Abstract: Provided are a latent heat storage material that functions as a high-capacity heat storage material at a medium-to-low temperature region using a latent heat storage material composition including at least one kind of n-paraffin having 14 to 18 carbon atoms in a total amount of 100 parts by mass (hereinafter referred to as “n-paraffin-based latent heat storage material composition”) that contains, as a supercooling preventing agent, an n-alkyl alcohol and/or an n-alkyl amine having 20 to 24 carbon atoms (hereinafter referred to as “n-paraffin derivative”), and is obtained by the following a) step and b) step, a microcapsule heat storage material containing the latent heat storage material as a core material, and a method for producing the same. a) A step of melting and homogenizing the n-paraffin derivative and the n-paraffin-based latent heat storage material composition at a temperature range of 50 to 100° C.

Abstract: A heating medium composition includes 5 to 40% by mass of biphenyl, 10 to 70% by mass of diphenyl ether, 5 to 30% by mass of diphenylene oxide, and 5 to 30% by mass of naphthalene.

Abstract: A microcapsule having a functional organic compound as a core material and a cross-linked or non-cross-linked polymer as a shell material achieves stabilization and efficiency of expression of function of the core material. Provided is a method for producing a microcapsule that is obtained by a polymerization reaction of at least one species of vinyl monomer using an O/W dispersion containing an organic compound having no vinyl group and the vinyl monomer as raw material, and has a core-shell structure in which a core is the organic compound having no vinyl group and a shell is a polymer of the vinyl monomer, including the step of emulsifying the O/W dispersion by continuously and successively passing the O/W dispersion through a plurality of net bodies that are provided along a flow path and disposed at certain intervals before the polymerization reaction.

Abstract: In a microcapsule having a latent heat storage material having no vinyl group as a core material and a cross-linked polymer as a shell material, functions of the latent heat storage material is stably and efficiently expressed.

Abstract: A heating medium composition includes biphenyl (A), diphenylene oxide (B), and at least one or more aromatic compounds (C) selected from six components of naphthalene, phenanthrene, anthracene, o-triphenyl, m-triphenyl, and p-triphenyl, wherein the biphenyl (A) is contained in a ratio of 15 to 50% by mass, the diphenylene oxide (B) is contained in a ratio of 10 to 40% by mass, the aromatic compounds (C) is contained in a ratio of 20 to 75% by mass, and diphenyl ether is not contained.

Abstract: A rubber composition containing a rubber component having an olefinic double bond, and an isobutylene polymer having a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2), wherein the content of a low molecular weight substance whose molecular weight is 1000 or less in the isobutylene polymer is 5% by mass or less based on the total amount of the isobutylene polymer. [wherein X represents a divalent group, Y represents a substituted or unsubstituted alicyclic group having an unsaturated bond, and n represents 0 or 1.

Abstract: A vinyl ether compound represented by formula (1-a) or formula (1-b): wherein n represents 0 or 1, and R1 and R2 each independently represent a hydrogen atom, a methyl group, or an ethyl group, provided that a total of the number of carbon atoms of R1 and the number of carbon atoms of R2 is 1 or 2.

Abstract: A vinyl ether compound represented by formula (1-a) or formula (1-b): wherein n represents 0 or 1, and R1 and R2 each independently represent a hydrogen atom, a methyl group, or an ethyl group, provided that a total of the number of carbon atoms of R1 and the number of carbon atoms of R2 is 1 or 2.

Abstract: An isobutylene-based polymer comprising a structural unit represented by the following formula (1): and a structural unit represented by the following formula (2): wherein X represents a divalent group; Y represents a substituted or unsubstituted alicyclic group having an unsaturated bond in the ring; and n represents 0 or 1.

Abstract: The invention provides a solid phosphoric acid catalyst which has high activity and attains high dimer selectivity in olefin dimerization reactions and efficient methods of olefin dimerization. The solid phosphoric acid catalyst comprises a carrier and phosphoric acid supported thereon. When the solid phosphoric acid catalyst is heated at 250° C. for 20 minutes, heating loss of water is 50 mass % or more based on diphosphorus pentoxide (P2O5) derived from the phosphoric acid. A method of olefin dimerization comprises bringing an olefin-containing feed material containing water in an amount of 10-1000 mass ppm into contact with the catalyst to initiate the reaction.

Abstract: An isobutylene-based polymer comprising a structural unit represented by the following formula (1): and a structural unit represented by the following formula (2): wherein X represents a divalent group; Y represents a substituted or unsubstituted alicyclic group having an unsaturated bond in the ring; and n represents 0 or 1.

Abstract: The present invention provides a solid phosphoric acid catalyst which attains high activity and dimer selectivity in olefin dimerization reaction and an efficient method for dimerization of olefin using the same. The solid phosphoric acid catalyst comprises phosphoric acid supported on a siliceous carrier, the proportion of orthophosphoric acid in the phosphoric acid supported being 60 mol % or more in terms of phosphorus atom amount. The solid phosphoric acid catalyst is prepared by bringing a phosphoric acid aqueous solution into contact with the siliceous carrier followed by drying, the preparation step being carried out at a temperature lower than 100° C. Also provided is a method for bringing an olefin-containing raw material into contact with the catalyst.

Abstract: A solid phosphoric acid catalyst which has high activity and attains high dimer selectivity in olefin dimerization reactions; and efficient methods of olefin dimerization reaction. The solid phosphoric acid catalyst comprises a carrier and phosphoric acid supported thereon. When the solid phosphoric acid catalyst is heated at 250° C. for 20 minutes, heating loss of water is 50 mass % or more based on diphosphorus pentaoxide (P2O5) derived from the phosphoric acid. One of the methods of olefin dimerization reaction comprises bringing an olefin-containing feed material containing water in an amount of 10-1000 mass ppm into contact with the catalyst to initiate the reaction.

Abstract: The present invention provides a solid phosphoric acid catalyst which attains high activity and dimer selectivity in olefin dimerization reaction and an efficient method for dimerization of olefin using the same. The solid phosphoric acid catalyst comprises phosphoric acid supported on a siliceous carrier, the proportion of orthophosphoric acid in the phosphoric acid supported being 60 mol % or more in terms of phosphorus atom amount. The solid phosphoric acid catalyst is prepared by bringing a phosphoric acid aqueous solution into contact with the siliceous carrier followed by drying, the preparation step being carried out at a temperature lower than 100° C. Also provided is a method for bringing an olefin-containing raw material into contact with the catalyst.

Abstract: A thermosetting resin composition which is improved in impact resistance, thermal crack resistance, oxidative degradation resistance and thermal degradation resistance without impairing the heat resistance represented by HDT and which is suitable for the encapsulation of semiconductors and the like, is provided. The thermosetting resin composition comprises (A) a thermosetting resin, (B) a liquid polybutene containing an aldehyde gourp and (C) a curing agent added at need thereto, wherein the main component of the liquid polybutene has an aldehyde structure at a terminal and the main chain thereof as a structure in which 80% or more of the repeating unit have a structure represented by the Formula (1).

Abstract: Butene oligomer derivatives having tert-butyl groups as one of the terminal groups, having a repeating unit of the main hydrocarbon chain consisting of 80% by mole or more of —CH2C(CH3)2—, and carrying the other terminal group consisting of 60% by mole or more of 1,4-butanediol type functional groups. These derivatives are useful as macromonomers which can be subjected to polycondensation, polyaddition, etc.

Abstract: A thermosetting resin composition which is improved in impact resistance, thermal crack resistance, oxidative degradation resistance and thermal degradation resistance without impairing the heat resistance represented by HDT and which is suitable for the encapsulation of semiconductors and the like, is provided.

Abstract: This invention relates a thermosetting resin composition which is produced by curing a composition containing a thermosetting resin and a reactive mono-olefin polymer, and its phase structure is sea-island structure which comprises a continuous phase mainly composed of a cured composition containing a thermosetting resin and, if necessary, further curing agent and dispersed phases mainly composed of a reactive mono-olefin polymer and said dispersed phases contain a plurality of finer dispersed phases and/or at least one layer of interfacial phases surrounding said dispersed phases, thereby providing a thermosetting resin composition that is suitable for use in sealing or encapsulating semiconductor devices, which composition has improved impact strength, resistance to thermal cracking, resistance to deterioration by oxidation, without losing thermal stability.

Abstract: Butene oligomer derivatives having tert-butyl groups as one of the terminal groups, having a repeating unit of the main hydrocarbon chain consisting of 80% by mole or more of —CH2C(CH3)2—, and carrying the other terminal group consisting of 60% by mole or more of 1,4-butanediol type functional groups. These derivatives are useful as macromonomers which can be subjected to polycondensation, polyaddition, etc.

Abstract: The purpose of the present invention provides a thermosetting resin composition suitable for use in sealing or encapsulating semiconductor devices, which resin composition is improved in impact strength, resistance in thermal cracking test, resistance to deterioration caused by heat or by oxidation, without lowering thermal stability represented by HDT, wherein the composition containing a thermosetting resin, an epoxy group-containing liquid polybutene and, if necessary, a curing agent, and said epoxy group-containing liquid polybutene has epoxy structures substantially at the terminal ends of molecules and 80 molar % or more of repeating units in the main chain structure has a specific structure. Furthermore, the cured thermosetting resin composition has a phase structure, in which dispersed phases of several &mgr;m in diameter and being mainly composed of epoxy group-containing liquid polybutene, are dispersed in a continuous phase that is mainly composed of said thermosetting resin.