to move within the space 15.Type: ApplicationFiled: January 24, 2011Publication date: May 19, 2011Applicant: HOKURIKU ELECTRIC INDUSTRY CO., LTD.Inventors: Tsutomu Sawai, Kazuya Komori
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Publication number: 20090289315Abstract: A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L1 of a weight portion 5 and an additional weight portion 3 as measured in an extending direction of a centerline C is determined to be shorter than a length L2 of a support portion 7 as measured in the extending direction of the centerline C. The weight portion 5 and the additional weight portion 3 are received within a space 15 defined, being surrounded by the support portion 7. Then, dimensions and shapes of the weight portion 5 and the additional weight portion 3 are determined to allow the weight portion 5 and the additional weight portion 3 to move within the space 15.Type: ApplicationFiled: December 20, 2006Publication date: November 26, 2009Applicant: HOKURIKU ELECTRIC INDUSTRY CO., LTD.Inventors: Tsutomu Sawai, Komori Kazuya
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Patent number: 7122396Abstract: The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is accordingly increased. An inner peripheral surface of a support portion 9 is constituted by four trapezoidal inclined surfaces 13 of a substantially identical shape which are annularly combined so as to define an outer peripheral surface of a frust-pyramidal space. A weight 3 is so constructed as to have an abutting portion including a linear portion 3d which abuts against the inclined surfaces 13 constituting the inner peripheral surface of the support portion 9 when the weight 3 makes a maximum displacement in a direction where a diaphragm portion 11 is located. The abutting portion 3d has a circular outline shape as seen from a side where a weight fixing portion 7 is located.Type: GrantFiled: October 3, 2003Date of Patent: October 17, 2006Assignee: Hokuriku Electric Industry Co., Ltd.Inventors: Yoshiyuki Nakamizo, Tsutomu Sawai, Masato Ando
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Publication number: 20060094148Abstract: The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is accordingly increased. An inner peripheral surface of a support portion 9 is constituted by four trapezoidal inclined surfaces 13 of a substantially identical shape which are annularly combined so as to define an outer peripheral surface of a frust-pyramidal space. A weight 3 is so constructed as to have an abutting portion including a linear portion 3d which abuts against the inclined surfaces 13 constituting the inner peripheral surface of the support portion 9 when the weight 3 makes a maximum displacement in a direction where a diaphragm portion 11 is located. The abutting portion 3d has a circular outline shape as seen from a side where a weight fixing portion 7 is located.Type: ApplicationFiled: October 3, 2003Publication date: May 4, 2006Applicant: Hokuriku Electric Industry Co., LtdInventors: Yoshiyuki Nakamizo, Tsutomu Sawai, Masato Ando
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Patent number: 6321600Abstract: An acceleration detecting device capable of permitting a weight, a diaphragm and a base to be precisely positioned on a casing of a measuring equipment or the like. The weight, diaphragm and base are integrally formed of a metal material into a single unit. An insulating casing is integrally formed while incorporating the single unit as an insert therein. The insulating casing has a recess defined by a side wall thereof, which is formed with a window for exposing a part of the base therethrough. The recess of the casing is closed with a metal cover member, which is mounted on the casing. The cover member is integrally provided with a contactor which is elastically forced against the base through the window. The base is electrically connected to ground terminals of terminal fitments.Type: GrantFiled: July 26, 1999Date of Patent: November 27, 2001Assignee: Hokuriku Electric Industry Co., Ltd.Inventors: Shigeru Hirose, Masato Ando, Yoshiyuki Nakamizo, Takeshi Arikura, Tsutomu Sawai
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Patent number: D816525Type: GrantFiled: February 7, 2017Date of Patent: May 1, 2018Assignee: HOKURIKU ELECTRIC INDUSTRY CO., LTD.Inventors: Tsutomu Sawai, Hiroki Hayashi