Abstract: An object processing apparatus comprising a chamber that has an internal space able to be depressurized and is configured such that a target object is subjected to a plasma treatment in the internal space; a first electrode that is disposed in the chamber and on which the target object is to be mounted; a first power supply that applies a bias voltage of negative potential to the first electrode; a gas introduction device that introduces a processing gas into an inside of the chamber; and a pumping device that depressurizes the inside of the chamber. A cover is provided between the first electrode and the target object so as to cover the first electrode. A spacer is located between the first electrode and the cover, and is disposed so as to occupy a localized region.

Abstract: A plasma processing apparatus of the invention includes: a chamber that has an internal space able to be depressurized and is configured such that a processing object is subjected to plasma treatment in the internal space; a first electrode that is disposed in the chamber and on which the processing object is to be mounted; a first power supply that applies a bias voltage of negative potential to the first electrode; a spiral shaped second electrode that is disposed outside the chamber and is disposed so as to face the first electrode with an upper lid of the chamber interposed therebetween; a second electrode that applies a high-frequency voltage to the second electrode. A plate having a shape forming a space and a cover provided to cover the plate are stacked in order and disposed between the first electrode and the processing object.

Abstract: Provided is a thin film production apparatus that enables cost reduction and improvement of deposition efficiency by employing a common component. In a thin film production apparatus according to the present invention, a volume of a reaction space is optimized by determining the volume of the reaction space with an inner block disposed inside a vacuum tank, that is, by merely altering a size of an inner diameter of the inner block without altering a size of the vacuum tank. Accordingly, film formation on plural kinds of substrates having different sizes becomes possible using the common vacuum tank. Further, increase of the number of apparatus structural components to be prepared for each size of the substrate to be processed can be minimized, whereby the cost of the components can be reduced, and, while simplifying assembling operation, product inspection operation, and adjusting operation, excellent deposition efficiency and stable film formation can be realized.

Abstract: In a purge gas assembly provided: in an outer circumference portion of a substrate stage, with a shoulder portion offset downward below a substrate mounting surface on an upper end of the substrate stage; a purge ring enclosing a stepped circumferential surface between the substrate mounting surface and the shoulder portion; and an annular gas ejection passage for ejecting the purge gas, the gas ejecting passage being defined between the stepped circumferential surface and an inner circumferential surface of the purge ring, an arrangement is made such that the purge gas can be ejected uniformly from the gas ejection passage over the entire circumference thereof and that the deposition of a film on an upper surface of the purge ring can also be restricted, and further that the construction is simplified. The purge ring has formed therein an annular groove which recesses from a lower surface thereof upward.

Abstract: In a purge gas assembly provided: in an outer circumference portion of a substrate stage, with a shoulder portion offset downward below a substrate mounting surface on an upper end of the substrate stage; a purge ring enclosing a stepped circumferential surface between the substrate mounting surface and the shoulder portion; and an annular gas ejection passage for ejecting the purge gas, the gas ejecting passage being defined between the stepped circumferential surface and an inner circumferential surface of the purge ring, an arrangement is made such that the purge gas can be ejected uniformly from the gas ejection passage over the entire circumference thereof and that the deposition of a film on an upper surface of the purge ring can also be restricted, and further that the construction is simplified. The purge ring has formed therein an annular groove which recesses from a lower surface thereof upward.

Abstract: Provided is a thin film production apparatus that enables cost reduction and improvement of deposition efficiency by employing a common component. In a thin film production apparatus according to the present invention, a volume of a reaction space is optimized by determining the volume of the reaction space with an inner block disposed inside a vacuum tank, that is, by merely altering a size of an inner diameter of the inner block without altering a size of the vacuum tank. Accordingly, film formation on plural kinds of substrates having different sizes becomes possible using the common vacuum tank. Further, increase of the number of apparatus structural components to be prepared for each size of the substrate to be processed can be minimized, whereby the cost of the components can be reduced, and, while simplifying assembling operation, product inspection operation, and adjusting operation, excellent deposition efficiency and stable film formation can be realized.

Abstract: A diaphragm-type double-acting process pump has a reduced number of members to be assembled to a center plate and also a reduced number of hermetically sealed portions. A space defined by the center plate, together with a side cover and a side body, which are provided on both sides, respectively, of the center plate, is divided by two diaphragms into left and right driving chambers inside the diaphragms and left and right pump chambers outside the diaphragms. The left and right pump chambers are communicated with a suction opening through check valves and also communicated with a discharge opening through check valves. The center plate is fitted in a recess formed in the side body, and the side cover is brought into contact with both the side body and the center plate to clamp the center plate by the side cover and the side body.