Patents by Inventor Tsuyoshi Makita

Tsuyoshi Makita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190338506
    Abstract: The fixing metal fitting including: a joint base in groove shape mainly composing a joint metal; a cover spacer in groove shape capable of supporting the pillar's axial load by covering the joint base, wherein joint base including: a plane section in rectangular shape coinciding with an end surface of the pillar; a pair of groove walls bent vertically in L shape; and a joining plate standing from the plane section and supported by welded part J contacting at least the pair of groove walls or groove bottom, wherein the cover spacer including: a plane section in rectangular shape for supporting pillar by abutting to the pillar's end surface; a pair of groove walls composed of side edges of plane section respectively bent vertically in L shape; and a slit drilled such that the joining plate will be fitted into slit when the cover spacer is covering the joint base.
    Type: Application
    Filed: January 10, 2018
    Publication date: November 7, 2019
    Applicants: IIDA SANGYO CO., LTD., BX KANESHIN CO., LTD.
    Inventors: Kazuhiko MORI, Moriyasu NAGAYOSHI, Naoki TAKAHASHI, Tsuyoshi MAKITA, Takahiro YAMAGUCHI
  • Publication number: 20120068275
    Abstract: A method for fabricating a semiconductor device includes forming a high-dielectric constant insulating film including a high-dielectric constant film; forming a first conductive film including an oxide film on an upper surface thereof and containing at least one of high melting point metal or a compound thereof; forming a second conductive film containing silicon on the first conductive film with the oxide film being interposed therebetween; forming a mixing layer by performing ion implantation to the first and second conductive films to mix a constituent material of the oxide film and silicon of the second conductive film together; and forming the mixing layer into a conductive layer by performing heat treatment.
    Type: Application
    Filed: November 28, 2011
    Publication date: March 22, 2012
    Applicant: PANASONIC CORPORATION
    Inventor: Tsuyoshi MAKITA
  • Publication number: 20110057268
    Abstract: A semiconductor device includes a resistive element and a MISFET. The resistive element includes a first conductive film formed on the semiconductor substrate and containing a metal, a second conductive film formed on the first conductive film and containing silicon, and an insulating film formed between the first conductive film and the second conductive film.
    Type: Application
    Filed: August 10, 2010
    Publication date: March 10, 2011
    Inventor: Tsuyoshi MAKITA
  • Publication number: 20090176328
    Abstract: A semiconductor device is provided and includes a substrate, a photoelectric converting portion, a plurality of optical waveguide portions stacked above the photoelectric conversion portion, each of the plurality of optical waveguide portions including a translucent material and being shaped in a taper.
    Type: Application
    Filed: March 12, 2009
    Publication date: July 9, 2009
    Inventor: Tsuyoshi Makita
  • Patent number: 7522801
    Abstract: A semiconductor device is provided and includes a substrate, a photoelectric converting portion, a plurality of optical waveguide portions stacked above the photoelectric conversion portion, each of the plurality of optical waveguide portions including a translucent material and being shaped in a taper.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: April 21, 2009
    Assignee: Fujifilm Corporation
    Inventor: Tsuyoshi Makita
  • Publication number: 20070280587
    Abstract: A semiconductor device is provided and includes a substrate, a photoelectric converting portion, a plurality of optical waveguide portions stacked above the photoelectric conversion portion, each of the plurality of optical waveguide portions including a translucent material and being shaped in a taper.
    Type: Application
    Filed: April 12, 2007
    Publication date: December 6, 2007
    Inventor: Tsuyoshi Makita
  • Publication number: 20070243669
    Abstract: The present invention provides a method for manufacturing a solid-state image pickup element in which an intralayer lens is formed above a solid-state image pickup element by: a first step of forming a film using an intralayer lens forming material; a second step of reducing an aspect ratio which is obtained by dividing a depth of concave portion after undergoing the first step by a spacing between convex portions, by either performing etchback after coating the film with a resist or performing sputter etching; and a third step of forming a new film on the film with the reduced aspect ratio using the intralayer lens forming material.
    Type: Application
    Filed: April 18, 2007
    Publication date: October 18, 2007
    Applicant: FUJIFILM Corporation
    Inventors: Hisashi Suzuki, Hideyasu Hanaoka, Tsuyoshi Makita
  • Patent number: 4627990
    Abstract: A method of and an apparatus for supplying a powdery material to a workpiece to be processed thereby. According to the method, the powdery material is discharged from a hopper and metered, and then fed into a tube extending in the vicinity of the workpiece. Ultrasonic vibrations are imparted to the tube to supply the powdery material to a portion to be processed of the workpiece while the amount of the supplied powdery material is being detected. The apparatus includes a hopper for storing the powdery material, the hopper having an outlet, a tube extending from the outlet to a position adjacent to the workpiece for conveying the powdery material therethrough, and an ultrasonic vibrating device mounted on the tube for imparting ultrasonic vibrations to the tube, and a device mounted on the tube for detecting the amount of the powdery material supplied through the tube.
    Type: Grant
    Filed: March 6, 1985
    Date of Patent: December 9, 1986
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Toshihiko Saga, Tsuyoshi Makita, Hisao Hirono, Akitaka Inao