Patents by Inventor Tsutomu Shibuya

Tsutomu Shibuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071584
    Abstract: A medical information system includes a processor on a side of a medical image diagnostic device. The processor acquires supplementary information as structured information associated with image data acquired using the medical image diagnostic device, the supplementary information being new information on a subject to be imaged. The processor notifies at least one management server that manages patient information of the supplementary information via a network in response to the acquisition of the supplementary information, the patient information being information unique to the subject.
    Type: Application
    Filed: August 29, 2023
    Publication date: February 29, 2024
    Applicant: CANON MEDICAL SYSTEMS CORPORATION
    Inventors: Shinya OZAWA, Kensuke SHINODA, Junichiro ARAOKA, Tsutomu IGARASHI, Masato SHIBUYA
  • Patent number: 8059863
    Abstract: The work movement analysis method for dividing a moving picture of a worker's work movement into a plurality of movement sections in an apparatus having display, storage, and processing units includes in the processing unit the steps of: defining a plurality of movement section classification buttons and providing the buttons to an operator; reproducing the moving picture in the display unit; allocating movement section identification information defined by a specific movement section classification button to a moving picture of a work; storing a position of a moving picture in the storage unit as an end position of a movement section; defining an end position of a previous movement section as a start position of the movement section and a reproduction start position of a moving picture of the work movement as the start position in a case of no end position, and dividing the work movement into the movement sections.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: November 15, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Tsutomu Shibuya, Toshiaki Seshimo, Mitsuhiro Ota, Shigeru Fujimori
  • Publication number: 20070282479
    Abstract: The work movement analysis method for dividing a moving picture of a worker's work movement into a plurality of movement sections in an apparatus having display, storage, and processing units includes in the processing unit the steps of: defining a plurality of movement section classification buttons and providing the buttons to an operator; reproducing the moving picture in the display unit; allocating movement section identification information defined by a specific movement section classification button to a moving picture of a work; storing a position of a moving picture in the storage unit as an end position of a movement section; defining an end position of a previous movement section as a start position of the movement section and a reproduction start position of a moving picture of the work movement as the start position in a case of no end position, and dividing the work movement into the movement sections.
    Type: Application
    Filed: February 14, 2007
    Publication date: December 6, 2007
    Applicant: Hitachi, Ltd.
    Inventors: Tsutomu Shibuya, Toshiaki Seshimo, Mitsuhiro Ota, Shigeru Fujimori
  • Patent number: 6423405
    Abstract: There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: July 23, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Tsutomu Shibuya, Kaoru Katayama, Mitugu Shirai, Shinichi Kazui, Hideaki Sasaki, Yasuhiro Iwata
  • Publication number: 20020048664
    Abstract: There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.
    Type: Application
    Filed: August 27, 1999
    Publication date: April 25, 2002
    Inventors: TSUTOMU SHIBUYA, KAORU KATAYAMA, MITUGU SHIRAI, SHINICHI KAZUI, HIDEAKI SASAKI, YASUHIRO IWATA
  • Patent number: 6017424
    Abstract: A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: January 25, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Tsutomu Shibuya, Kaoru Katayama, Mitugu Shirai, Shinichi Kazui, Hideaki Sasaki, Yasuhiro Iwata
  • Patent number: 5801350
    Abstract: A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.
    Type: Grant
    Filed: March 21, 1996
    Date of Patent: September 1, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Tsutomu Shibuya, Kaoru Katayama, Mitugu Shirai, Shinichi Kazui, Hideaki Sasaki, Yasuhiro Iwata