Abstract: To provide an epoxy resin composition capable of suppressing small pores generated when a surface of a cured product is polished, an electronic component using the epoxy resin composition, a semiconductor device using the epoxy resin composition, and a method for manufacturing the semiconductor device. The epoxy resin composition includes an epoxy resin, a curing accelerator, a filler, and an elastomer. The elastomer is at least one selected from a solid elastomer and a liquid elastomer, and the solid elastomer has a structure having no double bond in the main chain.

Abstract: A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.

Abstract: A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).

Abstract: Provided is a liquid compression molding material including an epoxy resin composition containing an epoxy resin (A), a curing accelerator (B), a filler (C), and an elastomer (D), in which blending ratio of the filler (C) to the epoxy resin composition is 73.0 mass % or more, and blending ratio of the elastomer (D) to a total of components excluding the filler (C) from the epoxy resin composition is 7.0 mass % or more.

Abstract: An object of the present invention is to provide a liquid epoxy resin composition suitable for use as a mold underfill material for TSV, which composition may provide an electronic component having high wiring density, satisfactorily releasing heat generated during its driving and having high reliability. The liquid epoxy resin composition of the present invention comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C) consisting of a silica filler and an alumina filler and carbon black (D); the epoxy resin (A) comprises a specific aliphatic epoxy resin, the alumina filler has a specific particle size distribution, and the liquid epoxy resin composition gives a cured product having a thermal conductivity within a predetermined range. The liquid epoxy resin composition of the present invention gives a cured product having high thermal conductivity.

Abstract: [Problem to be solved] To provide an epoxy resin composition that is excellent in injectability and thermal conductivity of the cured product and can also be used for manufacturing a semiconductor device having high operation reliability. [Solution] An epoxy resin composition including an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D), in which the filler (D) contains an aluminum nitride filler (D-1), the aluminum nitride filler (D-1) has an average particle size of 10.0 ?m or less, the aluminum nitride filler (D-1) has a uranium content of 20 ppb or less, and a blending ratio of the aluminum nitride filler (D-1) to a total amount of the filler (D) is 70% by mass or more.

Abstract: A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

Abstract: A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.

Abstract: A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

Abstract: A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).