Abstract: A droplet discharge apparatus includes a discharge head including a nozzle, a nozzle surface observation device, and processing circuitry. The discharge head including the nozzle is configured to discharge a droplet onto a discharge receiving medium formed of powder. The nozzle surface observation device is configured to observe a nozzle surface of the nozzle of the discharge head. The processing circuitry is configured to calculate an adhesion amount of attached matter to the nozzle surface based on an observation result of the nozzle surface observation device. The processing circuitry is configured to determine, based on a calculation result of the adhesion amount of the attached matter, an operation on a control target that controls at least one of a mass and a discharge speed of the droplet.

Abstract: A three-dimensional fabricating apparatus includes a discharge head, a detector, a non-contact cleaner, and a controller. The discharge head discharges droplets to fabricate a three-dimensional object. The detector detects a state of the discharge head. The non-contact cleaner cleans the discharge head in a non-contact manner. The controller controls an operation of the three-dimensional fabricating apparatus according to the state of the discharge head detected by the detector after the non-contact cleaner cleans the discharge head.

Abstract: A liquid fabrication applied to a layer of powder containing an inorganic particle, wherein the liquid fabrication has a powder contact angle with the inorganic particle of 50 degrees or greater and satisfies the following relationship 1: ?cos?/??1.5 m/s, where ? represents the powder contact angle, ? represents a surface tension in mN/m of the liquid fabrication at 23 degrees C., and ? represents a viscosity in mPa·s of the liquid fabrication at 25 degrees C.

Abstract: A droplet discharge apparatus includes a discharge head including a nozzle, a nozzle surface observation device, and processing circuitry. The discharge head including the nozzle is configured to discharge a droplet onto a discharge receiving medium formed of powder. The nozzle surface observation device is configured to observe a nozzle surface of the nozzle of the discharge head. The processing circuitry is configured to calculate an adhesion amount of attached matter to the nozzle surface based on an observation result of the nozzle surface observation device. The processing circuitry is configured to determine, based on a calculation result of the adhesion amount of the attached matter, an operation on a control target that controls at least one of a mass and a discharge speed of the droplet.

Abstract: A fabricating apparatus (1) includes a discharger (10) and a heating unit (20, 20?, 20?). The discharger (10) discharges a melted fabrication material (FM) to form a fabrication material layer (Ln?1). The heating unit (20, 20?, 20?) heats the fabrication material layer (Ln?1) formed by the discharger (10). The discharger (10) discharges the melted fabrication material (FM) to the fabrication material layer (Ln?1) heated by the heating unit (20, 20?, 20?), to laminate another fabrication material layer (Ln) on the fabrication material layer (Ln?1) heated by the heating unit.

Abstract: A modeling apparatus is configured to laminate a modeling material to model a three-dimensional modeled object. The modeling apparatus includes a local heating unit, a local cooling unit, and an annealing unit. The local heating unit is configured to locally heat the modeling material during lamination of the modeling material is being laminated. The local cooling unit is configured to locally cool the modeling material during the lamination. The annealing unit is configured to anneal the resultant three-dimensional modeled object at a temperature equal to or higher than a predetermined temperature.

Abstract: A fabricating apparatus is configured to fabricate a three-dimensional object, the apparatus includes a discharging device, a heating device, and control circuitry. The discharging device is configured to discharge a fabrication material to form a fabrication material layer. The heating device is configured to heat the fabrication material layer formed by the discharging device. The control circuitry is configured to control at least one of a heating range of the fabrication material layer heated by the heating device and a heating energy applied to the fabrication material layer by the heating device when the discharging device discharges the fabrication material to laminate another fabrication material layer on the fabrication material layer heated by the heating device.

Abstract: A fabricating apparatus includes a temperature measuring device, a heating device, and circuitry. The temperature measuring device is configured to measure a temperature of a fabrication material layer. The heating device is configured to heat the fabrication material layer. The circuitry is configured to control the heating device with a heating amount for heating the fabricating material layer to a temperature at which the fabricating material layer melts, based on the temperature measured by the temperature measuring device.

Abstract: A modeling device includes a discharger, a first mover, a modifier, and a second mover. The discharger is configured to discharge a melted modeling material. The first mover is configured to move the discharger and a modeling platform on which the modeling material is discharged by the discharger, relative to each other. The modifier is configured to modify a layer formed of the modeling material discharged by the discharger. The second mover is configured to move the modifier relative to the discharger. The second mover is configured to move the modifier along a movement path in which an orientation of the modifier is maintained with respect to a three-axis Cartesian coordinate system.

Abstract: A fabricating apparatus includes a heater, a discharger, and circuitry. The heater is configured to heat a first fabrication material layer formed of a fabrication material. The discharger is configured to discharge a molten fabrication material onto the first fabrication material layer heated by the heater, to stack a second fabrication material layer on the first fabrication material layer. The circuitry is configured to control a heating of the heater according to shape data so that the first fabrication material layer does not exceed a threshold temperature defined by the fabrication material when the heater heats the first fabrication material layer.

Abstract: A fabricating apparatus includes a heater, a discharger, and circuitry. The heater is configured to heat a first fabrication material layer formed of a fabrication material. The discharger is configured to discharge a melted fabrication material onto the first fabrication material layer heated by the heater, to stack a second fabrication material layer on the first fabrication material layer. The circuitry is configured to control a heating amount of the heater according to shape data when the heater heats the first fabrication material layer.