Patents by Inventor Tsuyoshi KAMIMURA

Tsuyoshi KAMIMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP MATERIAL, AND SEMICONDUCTOR DEVICE
    Publication number: 20240368374
    Abstract: [Problem to be solved] To provide an epoxy resin composition that is excellent in injectability and thermal conductivity of the cured product and can also be used for manufacturing a semiconductor device having high operation reliability. [Solution] An epoxy resin composition including an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D), in which the filler (D) contains an aluminum nitride filler (D-1), the aluminum nitride filler (D-1) has an average particle size of 10.0 ?m or less, the aluminum nitride filler (D-1) has a uranium content of 20 ppb or less, and a blending ratio of the aluminum nitride filler (D-1) to a total amount of the filler (D) is 70% by mass or more.
    Type: Application
    Filed: August 5, 2022
    Publication date: November 7, 2024
    Inventors: Makoto SUZUKI, Yosuke SAKAI, Tsuyoshi KAMIMURA
  • Liquid resin composition for sealing and electronic component apparatus
    Patent number: 12131970
    Abstract: A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: October 29, 2024
    Assignees: Resonac Corporation, Namics Corporation
    Inventors: Hidetoshi Inoue, Takayuki Matsuzaki, Hisato Takahashi, Tsuyoshi Kamimura, Haruyuki Yoshii
  • LIQUID COMPRESSION MOLDING MATERIAL
    Publication number: 20230203236
    Abstract: A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.
    Type: Application
    Filed: April 20, 2021
    Publication date: June 29, 2023
    Applicant: NAMICS CORPORATION
    Inventors: Makoto SUZUKI, Tsuyoshi KAMIMURA, Yosuke SAKAI
  • LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPARATUS
    Publication number: 20200194325
    Abstract: A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.
    Type: Application
    Filed: May 31, 2018
    Publication date: June 18, 2020
    Inventors: Hidetoshi INOUE, Takayuki MATSUZAKI, Hisato TAKAHASHI, Tsuyoshi KAMIMURA, Haruyuki YOSHII
  • LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT APPARATUS
    Publication number: 20200181392
    Abstract: A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).
    Type: Application
    Filed: May 31, 2018
    Publication date: June 11, 2020
    Inventors: Hidetoshi INOUE, Takayuki MATSUZAKI, Hisato TAKAHASHI, Tsuyoshi KAMIMURA, Haruyuki YOSHII