Patents by Inventor Tsuyoshi Kitagawa

Tsuyoshi Kitagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040074670
    Abstract: The present invention provides a connection structure between a printed circuit board and a flexible circuit board that enables the number of assembly steps including steps using soldering to be reduced and enables detachment of the flexible circuit board to be prevented. Printed-side conductive patterns formed on a printed circuit board is connected with flexible-side conductive patterns formed on a flexible circuit board. The connection structure comprises: two printed-side openings provided in the printed-side conductive patterns of the printed circuit board; two flexible-side openings provided in the flexible circuit board to align with the printed-side openings when the flexible-side conductive patterns are brought into contact with the printed-side conductive patterns; a frame having two leg parts that are inserted through the both openings; and an elastic pressing member interposed between the frame and the flexible circuit board.
    Type: Application
    Filed: October 7, 2003
    Publication date: April 22, 2004
    Applicant: HOSIDEN CORPORATION
    Inventor: Tsuyoshi Kitagawa
  • Publication number: 20040040826
    Abstract: To obtain a comfortable feeling of click at the time of depression operation and to provide a depression switch and a multidirectional input device with excellent operability.
    Type: Application
    Filed: August 20, 2003
    Publication date: March 4, 2004
    Applicant: HOSIDEN CORPORATION
    Inventor: Tsuyoshi Kitagawa
  • Publication number: 20020189832
    Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.
    Type: Application
    Filed: July 11, 2002
    Publication date: December 19, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Toshiyuki Baba, Toshio Nishimura, Tsuyoshi Kitagawa, Jiro Inoue, Shoichi Kawabata
  • Patent number: 6489558
    Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: December 3, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshiyuki Baba, Toshio Nishimura, Tsuyoshi Kitagawa, Jiro Inoue, Shoichi Kawabata
  • Publication number: 20020174997
    Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.
    Type: Application
    Filed: July 11, 2002
    Publication date: November 28, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Toshiyuki Baba, Toshio Nishimura, Tsuyoshi Kitagawa, Jiro Inoue, Shoichi Kawabata
  • Publication number: 20020060085
    Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.
    Type: Application
    Filed: August 8, 2001
    Publication date: May 23, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Toshiyuki Baba, Toshio Nishimura, Tsuyoshi Kitagawa, Jiro Inoue, Shoichi Kawabata
  • Patent number: 6130708
    Abstract: A waveform monitor receives HDTV and SDTV signals that are provided to a channel and an external trigger terminal respectively. An HDTV signal processor 14 produces a reference clock PCLK from the HDTV signal. A counter starts counting at the vertical sync signal of the SDTV signal and generates a trigger every time the count of the reference clock PCLK reaches a predetermined number (2,200, for example). This allows generation of a trigger signal which is phase locked to the vertical sync signal of the SDTV signal, and of which the frequency is the same as the horizontal line frequency of the HDTV signal. Therefore the waveform monitor can display the HDTV waveform line by line even though the HDTV and SDTV signals have different numbers of lines per field. The waveform monitor can be used to measure phase difference between television signals of difference formats, such as the HDTV and the SDTV.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: October 10, 2000
    Assignee: Sony/Tektronix Corporation
    Inventors: Tsuyoshi Kitagawa, Norihiko Sato