Abstract: A printed wiring board includes a first resin insulation layer, a second resin insulation layer formed on the first insulation layer and having an opening portion, a mounting conductive layer formed on the first resin insulation layer in the opening portion of the second resin insulation layer such that the mounting conductive layer has a surface exposed by the opening portion, an electronic component positioned in the opening portion of the second resin insulation layer such that the electronic component is mounted on the surface of the mounting conductive layer, and a heat-dissipating via conductor formed in the first resin insulation layer such that the heat-dissipating via conductor is connected to the mounting conductive layer formed on the first resin insulation layer.

Abstract: A heat sink is thermally connected to a substrate on which LED elements are mounted. A fan unit is arranged near the distal end of a fin segment of the heat sink. A vent hole is formed in a case so as to expose the base end of the fin segment entirely in a direction in which fins are aligned. The heat sink is configured such that a gap between the fins is substantially blocked in a part except where the vent hole is present. The gap is an opening extending in a width direction perpendicular to the direction in which the fins are aligned. Space between the distal end of the fin segment and the fan unit functions as a pressure chamber that is placed in a positively pressurized condition or a negatively pressurized condition by cooling air traveling from the fan unit.

Abstract: A heat sink is thermally connected to a substrate on which LED elements are mounted. A fan unit is arranged near the distal end of a fin segment of the heat sink. A vent hole is formed in a case so as to expose the base end of the fin segment entirely in a direction in which fins are aligned. The heat sink is configured such that a gap between the fins is substantially blocked in a part except where the vent hole is present. The gap is an opening extending in a width direction perpendicular to the direction in which the fins are aligned. Space between the distal end of the fin segment and the fan unit functions as a pressure chamber that is placed in a positively pressurized condition or a negatively pressurized condition by cooling air traveling from the fan unit.

Abstract: In a memory unit 6, there is stored a correction table for each candidate value of an output set value of each of LED units 2. If UV rays have ever been emitted so far by the LED units 2, each of which is formed of a plurality of LED chips 8, then a PLC 5 acquires, upon setting of a output set value by an operation unit 53, a correction value corresponding to a cumulative emission time up to a previous emission, from the correction table of the output set value. Thereafter, the PLC 5 sets the magnitude of the power supplied to each of the LED units 2 using the acquired correction value. If an output set value different from a previous output set value is set, the PLC 5 obtains the correction value starting from the cumulative emission time upon modification. As a result, the UV irradiation apparatus enables power consumption necessary for emission of UV rays to be reduced, and UV ray output to be kept constant regardless of the cumulative emission time, even if the output set value is modified.

Abstract: An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.

Abstract: A printed wiring board includes a first resin insulation layer, a second resin insulation layer formed on the first insulation layer and having an opening portion, a mounting conductive layer formed on the first resin insulation layer in the opening portion of the second resin insulation layer such that the mounting conductive layer has a surface exposed by the opening portion, an electronic component positioned in the opening portion of the second resin insulation layer such that the electronic component is mounted on the surface of the mounting conductive layer, and a heat-dissipating via conductor formed in the first resin insulation layer such that the heat-dissipating via conductor is connected to the mounting conductive layer formed on the first resin insulation layer.

Abstract: A method for manufacturing a printed wiring board includes forming on a support board a first resin insulation layer, forming a second resin insulation layer on the first resin insulation layer, forming in the second resin insulation layer an opening portion in which an electronic component having an electrode is mounted, accommodating the electronic component in the opening portion of the second resin insulation layer such that the electrode of the electronic component faces an opposite side of the first resin insulation layer, forming on the first surface of the second resin insulation layer and the electronic component an interlayer resin insulation layer, and forming in the interlayer resin insulation layer a via conductor reaching to the electrode of the electronic component.

Abstract: An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.

Abstract: In a memory unit 6, there is stored a correction table for each candidate value of an output set value of each of LED units 2. If UV rays have ever been emitted so far by the LED units 2, each of which is formed of a plurality of LED chips 8, then a PLC 5 acquires, upon setting of a output set value by an operation unit 53, a correction value corresponding to a cumulative emission time up to a previous emission, from the correction table of the output set value. Thereafter, the PLC 5 sets the magnitude of the power supplied to each of the LED units 2 using the acquired correction value. If an output set value different from a previous output set value is set, the PLC 5 obtains the correction value starting from the cumulative emission time upon modification. As a result, the UV irradiation apparatus enables power consumption necessary for emission of UV rays to be reduced, and UV ray output to be kept constant regardless of the cumulative emission time, even if the output set value is modified.

Abstract: A method for manufacturing a printed wiring board includes forming on a support board a first resin insulation layer, forming a second resin insulation layer on the first resin insulation layer, forming in the second resin insulation layer an opening portion in which an electronic component having an electrode is mounted, accommodating the electronic component in the opening portion of the second resin insulation layer such that the electrode of the electronic component faces an opposite side of the first resin insulation layer, forming on the first surface of the second resin insulation layer and the electronic component an interlayer resin insulation layer, and forming in the interlayer resin insulation layer a via conductor reaching to the electrode of the electronic component.

Abstract: A heatsink carries a UV-ray light emitting diode. Flow passages for causing circulation of a fluid that cools the UV-ray light emitting diode are opened in the heatsink. Supply ports and discharge ports are opened in a mount surface of a header where supply and discharge of the fluid for cooling purpose to and from the heatsink are performed. A pair of circulation orifices corresponding to the supply port and the discharge port are opened in the contact surface that contacts the mount surface in the heatsink. Recesses are formed around the respective circulation orifices, and an annular sealing member that exhibits rubber elasticity and that is compressed between the heatsink and the header is disposed in each of the recesses.

Abstract: There are provided a printing method for a printing press that includes: printing an image on a sheet of paper fed using an ultraviolet curable paint; and irradiating the ultraviolet curable paint on the printed sheet fed by selectively causing a plurality of light emitting diodes disposed at predetermined intervals across a lateral direction of the sheet to turn on in accordance with the location and size of a predetermined area of the sheet, thereby irradiating the predetermined area with ultraviolet light therefrom and curing the predetermined area.

Abstract: A package has a base substrate that is a metal plate electrically connected to one electrode of a UV-ray light emitting diode and a cover substrate that is a metal plate electrically connected to the other electrode and that is stacked on the base substrate. A plurality of packages are mounted on a header such that center lines of the base substrates extending in their widthwise directions are aligned to each other. The cover substrates are arranged asymmetrical with respect to the longitudinal center line of the base substrates so as to traverse the center line. When mounted on the header, the packages are arranged such that positions of the cover substrates are staggered with respect to the center line. Moreover, the base substrate of one of the adjacent packages and the cover substrate of the other adjacent package are connected together by a connection plate fastened to the base substrates and the cover substrate by connection screws.

Abstract: There are provided a printing method for a printing press that includes: printing an image on a sheet of paper fed using an ultraviolet curable paint; and irradiating the ultraviolet curable paint on the printed sheet fed by selectively causing a plurality of light emitting diodes disposed at predetermined intervals across a lateral direction of the sheet to turn on in accordance with the location and size of a predetermined area of the sheet, thereby irradiating the predetermined area with ultraviolet light therefrom and curing the predetermined area.

Abstract: A package has a base substrate that is a metal plate electrically connected to one electrode of a UV-ray light emitting diode and a cover substrate that is a metal plate electrically connected to the other electrode and that is stacked on the base substrate. A plurality of packages are mounted on a header such that center lines of the base substrates extending in their widthwise directions are aligned to each other. The cover substrates are arranged asymmetrical with respect to the longitudinal center line of the base substrates so as to traverse the center line. When mounted on the header, the packages are arranged such that positions of the cover substrates are staggered with respect to the center line. Moreover, the base substrate of one of the adjacent packages and the cover substrate of the other adjacent package are connected together by a connection plate fastened to the base substrates and the cover substrate by connection screws.

Abstract: A heatsink carries a UV-ray light emitting diode. Flow passages for causing circulation of a fluid that cools the UV-ray light emitting diode are opened in the heatsink. Supply ports and discharge ports are opened in a mount surface of a header where supply and discharge of the fluid for cooling purpose to and from the heatsink are performed. A pair of circulation orifices corresponding to the supply port and the discharge port are opened in the contact surface that contacts the mount surface in the heatsink. Recesses are formed around the respective circulation orifices, and an annular sealing member that exhibits rubber elasticity and that is compressed between the heatsink and the header is disposed in each of the recesses.