Abstract: According to one embodiment, an array antenna apparatus includes a distributor, transmission phase shifters, transmission amplifiers, transmission filters, transmission/reception switches, limiters, reception filters, low-noise amplifiers, reception phase shifters, a combiner, a vacuum vessel, a refrigerating unit, and a cooling plate.

Abstract: According to one embodiment, an antenna apparatus includes an antenna, a duplexer, a reception circuit, a phase controller, a combining unit, a thermally insulating container and a cooling unit. A reception circuit configured to separate a frequency of a signal received by the antenna into a plurality of reception pathways via BPFs (Band Pass Filters) corresponding to the number of transmittable frequencies, extract the reception signals, amplify with low noise the extracted reception signals by an LNA (Low Noise Filter) for the separated reception pathways, select a reception pathway corresponding to the transmission frequency from the separated reception pathways, and output the reception signal amplified with low noise to the selected reception pathway.

Abstract: The swinging operation of a rotary striker turns micro switches and, which detect the position of a piston, ON/OFF. The striker includes a lower-limit switch cam and an upper-limit switch cam. The cams and engage with switch bosses and that move together with the piston. When the piston is positioned at a lower-limit stop position L, the cam becomes engaged with the boss to make the striker swing in the X-direction and pushes a switch button of the switch. When the piston is positioned at an upper-limit stop position U, the cam becomes engaged with the boss to make the striker swing in the Y-direction and pushes a switch button of the switch.

Abstract: A multilayer high-frequency circuit board includes a signal line, ground layers, and an interlayer circuit. A signal line where a high-frequency signal flows is formed in the signal line layer. The ground layers are laminated on both sides of the signal line layer, each of which is grounded. The interlayer circuit is provided in the signal line layer and includes a ground connecting portion connected to the ground layers and a signal line connecting portion connected to the signal line. One of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other of the signal line connecting portion and the ground connecting portion concentrically with the one being separated from the outer periphery of the other along the signal line layer. An inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.

Abstract: The swinging operation of a rotary striker 14 turns micro switches 11 and 12, which detect the position of a piston 9, ON/OFF. The striker 14 includes a lower-limit switch cam 15 and an upper-limit switch cam 16. The cams 15 and 16 engage with switch bosses 36 and 37 that move together with the piston 9. When the piston 9 is positioned at a lower-limit stop position L, the cam 15 becomes engaged with the boss 36 to make the striker 14 swing in the X-direction and pushes a switch button 11a of the switch 11. When the piston 9 is positioned at an upper-limit stop position U, the cam 16 becomes engaged with the boss 37 to make the striker 14 swing in the Y-direction and pushes a switch button 12a of the switch 12.

Abstract: A multilayer high-frequency circuit board includes a signal line, ground layers, and an interlayer circuit. A signal line where a high-frequency signal flows is formed in the signal line layer. The ground layers are laminated on both sides of the signal line layer, each of which is grounded. The interlayer circuit is provided in the signal line layer and includes a ground connecting portion connected to the ground layers and a signal line connecting portion connected to the signal line. One of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other of the signal line connecting portion and the ground connecting portion concentrically with the one being separated from the outer periphery of the other along the signal line layer. An inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.

Abstract: A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circuit disposed in one of the most outside earth conductor layers of the multilayer board; a first power-supply/control circuit disposed in this most outside earth conductor layer; a second high frequency circuit disposed in at least one of the dielectric layers and connected to the first high frequency circuit in the multilayer board; a second power-supply/control circuit disposed in another one of the most outside earth conductor layers of the multilayer board; and a third power-supply/control circuit disposed in at least one of the dielectric layers at a portion at which the second high frequency circuit does not exist, the third power-supply/control circuit being connected to the first and second power-supply/control circuits.

Abstract: A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circuit disposed in one of the most outside earth conductor layers of the multilayer board; a first power-supply/control circuit disposed in this most outside earth conductor layer; a second high frequency circuit disposed in at least one of the dielectric layers and connected to the first high frequency circuit in the multilayer board; a second power-supply/control circuit disposed in another one of the most outside earth conductor layers of the multilayer board; and a third power-supply/control circuit disposed in at least one of the dielectric layers at a portion at which the second high frequency circuit does not exist, the third power-supply/control circuit being connected to the first and second power-supply/control circuits.