Patents by Inventor Tsuyoshi Kobayashi

Tsuyoshi Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring substrate and manufacturing method thereof, and semiconductor apparatus
    Patent number: 8115300
    Abstract: In a semiconductor apparatus, a semiconductor element is mounted on a wiring substrate. Wiring patterns and protrusions are formed on a surface of a substrate with the wiring patterns extending on tops of the protrusions. The surface of the substrate on which the wiring patterns are formed are covered with an insulating layer. Surfaces of connection parts of the wiring patterns formed on the tops of the protrusions are formed with the surfaces of the connection parts exposed to a surface of the insulating layer on a level with the surface of the insulating layer or in a position lower than the surface of the insulating layer. The connection parts are formed as pads for connection formed in alignment with connection electrodes of the semiconductor element. The semiconductor element is mounted by making electrical connection to the connection parts by flip chip bonding.
    Type: Grant
    Filed: June 14, 2007
    Date of Patent: February 14, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Shigetsugu Muramatsu, Tsuyoshi Kobayashi, Takashi Kurihara
  • Vehicle display device
    Patent number: 8108084
    Abstract: The present invention provides a vehicle display device which allows a driver to instantaneously grasp driving force information. A meter_ECU displays a driving force display image which displays driving force information of a vehicle on an MID, displays an acceleration-torque line (driving force characteristic line) L corresponding to the currently selected mode M and, at the same time, changes a power level which is indicated in a power display region P set within the acceleration-torque line L interlockingly with an accelerator operation of a driver. Due to such a constitution, the vehicle display device allows the driver to instantaneously grasp the driving force information.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: January 31, 2012
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventors: Toshio Masuda, Kenichi Yamamoto, Kenji Hijikata, Satoshi Satomura, Hiroshi Oishi, Toyohide Sunaguchi, Yoshio Iwakami, Munenori Homma, Atsushi Atake, Kouji Kaneda, Tatsuru Fukuda, Minoru Yuki, Masayuki Ushiki, Tsuyoshi Kobayashi, Masahito Motoi, Naoki Shibata, Hiroshi Ogiwara, Katsumasa Igarashi, Junzo Shinozuka, Akihisa Nakamura
  • Method of manufacturing a multilayer wiring board
    Patent number: 8096049
    Abstract: First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer boards are prepared and stacked up. On that case, the board disposed in the uppermost layer is prepared without having a metal bump. The boards are positioned and stacked up in such a manner that a metal bump of one of adjacent boards is connected to a corresponding wiring layer of the other board. Thereafter, resin is filled into gaps between the stacked boards, and insulating layers are formed on both sides of a multilayer board obtained through the above steps, in such a manner as to cover the entire surface except pad areas defined at predetermined positions on the wiring layers.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: January 17, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Tetsuya Koyama, Tsuyoshi Kobayashi, Hiroyuki Kato, Yoshihiro Machida
  • Reinforcing bar binding machine
    Patent number: 8051880
    Abstract: A reinforcing bar binding machine is provided with: a main sleeve having a tip end on which a hook is pivotally mounted; a tip end shaft fitted in an inside of the main sleeve; a spiral screw groove formed on the tip end shaft; a fitting opening that penetrates from an outside to the inside of the main sleeve; a key fitted in the fitting opening and brought in mash engagement with the screw groove; a short sleeve provided on an outer periphery of the main sleeve and covering the key; and an engaging means formed on the short sleeve and controlling a rotation of the main sleeve.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: November 8, 2011
    Assignee: Max Co., Ltd.
    Inventors: Takahiro Nagaoka, Tsuyoshi Kobayashi
  • Flavor improving agent, and food and drink containing the same
    Patent number: 8053467
    Abstract: The present invention provides a novel flavor improving agent capable of sufficiently enhancing or alleviating the flavor sensed in oral cavity; for example, enhancing and improving the thickness in taste or the like to provide depth and profoundness to the flavor, and also improving the sense of volume or the sharpness of aftertaste. The present invention also provides a food/drink, a pharmaceutical product and an oral care product having a good taste which can fulfill the recent high-level demand for taste.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: November 8, 2011
    Assignee: Takasago International Corporation
    Inventors: Ikuo Terada, Toshihiro Takeda, Tsuyoshi Kobayashi, Tadahiro Hiramoto
  • CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
    Publication number: 20110256662
    Abstract: A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.
    Type: Application
    Filed: June 23, 2011
    Publication date: October 20, 2011
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takaharu YAMANO, Hajime IIZUKA, Hideaki SAKAGUCHI, Toshio KOBAYASHI, Tadashi ARAI, Tsuyoshi KOBAYASHI, Tetsuya KOYAMA, Kiyoaki IIDA, Tomoaki MASHIMA, Koichi TANAKA, Yuji KUNIMOTO, Takashi YANAGISAWA
  • GAS COMBUSTION TYPE FASTENER DRIVING MACHINE
    Publication number: 20110240708
    Abstract: In a gas combustion type fastener driving machine, a fuel gas and air are stirred by a fan within a combustion chamber, a stirred air-fuel gas mixture is burned by an ignition spark, and a striking piston is actuated by a combustion pressure to drive a fastening member. The machine is provided with a fan motor (320) for rotating the fan, and a control circuit board (100) for controlling an action of the fan motor (320). The control circuit board (100) detects an actuation signal for an igniter (310) that generates the ignition spark and controls a rotation speed of the fan motor (320) based on the actuation signal.
    Type: Application
    Filed: March 23, 2011
    Publication date: October 6, 2011
    Applicant: MAX CO., LTD.
    Inventor: Tsuyoshi KOBAYASHI
  • Chip embedded substrate and method of producing the same
    Patent number: 7989707
    Abstract: A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.
    Type: Grant
    Filed: December 12, 2006
    Date of Patent: August 2, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi, Tetsuya Koyama, Kiyoaki Iida, Tomoaki Mashima, Koichi Tanaka, Yuji Kunimoto, Takashi Yanagisawa
  • INFORMATION STORAGE MEDIUM, GAME SYSTEM, AND DISPLAY IMAGE GENERATION METHOD
    Publication number: 20110181703
    Abstract: A game system acquires an input image from an input section that applies light to a body and receives reflected light from the body. The game system controls the size of an object in a virtual space based on a distance between the input section and the body, the distance being determined based on the input image. The game system generates a display image including the object.
    Type: Application
    Filed: January 25, 2011
    Publication date: July 28, 2011
    Applicant: NAMCO BANDAI GAMES INC.
    Inventors: Tsuyoshi KOBAYASHI, Kohtaro TANIGUCHI, Yasuhiro NISHIMOTO
  • INFORMATION STORAGE MEDIUM, GAME SYSTEM, AND INPUT DETERMINATION METHOD
    Publication number: 20110183765
    Abstract: A game system determines whether or not an input start timing coincides with an auxiliary start timing that corresponds to a reference start timing and differs from the reference start timing, and determines whether or not input information that has been input during a given auxiliary determination period that starts from the auxiliary start timing coincides with defined input information.
    Type: Application
    Filed: January 25, 2011
    Publication date: July 28, 2011
    Applicant: NAMCO BANDAI GAMES INC.
    Inventors: Tsuyoshi KOBAYASHI, Kohtaro TANIGUCHI, Yasuhiro NISHIMOTO
  • OPERATING METHOD OF REINFORCING BAR BINDING MACHINE
    Publication number: 20110146833
    Abstract: An operation method of a reinforcing bar binding machine includes an initializing operation. During the initializing operation, a cutter of a wire cutting mechanism shuts off a wire passageway, a wire is fed by a wire feed mechanism while the wire passageway remains shut off, and the wire feed mechanism is stopped when a leading end of the wire butts against the cutter.
    Type: Application
    Filed: November 24, 2010
    Publication date: June 23, 2011
    Applicant: MAX CO., LTD.
    Inventors: Ichiro Kusakari, Takahiro Nagaoka, Tsuyoshi Kobayashi, Akira Kasahara
  • Method of manufacturing a multilayer wiring board
    Publication number: 20110099806
    Abstract: First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer boards are prepared and stacked up. On that case, the board disposed in the uppermost layer is prepared without having a metal bump. The boards are positioned and stacked up in such a manner that a metal bump of one of adjacent boards is connected to a corresponding wiring layer of the other board. Thereafter, resin is filled into gaps between the stacked boards, and insulating layers are formed on both sides of a multilayer board obtained through the above steps, in such a manner as to cover the entire surface except pad areas defined at predetermined positions on the wiring layers.
    Type: Application
    Filed: December 30, 2010
    Publication date: May 5, 2011
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Tetsuya Koyama, Tsuyoshi Kobayashi, Hiroyuki Kato, Yoshihiro Machida
  • CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110095419
    Abstract: There is provided a conductive film. The conductive film includes: an anodized layer having a plurality of through holes extending therethrough in its thickness direction; a plurality of linear conductors each formed in a corresponding one of the through holes and each having first and second protrusions protruding from the anodized layer, wherein at least one of the first and second protrusions is covered by a coating material; and an uncured thermosetting resin layer formed on the anodized layer to cover at least one of the first and second protrusions.
    Type: Application
    Filed: October 21, 2010
    Publication date: April 28, 2011
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda, Tsuyoshi Kobayashi, Tatsuaki Denda
  • CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110095433
    Abstract: There is provided a method of manufacturing a conductive film. The method includes: (a) providing an anodized layer having a plurality of through holes extending therethrough in its thickness direction; (b) forming a plurality of linear conductors by filling each of the through holes with a conductive material; (c) forming protection layers on both surfaces of the anodized layer; (d) removing the anodized layer to form a plurality of gaps between the linear conductors; (e) forming an organic insulation layer between the protection layers to fill the gaps with the organic insulation layer; and (f) removing the protection layers.
    Type: Application
    Filed: October 21, 2010
    Publication date: April 28, 2011
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Michio HORIUCHI, Yasue TOKUTAKE, Yuichi MATSUDA, Tsuyoshi KOBAYASHI, Tatsuaki DENDA
  • Process for producing membrane electrode assembly, and fuel cell using the membrane electrode assembly produced by the process
    Patent number: 7931935
    Abstract: This invention provides a process for producing a membrane electrode assembly which has high and stable catalytic activity, and suppressed deterioration in catalytic activity during operation, and can prevent a deterioration in performance attributable to a structural factor of the membrane electrode assembly. The process comprises the step of, after the washing/removing step, drying the catalyst electrode in an atmosphere having a lower oxygen partial pressure than the air. The anode/cathode is a covered catalyst electrode having a structure formed by supporting/depositing a catalytically active material composed mainly of platinum/ruthenium subjected to the potential holding step, the washing/removing step, and the drying step, on a porous electroconductive carrier to cover at least a part of the porous electroconductive carrier with the ion conductive material.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: April 26, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masaaki Yamamoto, Wu Mei, Tsuyoshi Kobayashi, Taishi Fukazawa, Itsuko Mizutani, Yoshihiko Nakano
  • Inductor and Manufacturing Method Thereof
    Publication number: 20110080247
    Abstract: An inductor includes a core substrate including minute column-like electrical conductors extending between a front surface and a back surface of the core substrate. Each column-like electrical conductor is insulated from adjacent column-like electrical conductors by being surrounded by an insulating material. Insulation layers are formed on the front surface and the back surface of the core substrate, respectively. At least two connection electrical conductors extend through each of the insulation layers. Each connection electrical conductor is electrically connected to a plurality of the column-like electrical conductors. Wirings are formed on each of the insulation layers to connect said connection electrical conductors to each other electrically. The wirings, the connection electrical conductors and the column-like electrical conductors are connected to form a coil in a three-dimensional manner.
    Type: Application
    Filed: October 1, 2010
    Publication date: April 7, 2011
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Michio HORIUCHI, Yukio Shimizu, Kazunari Sekigawa, Tsuyoshi Kobayashi
  • Method of manufacturing a multilayer wiring board
    Patent number: 7882627
    Abstract: First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer boards are prepared and stacked up. On that case, the board disposed in the uppermost layer is prepared without having a metal bump. The boards are positioned and stacked up in such a manner that a metal bump of one of adjacent boards is connected to a corresponding wiring layer of the other board. Thereafter, resin is filled into gaps between the stacked boards, and insulating layers are formed on both sides of a multilayer board obtained through the above steps, in such a manner as to cover the entire surface except pad areas defined at predetermined positions on the wiring layers.
    Type: Grant
    Filed: January 4, 2008
    Date of Patent: February 8, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Tetsuya Koyama, Tsuyoshi Kobayashi, Hiroyuki Kato, Yoshihiro Machida
  • Methanol oxidation catalyst
    Patent number: 7846862
    Abstract: A methanol oxidation catalyst is provided, which includes nanoparticles having a composition represented by the following formula 1: PtxRuyTzQu ??formula 1 In the formula 1, the T-element is at least one selected from a group consisting of Mo, W and V and the Q-element is at least one selected from a group consisting of Nb, Cr, Zr and Ti, x is 40 to 90 at. %, y is 0 to 9.9 at. %, z is 3 to 70 at. % and u is 0.5 to 40 at. %. The area of the peak derived from oxygen bond of T-element is 80% or less of the area of the peak derived from metal bond of T-element in a spectrum measured by an X-ray photoelectron spectral method.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: December 7, 2010
    Assignees: Kabushiki Kaisha Toshiba, Intematix Corporation
    Inventors: Wu Mei, Taishi Fukazawa, Itsuko Mizutani, Tsuyoshi Kobayashi, Yoshihiko Nakano, Mina Farag, Yi-Qun Li, Shinji Aoki
  • Semiconductor package and manufacturing method thereof
    Patent number: 7847384
    Abstract: A semiconductor package 100 is constructed of a semiconductor chip 110, a sealing resin 106 for sealing this semiconductor chip 110, and wiring 105 formed inside the sealing resin 106. And, the wiring 105 is constructed of pattern wiring 105b connected to the semiconductor chip 110 and also formed so as to be exposed to a lower surface 106b of the sealing resin 106, and a post part 105a formed so as to extend in a thickness direction of the sealing resin 106, the post part in which one end is connected to the pattern wiring 105b and also the other end is formed so as to be exposed to an upper surface 106a of the sealing resin 106.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: December 7, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Tsuyoshi Kobayashi, Tetsuya Koyama, Takaharu Yamano
  • ELECTRONIC COMPONENT MOUNTED STRUCTURE
    Publication number: 20100294552
    Abstract: An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board.
    Type: Application
    Filed: May 11, 2010
    Publication date: November 25, 2010
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD
    Inventors: Tsuyoshi KOBAYASHI, Michio Horiuchi, Yukio Shimizu, Yasue Tokutake