Patents by Inventor Tsutomu Terazaki

Tsutomu Terazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7758822
    Abstract: A reactor device includes a reactor including at least one reacting unit supplied with a reactant to cause a reaction, a terminal portion provided at the reacting unit, and an electrically conductive member comprising an electrically conductive material and connected to the terminal portion, a space which extends between the terminal portion and an end face of the reactor, wherein the electrically conductive member is routed to outside the reactor through the space from the terminal portion to the end face of the reactor, and the electrically conductive member is fixed to the reactor at the end face.
    Type: Grant
    Filed: January 17, 2007
    Date of Patent: July 20, 2010
    Assignee: Casio Computer Co., Ltd.
    Inventors: Tsutomu Terazaki, Tadao Yamamoto
  • Publication number: 20090246576
    Abstract: Disclosed is a reaction device including: a reaction device body including a reaction section in which a reactant reacts; and a first container to house the reaction device body, wherein the first container includes a radiation transmitting region through which radiation from the reaction device body transmits.
    Type: Application
    Filed: March 25, 2009
    Publication date: October 1, 2009
    Applicant: Casio Computer Co., Ltd.
    Inventors: Tsutomu Terazaki, Motoki Endo, Tetsushi Ishikawa, Osamu Nakamura, Masaharu Shioya
  • Publication number: 20090155646
    Abstract: Disclosed is a reaction device including: a reactor to cause a reaction of a reactant; a first container to house the reactor; and a second container to house the first container, wherein a gas is injected to a space between the reactor and the first container and the first container is sealed, and an atmospheric pressure in a space between the first container and the second container is lower than a normal atmospheric pressure.
    Type: Application
    Filed: December 12, 2008
    Publication date: June 18, 2009
    Applicant: Casio Computer Co., Ltd.
    Inventors: Motoki Endo, Tsutomu Terazaki, Tetsushi Ishikawa, Osamu Nakamura, Masaharu Shioya
  • Patent number: 7531255
    Abstract: A thermal treatment apparatus provided on a substrate includes a heat generating section the section includes a heat generating layer, a diffusion preventing layer which contacts one surface of the heat generating layer to prevent heat diffusion due to heat generation of the heat generating layer, and a cohering layer disposed between the substrate and the diffusion preventing layer.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: May 12, 2009
    Assignee: Casio Computer Co., Ltd.
    Inventors: Masatoshi Nomura, Osamu Nakamura, Tsutomu Terazaki, Keishi Takeyama
  • Patent number: 7531016
    Abstract: A chemical reaction apparatus includes a solid body which has an outer surface, and in which at least one flow path which allows a chemical medium to flow is formed. This body has a heating element which heats the chemical medium in the flow path to accelerate a chemical reaction of the chemical medium, and a heat radiation preventing film which covers at least a portion of the outer surface of the body, and prevents radiation of heat generated by the heating element from a portion of the outer surface.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: May 12, 2009
    Assignee: Casio Computer Co., Ltd.
    Inventors: Tadao Yamamoto, Osamu Nakamura, Keishi Takeyama, Tsutomu Terazaki
  • Publication number: 20080145970
    Abstract: A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding.
    Type: Application
    Filed: February 14, 2008
    Publication date: June 19, 2008
    Applicant: Casio Computer Co., Ltd.
    Inventors: Tsutomu TERAZAKI, Osamu NAKAMURA, Keishi TAKEYAMA, Masatoshi NOMURA
  • Publication number: 20070181249
    Abstract: A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
    Type: Application
    Filed: February 22, 2007
    Publication date: August 9, 2007
    Applicant: Casio Computer Co., Ltd.
    Inventors: Osamu NAKAMURA, Keishi Takeyama, Tsutomu Terazaki
  • Publication number: 20070166581
    Abstract: A reactor device includes a reactor including at least one reacting unit supplied with a reactant to cause a reaction, a terminal portion provided at the reacting unit, and an electrically conductive member comprising an electrically conductive material and connected to the terminal portion, a space which extends between the terminal portion and an end face of the reactor, wherein the electrically conductive member is routed to outside the reactor through the space from the terminal portion to the end face of the reactor, and the electrically conductive member is fixed to the reactor at the end face.
    Type: Application
    Filed: January 17, 2007
    Publication date: July 19, 2007
    Applicant: Casio Computer Co., Ltd.
    Inventors: Tsutomu Terazaki, Tadao Yamamoto
  • Publication number: 20070148502
    Abstract: A reactor causing reaction of a reactant includes a plurality of substrates provided with top and bottom substrates having provided therein recessed portions for forming closely sealed regions and a plurality of intermediate substrates having provided therein at least openings that communicate with each other, a reactor main body portion including a reaction unit at which the intermediate substrates are formed to be laminated and joined with each other and a reaction flow channel reactant flows formed therein, and an envelope portion which houses the reactor main body portion therein except one end side thereof, via a closely sealed space formed by sandwiching the laminated intermediate substrates between the top and the bottom substrates and by communicating the opening and the closely sealed region on the substrates, and including a support portion which supports the reactor main body portion via the one end side of the reactor main body portion.
    Type: Application
    Filed: December 27, 2006
    Publication date: June 28, 2007
    Applicant: Casio Computer Co., Ltd.
    Inventor: Tsutomu Terazaki
  • Patent number: 7205625
    Abstract: A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
    Type: Grant
    Filed: August 11, 2004
    Date of Patent: April 17, 2007
    Assignee: Casio Computer Co., Ltd.
    Inventors: Osamu Nakamura, Keishi Takeyama, Tsutomu Terazaki
  • Publication number: 20070071662
    Abstract: A fuel cell fuel reformer including a gas reactor for producing reformed fuel and an electric heater for heating the gas reactor. An external container includes an inner vacuum chamber, which accommodates the gas reactor and the electric heater, and receiving portions. An electric wire extends through the external container to supply electric power to the electric heater in the inner vacuum chamber. Fluid tubes are received by the receiving portions and extend through the external container. A sealant seals gaps between the fluid tubes and the receiving portions. The gas reactor, the fluid tubes, the external container, and the sealant each have thermal expansion coefficients, with the maximum one of the thermal expansion coefficients being ten-times the minimum one of the thermal expansion coefficients or less.
    Type: Application
    Filed: September 26, 2006
    Publication date: March 29, 2007
    Applicants: Nippon Sheet Glass Company, Limited, CASIO COMPUTER CO., LTD.
    Inventors: Shinya Kawakita, Ryo Anraku, Masashi Ogino, Osamu Nakamura, Tsutomu Terazaki
  • Publication number: 20050212111
    Abstract: A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes. Bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding.
    Type: Application
    Filed: March 14, 2005
    Publication date: September 29, 2005
    Applicant: Casio Computer Co., Ltd.
    Inventors: Tsutomu Terazaki, Osamu Nakamura, Keishi Takeyama, Masatoshi Nomura
  • Publication number: 20050069737
    Abstract: A thermal treatment apparatus provided on a substrate includes a heat generating section the section includes a heat generating layer, a diffusion preventing layer which contacts one surface of the heat generating layer to prevent heat diffusion due to heat generation of the heat generating layer, and a cohering layer disposed between the substrate and the diffusion preventing layer.
    Type: Application
    Filed: September 27, 2004
    Publication date: March 31, 2005
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Masatoshi Nomura, Osamu Nakamura, Tsutomu Terazaki, Keishi Takeyama
  • Publication number: 20050046007
    Abstract: A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
    Type: Application
    Filed: August 11, 2004
    Publication date: March 3, 2005
    Applicant: Casio Computer Co., Ltd.
    Inventors: Osamu Nakamura, Keishi Takeyama, Tsutomu Terazaki
  • Publication number: 20040148858
    Abstract: A chemical reaction apparatus includes a solid body which has an outer surface, and in which at least one flow path which allows a chemical medium to flow is formed. This body has a heating element which heats the chemical medium in the flow path to accelerate a chemical reaction of the chemical medium, and a heat radiation preventing film which covers at least a portion of the outer surface of the body, and prevents radiation of heat generated by the heating element from a portion of the outer surface.
    Type: Application
    Filed: November 12, 2003
    Publication date: August 5, 2004
    Inventors: Tadao Yamamoto, Osamu Nakamura, Keishi Takeyama, Tsutomu Terazaki