Abstract: An electrode structure includes: a plurality of pixel electrodes arranged separately from each other; and a plurality of dielectric layers laminated in a first direction with respect to the plurality of pixel electrodes, in which the plurality of dielectric layers includes: a first dielectric layer that spreads over the plurality of pixel electrodes in a direction intersecting with the first direction; and a second dielectric layer that includes dielectric material having a refractive index higher than that of the first dielectric layer, sandwiches the first dielectric layer together with the plurality of pixel electrodes, and has a slit at a position overlapping space between pixel electrodes adjacent when viewed from the first direction.

Abstract: With a gas shutoff device in the related art, a non-uniform gas layer can be produced by mixing of a gas of a different type from the gas currently in use during a shift in the amount of heat or installation or replacement, and an unexpected flow rate may be detected due to a disruption in the propagation of ultrasonic waves, thereby causing an erroneous determination of a flow rate abnormality or a sensor abnormality. With the gas shutoff device according to the invention, a valve-closing timer section 14 starts to time based on a valve-closing signal which is output by the flow rate abnormality or the sensor abnormality, and outputs a valve-opening signal to a valve driving section 12 if a release input is accepted from outside within a setting time period.

Abstract: A temporary drainage system for draining rain water that flows into a floor under construction to an outside of a building during construction of a multiple-story building includes: a flexible drainage collection hose connected to a penetration hole formed in a floor slab of the floor under construction; a sand-settling vessel provided on a floor slab of a constructed floor of the building and connected to the drainage collection hose; a drainage pit provided on a lowest floor of the building to store drainage water discharged from the sand-settling vessel through a drainage hose; and a drainage pump provided in the drainage pit. The drainage water collected into the drainage pit is discharged to the outside of the building by an operation of the drainage pump.

Abstract: An adhesive composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) particles of a thermoplastic resin which is solid at 25° C., and (F) silicone powder having a particle size at cumulative 50% (d50), measured by a laser light diffraction method, of from 1 to 50 ?m. The composition is particularly suitable to be applied by screen printing on a substrate or a silicon wafer.

Abstract: With a gas shutoff device in the related art, a non-uniform gas layer can be produced by mixing of a gas of a different type from the gas currently in use during a shift in the amount of heat or installation or replacement, and an unexpected flow rate may be detected due to a disruption in the propagation of ultrasonic waves, thereby causing an erroneous determination of a flow rate abnormality or a sensor abnormality. With the gas shutoff device according to the invention, a valve-closing timer section 14 starts to time based on a valve-closing signal which is output by the flow rate abnormality or the sensor abnormality, and outputs a valve-opening signal to a valve driving section 12 if a release input is accepted from outside within a setting time period.

Abstract: A conventional appliance monitoring apparatus handles only the amount of gas used and security information for the case of a gas cutoff and can not address social needs for a desire to obtain information about influence (e.g., an amount of CO2 emission) of use of the gas combustion appliance on a terrestrial environment. A CO2 emission calculation unit 4 calculates an amount of CO2 emission based on a gas appliance used by a client output from an appliance determination unit 2, a gas flow signal thereof, and CO2 emission data pertaining to the gas appliance stored in a CO2 emission data storage unit 3. Thus, it is possible to determine the amount of CO2 emission produced by using the gas appliance by the client.

Abstract: A convention appliance monitoring apparatus handles only the amount of gas used and security information for the case of a gas cutoff and can not address social needs for a desire to obtain information about influence (e.g., an amount of CO2 emission) of use of the gas combustion appliance on a terrestrial environment. Based on a gas appliance used by a client and a gas flow signal pertaining the gas appliance which are output from an appliance determination unit 2, CO2 emission data on the gas appliance stored in a CO2 emission data storage unit 3, and CO2 emission data which are to be compared with the gas appliance and stored in a comparative CO2 emission data storage unit 4, a CO2 emission calculation unit 5 calculates an amount of CO2 emission, an comparative amount of CO2 emission and a difference between the amount of CO2 emission and the comparative amount of CO2 emission.

Abstract: A die bonding agent comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, the die bonding agent having a viscosity ratio, V1/V2, ranging (i) from 1.5 to 4 at a temperature of from room temperature to 50° C., and (ii) from 0.5 to less than 1.5 at a temperature at which the die bonding agent hardens in 0.5 hour to 1.5 hours, the viscosities being measured in 10 minutes after the die bonding agent is placed on a sample stage of a Brook Field viscometer, wherein V1 is a viscosity measured by stirring 0.5 ml of the die bonding agent with a No. 51 spindle at 0.5 rpm and V2 is a viscosity measured by stirring 0.5 ml of the die bonding agent with a No. 51 spindle at 5 rpm in the Brook Field viscometer.

Abstract: A temporary drainage system for draining rain water that flows into a floor under construction to an outside of a building during construction of a multiple-story building includes: a flexible drainage collection hose connected to a penetration hole formed in a floor slab of the floor under construction; a sand-settling vessel provided on a floor slab of a constructed floor of the building and connected to the drainage collection hose; a drainage pit provided on a lowest floor of the building to store drainage water discharged from the sand-settling vessel through a drainage hose; and a drainage pump provided in the drainage pit. The drainage water collected into the drainage pit is discharged to the outside of the building by an operation of the drainage pump.

Abstract: An adhesive composition comprising 100 parts by weight of (A) an alternating copolymer composed of repeating units having alcoholic hydroxyl groups and represented by the following formula (1): 10 to 1,000 parts by weight of (B) an epoxy resin having at least two glycidyl groups per molecule, and 0.1 to 10 parts by weight of (C) a curing promoter. The composition is particularly suitable as a die bonding agent.

Abstract: A composition comprising (A) an epoxy resin, (B) an epoxy resin curing agent in such an amount that an equivalent ratio of a functional group of the epoxy resin curing agent (B) to the epoxy group of the epoxy resin (A) ranges from 0.8 to 1.25, (C) thermoplastic resin particles which are solid at 25° C. in an amount of from 3 to 60 parts by weight per total 100 parts by weight of the epoxy resin (A) and the epoxy resin curing agent (B), and (D) an epoxy resin curing promoter in an amount of from 0.1 to 10 parts by weight per total 100 parts by weight of the epoxy resin (A) and the epoxy resin curing agent (B). The composition is stable in B-stage and forms a curing product with no void.

Abstract: An adhesive composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) particles of a thermoplastic resin which is solid at 25° C., and (F) silicone powder having a particle size at cumulative 50% (d50), measured by a laser light diffraction method, of from 1 to 50 ?m. The composition is particularly suitable to be applied by screen printing on a substrate or a silicon wafer.

Abstract: An adhesive composition comprising 100 parts by weight of (A) an alternating copolymer composed of repeating units having alcoholic hydroxyl groups and represented by the following formula (1): 10 to 1,000 parts by weight of (B) an epoxy resin having at least two glycidyl groups per molecule, and 0.1 to 10 parts by weight of (C) a curing promoter. The composition is particularly suitable as a die bonding agent.

Abstract: A die bonding agent comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, the die bonding agent having a viscosity ratio, V1/V2, ranging (i) from 1.5 to 4 at a temperature of from room temperature to 50° C., and (ii) from 0.5 to less than 1.5 at a temperature at which the die bonding agent hardens in 0.5 hour to 1.5 hours, the viscosities being measured in 10 minutes after the die bonding agent is placed on a sample stage of a Brook Field viscometer, wherein V1 is a viscosity measured by stirring 0.5 ml of the die bonding agent with a No. 51 spindle at 0.5 rpm and V2 is a viscosity measured by stirring 0.5 ml of the die bonding agent with a No. 51 spindle at 5 rpm in the Brook Field viscometer.

Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an effective flux component selected from among abietic acid, palustric acid, levopimaric acid and dihydroabietic acid is low volatile and exhibits improved wetting and adherent properties to solder balls. The epoxy resin composition is used to cover and encapsulate a semiconductor chip, especially as no-flow underfill material, forming a highly reliable semiconductor device.

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent, and (C) an inorganic filler having an average particle size of more than 5 ?m in an amount of from 300 parts by weight to 1,000 parts by weight per 100 parts by weight of components (A) and (B) combined, has a low viscosity and a low coefficient of linear expansion and is suited for the encapsulation of semiconductor devices.

Abstract: A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i):  wherein n is 0 or a positive number, (B) a curing accelerator, and (C) an amorphous silica-titania co-melt as at least one of inorganic fillers, said composition satisfying the relationship of the following formula (1): [ { 2 ⁢ ( n A 2 + n C 2

Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an effective flux component selected from among abietic acid, palustric acid, levopimaric acid and dihydroabietic acid is low volatile and exhibits improved wetting and adherent properties to solder balls. The epoxy resin composition is used to cover and encapsulate a semiconductor chip, especially as no-flow underfill material, forming a highly reliable semiconductor device.

Abstract: A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified epoxy or phenolic resin is cured alone or together with another epoxy resin and/or phenolic resin to form a cured product, the organopolysiloxane component does not form a phase separation structure in the cured product. The composition cures into a product having both the adherence, heat resistance and humidity resistance characteristic of epoxy or phenolic resins and the flexibility and impact resistance characteristic of silicone resins.

Abstract: A conductive resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) a conductive filler is provided wherein component (A) and/or (B) is a copolymer obtained by reacting an epoxy resin or phenolic resin with an organopolysiloxane, the organopolysiloxane component in the cured composition does not form a phase separation structure, and a weight ratio of (D) to (A) plus (B) is in the range: 300/100≦D/(A+B)≦1500/100. It possesses adhesion, heat resistance, moisture resistance, flexibility and impact resistance.