Patents by Inventor Tsuyoshi Bito
Tsuyoshi Bito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8580913Abstract: A polyimide resin which is satisfactory in solvent solubility and heat resistance, has a low coefficient of water absorption and is excellent in adhesive properties and a method for manufacturing the same, a film containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a molecule having a repeating unit represented by a structure of any one of the following formulae (1) to (3) in a specified proportion, whose molecular end is capped by an end-capping agent.Type: GrantFiled: July 5, 2007Date of Patent: November 12, 2013Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Tsuyoshi Bito, Shuta Kihara, Jitsuo Oishi
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Patent number: 8293371Abstract: A polyimide resin composed of a repeating unit represented by the following formula (1): or composed of the repeating unit represented by the formula (1) and at least one repeating unit represented by the following formula (2): wherein X is the same as defined in the specification, exhibits a good thermoplastic property, a high solubility in solvents and a good heat resistance as well as a low water absorption and an excellent adhesion property. The polyimide resin is useful as the material for the adhesive layer of a metal-clad laminate which is composed of an insulating substrate, a metal layer and an adhesive layer disposed between the insulating substrate and the metal layer.Type: GrantFiled: January 20, 2006Date of Patent: October 23, 2012Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Tsuyoshi Bito, Shuta Kihara, Jitsuo Oishi
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Publication number: 20120059119Abstract: To provide a thermosetting polyimide resin composition that can provide a cured product which generates a small amount of decomposition gas even when exposed to, for example, a high-temperature environment of about 250° C., and which exhibits high heat resistance, high durability, favorable flexibility, and favorable adhesive property; a cured product produced from the thermosetting polyimide resin composition; and an adhesive produced from the thermosetting polyimide resin composition. The thermosetting polyimide resin composition containing (a) a polyimide produced through reaction between a tetracarboxylic acid component containing a tetracarboxylic dianhydride and/or a tetracarboxylic acid, and a diamine; and (b) a maleimide composition containing at least one polymaleimide compound represented by any of formulas (4-1) to (4-3).Type: ApplicationFiled: May 6, 2010Publication date: March 8, 2012Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Tsuyoshi Bito, Jitsuo Oishi, Shuto Kihara
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Patent number: 8110652Abstract: A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2), with a proportion of a group presented by the following formula (3) being 50% by mole or more of the whole of X.Type: GrantFiled: July 17, 2007Date of Patent: February 7, 2012Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Tsuyoshi Bito, Shuta Kihara, Jitsuo Oishi
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Publication number: 20090305046Abstract: A thermosetting polyimide resin composition which, when used in an adhesive layer of a metal-clad laminate, is able to be manufactured by only the solvent removal without requiring an imidation step reaching 300° C. or higher and is thermosetting, a cured material of which is excellent in adhesive properties, low in coefficient of water absorption and satisfactory in heat resistance is provided. A thermosetting polyimide resin composition including a polyimide resin having a repeating unit or units having a specified structure and a compound having two or more polymerizable double bonds in one molecule thereof; a film containing the subject thermosetting polyimide resin composition and a metal-clad laminate including an adhesive layer composed of the subject thermosetting polyimide resin composition.Type: ApplicationFiled: July 18, 2007Publication date: December 10, 2009Inventors: Tsuyoshi Bito, Shuta Kihara, Jitsuo Oishi
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Publication number: 20090291259Abstract: A polyimide resin which is satisfactory in solvent solubility and heat resistance, has a low coefficient of water absorption and is excellent in adhesive properties and a method for manufacturing the same, a film containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a molecule having a repeating unit represented by a structure of any one of the following formulae (1) to (3) in a specified proportion, whose molecular end is capped by an end-capping agent.Type: ApplicationFiled: July 5, 2007Publication date: November 26, 2009Inventors: Tsuyoshi Bito, Shuta Kihara, Jitsuo Oishi
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Publication number: 20090269597Abstract: A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2), with a proportion of a group presented by the following formula (3) being 50% by mole or more of the whole of X.Type: ApplicationFiled: July 17, 2007Publication date: October 29, 2009Inventors: Tsuyoshi Bito, Shuta Kihara, Jitsuo Oishi
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Publication number: 20090068482Abstract: A polyimide resin composed of a repeating unit represented by the following formula (1): or composed of the repeating unit represented by the formula (1) and at least one repeating unit represented by the following formula (2): wherein X is the same as defined in the specification, exhibits a good thermoplastic property, a high solubility in solvents and a good heat resistance as well as a low water absorption and an excellent adhesion property. The polyimide resin is useful as the material for the adhesive layer of a metal-clad laminate which is composed of an insulating substrate, a metal layer and an adhesive layer disposed between the insulating substrate and the metal layer.Type: ApplicationFiled: January 20, 2006Publication date: March 12, 2009Inventors: Tsuyoshi Bito, Shuta Kihara, Jitsuo Oishi
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Patent number: 7078477Abstract: In the process of the present invention, a solvent-soluble polyimide is produced by polycondensing at least one tetracarboxylic acid component with at least one diamine component in a solvent in the presence of a tertiary amine. The tetracarboxylic acid component is selected from the group consisting of tetracarboxylic dianhydrides represented by the following formula 1: wherein R is as defined in the specification, and tetracarboxylic acids and their derivatives represented by the following formula 2: wherein R and Y1 to Y4 are as defined in the specification. Unlike the conventional techniques using an excessively large amount of a chemical imidation agent such as acetic anhydride and a chemical imidation catalyst such as triethylamine, in the process of the present invention, the solvent-soluble polyimide having a high polymerization degree is easily produced in a solvent with good productivity by using only a catalytic amount of the tertiary amine.Type: GrantFiled: June 25, 2004Date of Patent: July 18, 2006Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Hiroki Oguro, Shuta Kihara, Tsuyoshi Bito
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Publication number: 20040266979Abstract: In the process of the present invention, a solvent-soluble polyimide is produced by polycondensing at least one tetracarboxylic acid component with at least one diamine component in a solvent in the presence of a tertiary amine.Type: ApplicationFiled: June 25, 2004Publication date: December 30, 2004Applicant: Mitsubishi Gas Chemical Company, Inc.Inventors: Hiroki Oguro, Shuta Kihara, Tsuyoshi Bito