Abstract: A tape cassette that includes a box-shaped cassette case whose outline being defined by a bottom wall, a top wall, and a side wall and including a plurality of corner portions, at least one tape contained within a tape containment area defined within the outline, a pair of cavities extending from the bottom wall and being provided between the tape containment area and the outline at opposite ends of a diagonal line connecting one of the corner portions to another of the corner portions, and a side face indicator portion provided in the side wall, indicating a type of the tape, and including a plurality of indicator portions disposed in a pattern in accordance with the type of the tape, each of the indicator portions being one of a switch hole and a surface portion.

Abstract: A tape cassette that includes a box-shaped cassette case whose outline being defined by a bottom wall, a top wall, and a side wall and including a plurality of corner portions, at least one tape contained within a tape containment area defined within the outline, a pair of cavities extending from the bottom wall and being provided between the tape containment area and the outline at opposite ends of a diagonal line connecting one of the corner portions to another of the corner portions, and a side face indicator portion provided in the side wall, indicating a type of the tape, and including a plurality of indicator portions disposed in a pattern in accordance with the type of the tape, each of the indicator portions being one of a switch hole and a surface portion.

Abstract: An insect repellent is suitable for an anti-tick treatment to living materials such as bedding and carpets with long-term replacement cycles in years and that also has a tick repellent effect stably lasting over a long period of time. The insect repellent contains 2,4-DHAP or xanthoxyline as an active ingredient. 2,4-DHAP and xanthoxyline can stably maintain repellency rates of at least 30-40% and about 90% respectively even if a heating treatment at 150° C. is continued for 5 minutes or longer, that is, for about 3 years in an environment of 25° C.

Abstract: When soldering a package having an electrode on which Ni/Au or Ag—Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn—Ag—Cu series or Sn—Sb series and a solder material of Sn—Ag—Cu—Ni series or Sn—Pb series. The electrode on which Ni/Au or Ag—Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn—Ag—Cu series or Sn—Sb series being attached to the Cu electrode and the solder material of Sn—Ag—Cu—Ni series or Sn—Cu series being attached to the electrode on which Ni/Au or Ag—Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability.

Abstract: When soldering a package having an electrode on which Ni/Au or Ag—Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn—Ag—Cu series or Sn—Sb series and a solder material of Sn—Ag—Cu—Ni series or Sn—Pb series. The electrode on which Ni/Au or Ag—Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn—Ag—Cu series or Sn—Sb series being attached to the Cu electrode and the solder material of Sn—Ag—Cu—Ni series or Sn—Cu series being attached to the electrode on which Ni/Au or Ag—Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability.