Abstract: Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).

Abstract: Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).

Abstract: Apparatus for forming a thin film pattern on the surface of a substrate. This apparatus is provided with: a transfer member having a thin film carrying surface which carries a thin film pattern; and a thin film transfer mechanism for joining the transfer member to a substrate for transferring, to the substrate, the thin film pattern on the thin film carrying surface. The thin film pattern may be a wiring film pattern. A gelatinous film may previously be formed on the substrate, and the thin film pattern may be transferred as embedded in the gelatinous film.

Abstract: Apparatus for forming a thin film pattern on the surface of a substrate. This apparatus is provided with: a transfer member having a thin film carrying surface which carries a thin film pattern; and a thin film transfer mechanism for joining the transfer member to a substrate for transferring, to the substrate, the thin film pattern on the thin film carrying surface. The thin film pattern may be a wiring film pattern. A gelatinous film may previously be formed on the substrate, and the thin film pattern may be transferred as embedded in the gelatinous film.

Abstract: With a thin film bearing surface of a substrate directed toward an insulation film which is formed on a surface of a quartz plate, the substrate and the quartz plate are moved closer to each other and the insulation film is tightly adhered to the thin film bearing surface (adhering process). The quartz plate alone is then selectively peeled off, thereby completing transfer of the insulation film onto the substrate (peeling process). In this manner, the insulation film is disposed on the thin film bearing surface of the substrate, and a transportation mechanism then houses the substrate in a substrate cassette. Meanwhile, after the quartz plate is transported by the transportation mechanism to a cleaning unit and cleaned by the cleaning unit (cleaning process), the quartz plate is returned to a plate-like member cassette and waits in this cassette until reused next time.

Abstract: With a thin film bearing surface of a substrate directed toward an insulation film which is formed on a surface of a quartz plate, the substrate and the quartz plate are moved closer to each other and the insulation film is tightly adhered to the thin film bearing surface (adhering process). The quartz plate alone is then selectively peeled off, thereby completing transfer of the insulation film onto the substrate (peeling process). In this manner, the insulation film is disposed on the thin film bearing surface of the substrate, and a transportation mechanism then houses the substrate in a substrate cassette. Meanwhile, after the quartz plate is transported by the transportation mechanism to a cleaning unit and cleaned by the cleaning unit (cleaning process), the quartz plate is returned to a plate-like member cassette and waits in this cassette until reused next time.

Abstract: A slit nozzle includes a solution feeding mechanism having an elastic element and a plurality of piezoelectric devices and embedded in a side surface of a flow passage near a slit in the slit nozzle. Control is effected so that the piezoelectric devices are vibrated to cause the elastic element to produce traveling waves toward the slit. A resist solution serving as a processing solution is pumped by the traveling waves, thereby to be discharged through the slit toward a substrate. This provides a substrate processing apparatus capable of smoothly discharging the processing solution to accomplish high discharge accuracy.

Abstract: A substrate processing apparatus provided with: a coating processing section for supplying a coating solution to a substrate; a pressure processing section for pressurizing a coating film formed on the substrate; and a developing processing section for supplying a developing solution to the substrate having the coating film selectively exposed to light with the use of an exposure mask. The pressure processing section may be arranged such that a pressing plate having a flat face is brought into pressure contact with the coating film.

Abstract: A semiconductor wafer is held by support pins horizontally. A susceptor and a heating plate are moved upwardly so that the semiconductor wafer is transferred from the support pins to the susceptor. At this time, a gas layer is sandwiched between the upper surface of the susceptor and the lower surface of the semiconductor wafer to cause the semiconductor wafer to float over the upper surface of the susceptor for about seventy seconds immediately after the semiconductor wafer is mounted on the upper surface of the susceptor. Then, flash lamps are lit up to perform flash heating while the semiconductor wafer is floating over the upper surface of the susceptor. Even when flashlight irradiation causes rapid thermal expansion of the wafer surface, the semiconductor wafer does not suffer a great stress. This can prevent the semiconductor wafer from breaking.

Abstract: A semiconductor wafer is held by support pins horizontally. A susceptor and a heating plate are moved upwardly so that the semiconductor wafer is transferred from the support pins to the susceptor. At this time, a gas layer is sandwiched between the upper surface of the susceptor and the lower surface of the semiconductor wafer to cause the semiconductor wafer to float over the upper surface of the susceptor for about seventy seconds immediately after the semiconductor wafer is mounted on the upper surface of the susceptor. Then, flash lamps are lit up to perform flash heating while the semiconductor wafer is floating over the upper surface of the susceptor. Even when flashlight irradiation causes rapid thermal expansion of the wafer surface, the semiconductor wafer does not suffer a great stress. This can prevent the semiconductor wafer from breaking.

Abstract: A slit nozzle includes a solution feeding mechanism having an elastic element and a plurality of piezoelectric devices and embedded in a side surface of a flow passage near a slit in the slit nozzle. Control is effected so that the piezoelectric devices are vibrated to cause the elastic element to produce traveling waves toward the slit. A resist solution serving as a processing solution is pumped by the traveling waves, thereby to be discharged through the slit toward a substrate. This provides a substrate processing apparatus capable of smoothly discharging the processing solution to accomplish high discharge accuracy.

Abstract: With a thin film bearing surface of a substrate directed toward an insulation film which is formed on a surface of a quartz plate, the substrate and the quartz plate are moved closer to each other and the insulation film is tightly adhered to the thin film bearing surface (adhering process). The quartz plate alone is then selectively peeled off, thereby completing transfer of the insulation film onto the substrate (peeling process). In this manner, the insulation film is disposed on the thin film bearing surface of the substrate, and a transportation mechanism then houses the substrate in a substrate cassette. Meanwhile, after the quartz plate is transported by the transportation mechanism to a cleaning unit and cleaned by the cleaning unit (cleaning process), the quartz plate is returned to a plate-like member cassette and waits in this cassette until reused next time.

Abstract: A substrate processing apparatus provided with: a coating processing section for supplying a coating solution to a substrate; a pressure processing section for pressurizing a coating film formed on the substrate; and a developing processing section for supplying a developing solution to the substrate having the coating film selectively exposed to light with the use of an exposure mask. The pressure processing section may be arranged such that a pressing plate having a flat face is brought into pressure contact with the coating film.

Abstract: Apparatus for forming a thin film pattern on the surface of a substrate. This apparatus is provided with: a transfer member having a thin film carrying surface which carries a thin film pattern; and a thin film transfer mechanism for joining the transfer member to a substrate for transferring, to the substrate, the thin film pattern on the thin film carrying surface. The thin film pattern may be a wiring film pattern. A gelatinous film may previously be formed on the substrate, and the thin film pattern may be transferred as embedded in the gelatinous film.

Abstract: Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).

Abstract: A substrate treating apparatus for performing a predetermined treatment of a substrate in a spin, has a spin motor including a rotor having a hollow opening centrally thereof, and a stator disposed coaxially with the rotor and having a hollow opening centrally thereof. The rotor includes holders for supporting the substrate in three peripheral positions thereof. A support mechanism switches the holders between a position for supporting the substrate, and a position retracted therefrom. The opposite surfaces of the substrate supported by the holders are cleaned with a cleaning solution supplied through nozzles. The holders have a substrate supporting force derived from a weight and magnetism of the support mechanism, to support the substrate reliably. A guide is disposed in the hollow of the rotor, and connected to the rotor. The holders are arranged in a substrate treating space formed inwardly of the guide. The holders are arranged on the guide.

Abstract: A substrate processing apparatus comprises a processing part and a transferring part. In the processing part there are a plurality of stages in which a plurality of processing units are arranged in a row along a horizontal direction and the stages are arranged in a stack vertically. Thus, the processing units are arranged in matrix. The transferring part includes a plurality of horizontal transferring devices each movable in the horizontal direction and a vertical transferring device movable in the vertical direction. Hence, a substrate is movable both horizontally and vertically to be transferred to the desired processing unit.

Abstract: An apparatus for correcting snaking of rollfilm comprises a driving roller for feeding the rollfilm to the exposure position with the film being maintained flat, pinch rollers provided such that they can approach or be separated from the driving roller, switching means for switching between the abutment and separation of the pinch rollers and the driving roller, and cutting means for cutting the rollfilm.

Abstract: Method and apparatus for loading an unexposed film on a rotary drum in a exposure/recording apparatus, such as raster plotter or a color scanner, and unloading the exposed film out of the drum, the replacement of films being automatically carried out by the use of a supply pallet and a discharge pallet, suckers, and maneuverable linkages so as to enable the film to travel from the supply pallet to the drum, and, after exposure, to the discharge pallet.

Abstract: A linear actuator constructed so as to convert deformation movements of a plurality of electrostrictive elements to a reciprocating movement of an output shaft thereof. The linear actuator comprises a planetary driving unit adapted to be driven by a plurality of electrostrictive elements in a casing body thereof, a precessional driving unit adapted to be driven by a plurality of electrostrictive elements therein a contact ring connected interlockingly to both the planetary driving unit and the precessional driving unit therein and the output shaft engaged loosely to the interior surface of the contact ring and supported reciprocatively by the casing body. The voltages applied to the electrostrictive elements are controlled so as for the contact ring to be driven to perform a planetary movement with being pressed onto the output shaft and to be driven to perform a precessional movement by the precessional driving unit.